Abstract:
Embodiments of the invention provide a manufacturing method of a TFT array substrate. The TFT array substrate is formed to comprise a plurality of scanning lines, a plurality of data lines and a plurality of pixel units defined by intersecting these scanning lines and these data lines with each other. Each of the pixel units comprises a TFT and a pixel electrode. The TFT is formed to comprise a gate electrode, a gate insulating layer, a metal oxide semiconductor layer used as an active layer, an etch stopping layer formed on a portion of the surface of the metal oxide semiconductor layer, a source electrode and a drain electrode. In this method, the metal oxide semiconductor layer, the source electrode and the drain electrode are formed by a same patterning process.
Abstract:
The invention provides a conductive graphene-metal composite material, which is a composite of monolayer graphene nanoflakes and metal or metal oxide. The monolayer graphene nanoflakes of the invention are made by exfoliating graphite, and have a good combination with metal material by adopting an ultrasonic treatment or a mechanical agitation treatment. The graphene is uniformly dispersed therein and forms a conductive network, which can improve the electrochemical activity efficiently and reduce the resistance against the transfer of the charges efficiently. Use of the graphene-metal composite electrode reduces the costs of processes and facilities, on the premise of good properties. It can be used to replace the ITO conductive layer of the liquid crystal display.
Abstract:
Embodiments of the invention provide a conductive structure, a thin film transistor, an array substrate, and a display device. The conductive structure comprises a copper layer formed of copper or copper alloy; a blocking layer for preventing copper ions of the copper layer from diffusing outward; and a diffusion prevention layer for preventing exterior ions from diffusing to the copper layer and disposed between the copper layer and the blocking layer. The multilayer conductive structure according to an embodiment of the invention can prevent exterior ions from diffusing into a copper layer and prevent copper ions from diffusing outward to reduce ions diffusion that adversely impacts the electricity performance and chemical corrosion resistance of the copper metal layer, and meanwhile can enhance adhesiveness of the conductive structure, which may be helpful for etching/patterning of the multilayer conductive structure.