公开(公告)号：US20240334589A1

公开(公告)日：2024-10-03

申请号：US18742367

申请日：2024-06-13

Applicant: Cisco Technology, Inc.

Inventor： Rohit Dev Gupta ,  Arjun Jayaprakash Guzar ,  Tilak Gaitonde

IPC: H05K1/02

CPC classification number: H05K1/0203 ,  H05K2201/066 ,  H05K2201/10734

Abstract: Techniques are provided herein for dynamic pressure control of a heat sink. In one example embodiment, an apparatus includes a Ball Grid Array (BGA) device, a heat sink thermally coupled to the BGA device, and a pressure control assembly configured to dynamically control a pressure of the heat sink on the BGA device based on a temperature associated with the BGA device. The pressure control assembly includes a Shape Memory Alloy (SMA) washer configured to apply a first amount of the pressure when the SMA washer is in a first state, and a second amount of the pressure when the SMA washer is in a second state.

公开(公告)号：US12069794B2

公开(公告)日：2024-08-20

申请号：US17858819

申请日：2022-07-06

Applicant: Cisco Technology, Inc.

Inventor： Rohit Dev Gupta ,  Arjun Jayaprakash Guzar ,  Tilak Gaitonde

IPC: H05K1/02

CPC classification number: H05K1/0203 ,  H05K2201/066 ,  H05K2201/10734

Abstract: Techniques are provided herein for dynamic pressure control of a heat sink. In one example embodiment, an apparatus includes a Ball Grid Array (BGA) device, a heat sink thermally coupled to the BGA device, and a pressure control assembly configured to dynamically control a pressure of the heat sink on the BGA device based on a temperature associated with the BGA device. The pressure control assembly includes a Shape Memory Alloy (SMA) washer configured to apply a first amount of the pressure when the SMA washer is in a first state, and a second amount of the pressure when the SMA washer is in a second state.

公开(公告)号：US20240015880A1

公开(公告)日：2024-01-11

申请号：US17858819

申请日：2022-07-06

Applicant: Cisco Technology, Inc.

Inventor： Rohit Dev Gupta ,  Arjun Jayaprakash Guzar ,  Tilak Gaitonde

IPC: H05K1/02

CPC classification number: H05K1/0203 ,  H05K2201/10734 ,  H05K2201/066

Abstract: Techniques are provided herein for dynamic pressure control of a heat sink. In one example embodiment, an apparatus includes a Ball Grid Array (BGA) device, a heat sink thermally coupled to the BGA device, and a pressure control assembly configured to dynamically control a pressure of the heat sink on the BGA device based on a temperature associated with the BGA device. The pressure control assembly includes a Shape Memory Alloy (SMA) washer configured to apply a first amount of the pressure when the SMA washer is in a first state, and a second amount of the pressure when the SMA washer is in a second state.