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公开(公告)号：US10071539B2
公开(公告)日：2018-09-11
申请号：US14864618
申请日：2015-09-24
Applicant: Apple Inc.
Inventor： Naoto Matsuyuki , Trevor J. Ness , David I. Nazzaro
IPC: H04M1/02 , B32B18/00 , B28B1/00 , C04B35/645 , B28B7/00
CPC classification number: B32B18/00 , B28B1/002 , B28B1/008 , B28B7/0088 , C04B35/645 , C04B2235/602 , C04B2235/6022 , C04B2235/6023 , C04B2235/9615 , C04B2237/343 , C04B2237/348 , H04M1/0202 , H04M1/0266
Abstract: A ceramic structure and methods for making the ceramic structure are disclosed. Multiple parts may be molded; the parts may be molded from the same or different ceramic materials. The parts may be formed in the same mold and may be adjacent to and/or attached to one another as a result of molding. The parts may be placed in a sintering furnace and sintered simultaneously. Simultaneously sintering the parts forms a unitary structure from the parts.
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公开(公告)号：US09755337B2
公开(公告)日：2017-09-05
申请号：US14843905
申请日：2015-09-02
Applicant: APPLE INC.
Inventor： Makiko K. Brzezinski , Tyler S. Bushnell , David I. Nazzaro
CPC classification number: H01R12/716 , H01R12/73 , H01R13/5216 , H01R13/5219 , H01R43/005 , H01R43/205
Abstract: Board-to-board connectors that may provide durable and reliable connections, may save board space, and may be easy to manufacture. One example may provide board-to-board connectors that provide durable connections by providing a seal between board-to-board plugs and receptacles. The seal may be an O-ring, gasket, or other seal. The seal may protect contacts on the board-to-board connectors from exposure to fluids, such as water or other corrosive fluids. This seal may provide a level of redundancy with one or more seals protecting a device from external fluids, such as a seal at or in the device enclosure.
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公开(公告)号：US09634426B2
公开(公告)日：2017-04-25
申请号：US15079785
申请日：2016-03-24
Applicant: APPLE INC.
Inventor： David I. Nazzaro , Tyler S. Bushnell , Ibuki Kamei
IPC: H01R13/52 , H01R13/44 , H01R13/46 , H01R13/453 , H01R24/58
CPC classification number: H01R13/5216 , H01R13/44 , H01R13/453 , H01R13/46 , H01R13/52 , H01R24/58
Abstract: An electronic device has a self-healing elastomer applied over one or more external electronic connectors. The self-healing elastomer may obscure the electronic connectors from the user as well as provide environmental protection for the connector and the electronic device. Electronic probes may temporarily penetrate the self-healing elastomer to mate with the electronic connector. After removal of the probes the self-healing elastomer may elastically reform and self-heal.
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公开(公告)号：US20160255929A1
公开(公告)日：2016-09-08
申请号：US14816277
申请日：2015-08-03
Applicant: Apple Inc.
Inventor： David I. Nazzaro , Joseph C. Poole , Kevin M. Kenney , Naoto Matsuyuki
CPC classification number: A45C11/00 , A45C2011/002 , B29C45/14311 , B29C2045/14327 , B29C2045/14868 , B29K2101/10 , B29K2101/12 , B29K2709/02 , B29K2995/0026 , B29L2031/3481
Abstract: A method of manufacturing a co-molded housing component for an electronic device is disclosed. A component formed from a ceramic material is placed in a mold. The mold comprises a first section defining a first cavity configured to receive the first component, and a second section defining a second cavity that is in communication with the first cavity when the mold is closed. The second cavity is in the shape of a feature that is to be joined to the ceramic material. A polymer material is injected into the second cavity, thereby forming the feature from the polymer material and bonding the feature to the ceramic material. The polymer material is cured. The first component and the feature together form the housing component for an electronic device.
Abstract translation: 公开了一种制造用于电子设备的共模塑外壳部件的方法。 将由陶瓷材料形成的部件放置在模具中。 模具包括限定被配置为容纳第一部件的第一空腔的第一部分和限定当模具闭合时与第一腔体连通的第二腔室的第二部分。 第二空腔是要与陶瓷材料接合的特征的形状。 将聚合物材料注入到第二腔中，由此从聚合物材料形成特征并将该特征粘合到陶瓷材料上。 聚合物材料固化。 第一部件和特征一起形成用于电子设备的壳体部件。
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