公开(公告)号：US09521991B2

公开(公告)日：2016-12-20

申请号：US14208281

申请日：2014-03-13

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Nevada J. Sanchez

IPC: A61B8/14 ,  A61B8/00 ,  A61N7/00 ,  G01S15/02 ,  G01S15/89 ,  H04R1/00 ,  B81C1/00 ,  G01S7/52 ,  B06B1/02 ,  A61N7/02 ,  A61B8/08

CPC classification number: A61B8/4494 ,  A61B8/14 ,  A61B8/145 ,  A61B8/4483 ,  A61B8/4488 ,  A61B8/485 ,  A61B8/54 ,  A61N7/00 ,  A61N7/02 ,  B06B1/02 ,  B81C1/00246 ,  G01S7/52019 ,  G01S7/52034 ,  G01S7/52047 ,  G01S7/5208 ,  G01S15/02 ,  G01S15/8915 ,  G01S15/8977 ,  H04R1/00 ,  Y10T29/41

Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and a high-speed serial data module may be used to move data for all received channels off-chip as digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. Various novel waveform generation techniques, transducer configuration and biasing methodologies, etc., are likewise disclosed. HIFU methods may additionally or alternatively be employed as a component of the “ultrasound-on-a-chip” solution disclosed herein.

公开(公告)号：US20160264400A1

公开(公告)日：2016-09-15

申请号：US15158968

申请日：2016-05-19

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Nevada J. Sanchez

IPC: B81B3/00 ,  B06B1/02 ,  G10K9/12 ,  B81C1/00

CPC classification number: B06B1/0292 ,  B06B1/02 ,  B81B3/0021 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2207/015 ,  B81C1/00158 ,  B81C2201/013 ,  B81C2203/0118 ,  B81C2203/0735 ,  B81C2203/0771 ,  G10K9/12 ,  G10K11/18

Abstract: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.

Abstract translation: 描述了CMOS超声波传感器及其制造方法。 所述方法可以包括在第一晶片上形成空腔并将第一晶片接合到第二晶片。 可以处理第二晶片以形成用于空腔的膜。 可以提供对腔的电接入。

公开(公告)号：US20160242739A1

公开(公告)日：2016-08-25

申请号：US15143369

申请日：2016-04-29

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Nevada J. Sanchez

IPC: A61B8/00

CPC classification number: A61B8/4494 ,  A61B8/14 ,  A61B8/145 ,  A61B8/4483 ,  A61B8/4488 ,  A61B8/485 ,  A61B8/54 ,  A61N7/00 ,  A61N7/02 ,  B06B1/02 ,  B81C1/00246 ,  G01S7/52019 ,  G01S7/52034 ,  G01S7/52047 ,  G01S7/5208 ,  G01S15/02 ,  G01S15/8915 ,  G01S15/8977 ,  H04R1/00

Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and a high-speed serial data module may be used to move data for all received channels off-chip as digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. Various novel waveform generation techniques, transducer configuration and biasing methodologies, etc., are likewise disclosed. HIFU methods may additionally or alternatively be employed as a component of the “ultrasound-on-a-chip” solution disclosed herein.

公开(公告)号：US20160202349A1

公开(公告)日：2016-07-14

申请号：US15075942

申请日：2016-03-21

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Nevada J. Sanchez

IPC: G01S7/52 ,  A61N7/00 ,  A61B8/00

Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and a high-speed serial data module may be used to move data for all received channels off-chip as digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. Various novel waveform generation techniques, transducer configuration and biasing methodologies, etc., are likewise disclosed. HIFU methods may additionally or alternatively be employed as a component of the “ultrasound-on-a-chip” solution disclosed herein.

公开(公告)号：US09351706B2

公开(公告)日：2016-05-31

申请号：US14561504

申请日：2014-12-05

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Nevada J. Sanchez ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Gregory Corteville

IPC: A61B8/00 ,  A61B8/13 ,  A61B8/08 ,  G03B27/42 ,  G03B27/52 ,  B06B1/02 ,  G01S7/00 ,  A61B8/14 ,  A61N7/02 ,  G01S7/52 ,  G01S15/89 ,  A61N7/00

CPC classification number: A61B8/4444 ,  A61B8/13 ,  A61B8/14 ,  A61B8/4411 ,  A61B8/4477 ,  A61B8/4483 ,  A61B8/4488 ,  A61B8/4494 ,  A61B8/483 ,  A61B8/5207 ,  A61B8/54 ,  A61B8/56 ,  A61N7/02 ,  A61N2007/0078 ,  B06B1/0292 ,  G01S7/003 ,  G01S7/5208 ,  G01S7/52084 ,  G01S15/8915 ,  G03B27/423 ,  G03B27/52 ,  Y10T29/49005

Abstract: Ultrasound devices and methods are described, including a repeatable ultrasound transducer probe having ultrasonic transducers and corresponding circuitry. The repeatable ultrasound transducer probe may be used individually or coupled with other instances of the repeatable ultrasound transducer probe to create a desired ultrasound device. The ultrasound devices may optionally be connected to various types of external devices to provide additional processing and image rendering functionality.

Abstract translation: 描述了超声装置和方法，包括具有超声换能器和相应电路的可重复的超声换能器探头。 可重复的超声换能器探针可以单独使用或与可重复的超声换能器探头的其它实例相结合以产生所需的超声波装置。 超声设备可以可选地连接到各种类型的外部设备以提供额外的处理和图像呈现功能。

公开(公告)号：US09149255B2

公开(公告)日：2015-10-06

申请号：US14191627

申请日：2014-02-27

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Nevada J. Sanchez ,  Gregory L. Charvat ,  Tyler S. Ralston

IPC: A61B8/00 ,  A61B8/14 ,  A61B8/08 ,  A61B17/32 ,  A61B19/00 ,  A61N7/00 ,  A61N7/02

CPC classification number: G01S7/52017 ,  A61B5/015 ,  A61B8/08 ,  A61B8/13 ,  A61B8/4209 ,  A61B8/4245 ,  A61B8/4254 ,  A61B8/4263 ,  A61B8/4477 ,  A61B8/4488 ,  A61B8/4494 ,  A61B8/483 ,  A61B8/5207 ,  A61B8/56 ,  A61B8/565 ,  A61B17/320068 ,  A61B2090/378 ,  A61B2562/164 ,  A61N7/00 ,  A61N7/02 ,  A61N2007/0078 ,  G01S7/52019 ,  G01S7/52023

Abstract: Apparatus and methods are described that include ultrasound imaging devices, which may operate in a transmissive ultrasound imaging modality, and which may be used to detect properties of interest of a subject such as index of refraction, density and/or speed of sound. Devices suitable for performing high intensity focused ultrasound (HIFU), as well as HIFU and ultrasound imaging, are also described.

Abstract translation: 描述了包括超声成像装置的装置和方法，其可以在透射超声成像模式中操作，并且其可以用于检测对象的感兴趣的属性，例如折射率，密度和/或声速。 还描述了适用于执行高强度聚焦超声（HIFU）的设备，以及HIFU和超声成像。

公开(公告)号：US20150251896A1

公开(公告)日：2015-09-10

申请号：US14711145

申请日：2015-05-13

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Nevada J. Sanchez

IPC: B81B7/00

CPC classification number: B81C1/00301 ,  B06B1/02 ,  B06B1/0292 ,  B81B7/007 ,  B81C1/00134 ,  B81C1/00158 ,  B81C1/00246 ,  B81C2201/0195 ,  B81C2203/0735 ,  B81C2203/0771 ,  G01N29/2406 ,  H01L29/84 ,  H04R19/005

Abstract: Complementary metal oxide semiconductor (CMOS) ultrasonic transducers (CUTs) and methods for forming CUTs are described. The CUTs may include monolithically integrated ultrasonic transducers and integrated circuits for operating in connection with the transducers. The CUTs may be used in ultrasound devices such as ultrasound imaging devices and/or high intensity focused ultrasound (HIFU) devices.

Abstract translation: 描述了互补金属氧化物半导体（CMOS）超声波换能器（CUT）以及用于形成CUT的方法。 CUT可以包括用于与换能器连接的单体集成超声换能器和集成电路。 CUT可用于超声波装置，例如超声成像装置和/或高强度聚焦超声（HIFU）装置。

公开(公告)号：US09028412B2

公开(公告)日：2015-05-12

申请号：US14191553

申请日：2014-02-27

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Nevada J. Sanchez ,  Gregory L. Charvat ,  Tyler S. Ralston

IPC: A61B8/00 ,  A61B8/14 ,  A61N7/00 ,  A61B17/32 ,  A61B19/00 ,  A61B8/08 ,  A61N7/02

CPC classification number: G01S7/52017 ,  A61B5/015 ,  A61B8/08 ,  A61B8/13 ,  A61B8/4209 ,  A61B8/4245 ,  A61B8/4254 ,  A61B8/4263 ,  A61B8/4477 ,  A61B8/4488 ,  A61B8/4494 ,  A61B8/483 ,  A61B8/5207 ,  A61B8/56 ,  A61B8/565 ,  A61B17/320068 ,  A61B2090/378 ,  A61B2562/164 ,  A61N7/00 ,  A61N7/02 ,  A61N2007/0078 ,  G01S7/52019 ,  G01S7/52023

Abstract: Apparatus and methods are described that include ultrasound imaging devices, which may operate in a transmissive ultrasound imaging modality, and which may be used to detect properties of interest of a subject such as index of refraction, density and/or speed of sound. Devices suitable for performing high intensity focused ultrasound (HIFU), as well as HIFU and ultrasound imaging, are also described.

公开(公告)号：US09022936B2

公开(公告)日：2015-05-05

申请号：US14191573

申请日：2014-02-27

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Nevada J. Sanchez ,  Gregory L. Charvat ,  Tyler S. Ralston

IPC: A61B8/00 ,  A61B8/14 ,  A61B8/08 ,  A61B17/32 ,  A61B19/00 ,  A61N7/00 ,  A61N7/02

CPC classification number: G01S7/52017 ,  A61B5/015 ,  A61B8/08 ,  A61B8/13 ,  A61B8/4209 ,  A61B8/4245 ,  A61B8/4254 ,  A61B8/4263 ,  A61B8/4477 ,  A61B8/4488 ,  A61B8/4494 ,  A61B8/483 ,  A61B8/5207 ,  A61B8/56 ,  A61B8/565 ,  A61B17/320068 ,  A61B2090/378 ,  A61B2562/164 ,  A61N7/00 ,  A61N7/02 ,  A61N2007/0078 ,  G01S7/52019 ,  G01S7/52023

Abstract: Apparatus and methods are described that include ultrasound imaging devices, which may operate in a transmissive ultrasound imaging modality, and which may be used to detect properties of interest of a subject such as index of refraction, density and/or speed of sound. Devices suitable for performing high intensity focused ultrasound (HIFU), as well as HIFU and ultrasound imaging, are also described.

公开(公告)号：US20150087977A1

公开(公告)日：2015-03-26

申请号：US14561328

申请日：2014-12-05

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Nevada J. Sanchez

IPC: A61N7/02 ,  A61B8/00 ,  A61B8/14

CPC classification number: A61B8/4494 ,  A61B8/14 ,  A61B8/145 ,  A61B8/4483 ,  A61B8/4488 ,  A61B8/485 ,  A61B8/54 ,  A61N7/00 ,  A61N7/02 ,  B06B1/02 ,  B81C1/00246 ,  G01S7/52019 ,  G01S7/52034 ,  G01S7/52047 ,  G01S7/5208 ,  G01S15/02 ,  G01S15/8915 ,  G01S15/8977 ,  H04R1/00 ,  Y10T29/41

Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and a high-speed serial data module may be used to move data for all received channels off-chip as digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. Various novel waveform generation techniques, transducer configuration and biasing methodologies, etc., are likewise disclosed. HIFU methods may additionally or alternatively be employed as a component of the “ultrasound-on-a-chip” solution disclosed herein.

Abstract translation: 为了实现单芯片超声成像解决方案，可以在接收信号路径中采用片上信号处理以减少数据带宽，并且可以使用高速串行数据模块来将数据作为数字的片外移动数据 数据流。 片上接收信号的数字化允许在芯片上执行高级数字信号处理，从而允许整个超声波成像系统完全集成在单个半导体衬底上。 同样公开了各种新颖的波形产生技术，换能器配置和偏置方法等。 HIFU方法可以额外地或替代地用作本文公开的“片上超声”解决方案的组件。