-
公开(公告)号：US20220375966A1
公开(公告)日：2022-11-24
申请号：US17772234
申请日：2021-05-18
Applicant: BOE Technology Group Co., Ltd.
Inventor： Xue DONG , Guangcai YUAN , Ce NING , Zhiwei LIANG , Feng GUAN , Zhaohui QIANG , Yingwei LIU , Ke WANG , Zhanfeng CAO
Abstract: An array substrate includes a base substrate, a driving circuit layer, and a functional device layer which are sequentially stacked; the driving circuit layer is provided with first driving circuits, and each first driving circuit at least comprises a driving transistor; and the driving circuit layer comprises a first gate layer, a first gate insulation layer, a semiconductor layer, a second gate insulation layer, a second gate layer, an interlayer dielectric layer, and a source-drain metal layer which are sequentially stacked on one side of the base substrate.
-
32.发明申请公开(公告)号：US20220344557A1
公开(公告)日：2022-10-27
申请号：US17417660
申请日：2020-10-22
Applicant: BOE Technology Group Co., Ltd.
Inventor： Haixu LI , Guangcai YUAN , Zhanfeng CAO , Ke WANG , Qi QI
Abstract: The present disclosure provides a display backplane including an array substrate including at least one pixel unit each including at least one TFT; a planarization layer covering the array substrate; a pad layer including pads on the planarization layer, surface of the pad away from the planarization layer being first surface, each pixel unit being provided with one pad electrically coupled to a driving thin film transistor in a corresponding pixel unit through via hole penetrating through the planarization layer; a passivation layer covering the pad layer and including through holes, each pad corresponding to one through hole, such that the first surface of each pad is exposed through corresponding through hole, and area of top opening of through hole is smaller than area of bottom opening thereof. The present disclosure further provides a fabrication method of the display backplane, a display panel and a fabrication method thereof.
-
公开(公告)号：US20220231109A1
公开(公告)日：2022-07-21
申请号：US17485184
申请日：2021-09-24
Applicant: BOE Technology Group Co., Ltd.
Inventor： Fengjuan LIU , Ke WANG , Wei LIU , Tianmin ZHOU
Abstract: A displaying substrate and a displaying device. The displaying substrate comprises a flexible base plate; a first auxiliary electrode arranged on one side of the flexible base plate, the first auxiliary electrode being connected with a first power cord; a pixel unit arranged on a side of the flexible base plate away from a first metal layer, the pixel unit comprising: thin-film transistors arranged on the side of the flexible base plate away from the first metal layer, an insulation layer and a second auxiliary electrode, the second auxiliary electrode being connected with a second power cord, wherein the plurality of thin-film transistors comprise a drive transistor, the drive transistor has a source connected with the first auxiliary electrode and a drain connected with a first electrode of a light emitting device, a second electrode of the light emitting device is connected with the second auxiliary electrode.
-
公开(公告)号：US20220216183A1
公开(公告)日：2022-07-07
申请号：US17422220
申请日：2020-10-21
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Mingxing WANG , Meng YAN , Qingxun ZHANG , Qian WU , Xuan FENG , Xiawei YUN , Guangcai YUAN , Xue DONG , Muxin DI , Zhiwei LIANG , Ke WANG
IPC: H01L25/065 , H01L27/15 , H01L23/498 , H01L23/00
Abstract: A display substrate and a display device are provided. The display substrate includes a backplane including a plurality of pixel regions; and light emitting units arranged in one-to-one correspondence with the plurality of pixel regions. Each light emitting unit includes light emitting sub-units arranged in a plurality of rows and a plurality of columns, each row of light emitting sub-units includes a plurality of light emitting sub-units arranged along a row direction, each column of light emitting sub-units includes one light emitting sub-unit, and orthographic projections of light emitting regions of two adjacent columns of light emitting sub-units on a first straight line extending along a column direction are not overlapped; and in each light emitting unit, there is no gap between orthographic projections of the light emitting regions of the two adjacent columns of light emitting sub-units on a second straight line extending along the row direction.
-
35.发明申请公开(公告)号：US20220068873A1
公开(公告)日：2022-03-03
申请号：US17418809
申请日：2020-10-19
Applicant: BOE Technology Group Co., Ltd.
Inventor： Guangcai YUAN , Zhiwei LIANG , Ke WANG , Zhanfeng CAO
Abstract: A backplane (0) and a fabrication method therefor, a chip (01) bonding method, and a display device. The backplane (0) comprises: a base substrate (10); and conductive connection tubes (20) located on the base substrate (10). One end of each conductive connection tube (20) is connected to the base substrate (10), and the side walls of the conductive connection tubes (20) are provided with openings that penetrate said side walls. During the process of bonding the chip (01) to the backplane (0), when the conductive connection tubes (20) are heated, air within inner cavities of the conductive connection tubes (20) can be discharged by means of the openings on the side walls of the conductive connection tubes (20), which helps to ensure the reliability of the bonding between the chip (01) and the backplane (0).
-
Patent Agency Ranking
36.发明申请公开(公告)号：US20220059516A1
公开(公告)日：2022-02-24
申请号：US16973162
申请日：2020-03-05
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Ke WANG
Abstract: The present disclosure provides a manufacturing method of a display backplane which includes a base substrate having first, second and third portions. The manufacturing method includes: forming a flexible layer extending from the first portion to and covering the second and third portions; forming a pixel driving circuit on the first portion and a backlight circuit on the third portion, wherein a part of a film layer of the pixel driving circuit extends from the first portion to and covers the second and third portions; removing a film layer on a side of the flexible layer away from the base substrate and on the second portion; separating the flexible layer from the second and third portions; removing the second and third portions; and bending a film layer separated from the third portion to a side of the first portion away from the flexible layer.
-
37.发明申请公开(公告)号：US20210233940A1
公开(公告)日：2021-07-29
申请号：US16966146
申请日：2019-12-25
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Haixu LI , Zhanfeng CAO , Ke WANG
Abstract: A circuit backplane of a display panel, a method for manufacturing the same, and a display panel are provided. The circuit backplane includes a substrate and a plurality of circuit regions on the substrate. Each of the plurality of circuit regions includes a cathode soldered electrode, an anode soldered electrode, and a flow blocking island that are on the substrate. The flow blocking island is between the cathode soldered electrode and the anode soldered electrode, and in a thickness direction of the circuit backplane, a height of the flow blocking island is greater than each of a height of the cathode soldered electrode and a height of the anode soldered electrode.
-
公开(公告)号：US20210217646A1
公开(公告)日：2021-07-15
申请号：US16758074
申请日：2019-01-29
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Yingwei LIU , Zhanfeng CAO , Muxin Dl , Ke WANG , Zhiwei LIANG , Renquan GU
IPC: H01L21/683 , H01L21/677 , H01L33/62
Abstract: The present disclosure relates to an element pickup device, a method for manufacturing the same and a method for using the same. The element pickup device includes: a first substrate and a second substrate oppositely disposed; a spacing part located between the first substrate and the second substrate, wherein the spacing part is spaced apart from each other to define a flow channel for liquid; and an element pickup part including an opening located in the second substrate and in communication with the flow channel.
-
公开(公告)号：US20210066538A1
公开(公告)日：2021-03-04
申请号：US16918753
申请日：2020-07-01
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Yingwei LIU , Zhiwei LIANG , Ke WANG , Zhanfeng CAO , Shuang LIANG
Abstract: A method for manufacturing a display substrate includes: fabricating a first functional structure on a first side of a common substrate, and fabricating a second functional structure on a second side of the common substrate; fabricating a via hole in an edge region of the common substrate; and fabricating a conductive connection portion in the via hole, a first end of the conductive connection portion on the first side extending out of the via hole and coupled to a first functional pattern in the first functional structure, and a second end of the conductive connection portion on the second side extending out of the via hole and coupled to a second functional pattern in the second functional structure. The method provided in embodiments of the present disclosure is applied to the manufacturing of a display substrate.
-
40.发明申请OXIDE THIN-FILM TRANSISTOR, ARRAY SUBSTRATE AND METHODS FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE 审中-公开氧化物薄膜晶体管，阵列基板及其制造方法和显示装置公开(公告)号：US20160359053A1
公开(公告)日：2016-12-08
申请号：US15156858
申请日：2016-05-17
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
IPC: H01L29/786 , H01L29/24 , H01L27/12 , H01L29/66
CPC classification number: H01L29/78618 , H01L27/1225 , H01L27/127 , H01L27/3272 , H01L29/24 , H01L29/66969 , H01L29/78633 , H01L29/7869 , H01L29/78696
Abstract: An oxide thin-film transistor, an array substrate and methods for manufacturing the same, and a display device are provided. The method for manufacturing the oxide thin-film transistor includes: forming a pattern of an oxide semi-conductor layer above a base substrate; and illuminating, by a light source, two opposite boundary regions of the pattern of the oxide semi-conductor layer, where the illuminated two opposite boundary regions of the pattern of the oxide semi-conductor layer form ohmic contact layers and a region of the pattern of the oxide semi-conductor layer that is not illuminated forms a semi-conductor active layer; forming a source electrode and a drain electrode which are connected to the semi-conductor active layer via the ohmic contact layers respectively.
Abstract translation: 提供氧化物薄膜晶体管，阵列基板及其制造方法以及显示装置。 氧化物薄膜晶体管的制造方法包括：在基底基板上形成氧化物半导体层的图案; 并且通过光源照射氧化物半导体层的图案的两个相对的边界区域，其中氧化物半导体层的图案的被照射的两个相对的边界区域形成欧姆接触层和图案的区域 未被照射的氧化物半导体层形成半导体有源层; 形成源电极和漏电极，分别经由欧姆接触层与半导体有源层连接。
-
-
-
-
-
-
-
-
-
Search Results
71
records
(took 0.027 seconds)
