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公开(公告)号：US10128422B2
公开(公告)日：2018-11-13
申请号：US14886776
申请日：2015-10-19
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Abstract: Provided is a light emitting semiconductor device comprising a flexible dielectric layer, a conductive layer on at least one side of the dielectric layer, at least one cavity or via in the dielectric substrate, and a light emitting semiconductor supported by the cavity or via. Also provided is a support article comprising a flexible dielectric layer, a conductive layer on at least one side and at least one cavity or via in the dielectric substrate. Further provided is a flexible light emitting semiconductor device system comprising the above-described light emitting semiconductor device attached to the above-described support article.
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公开(公告)号：US10121947B2
公开(公告)日：2018-11-06
申请号：US15316028
申请日：2015-05-26
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
IPC: H01L33/62 , B32B15/08 , B32B7/12 , B32B27/28 , H01L33/48 , H01L33/58 , H05K1/03 , H05K1/18 , H05K3/28
Abstract: Flexible LED assemblies (300) are described. More particularly, flexible LED (320) assemblies having flexible substrates (302) with conductive features (304, 306) positioned on or in the substrate, and layers of ceramic (310) positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.
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33.发明申请公开(公告)号：US20180246592A1
公开(公告)日：2018-08-30
申请号：US15745808
申请日：2016-07-07
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Siarhei V. Savich , Daniel J. Theis , Qin Fei Chen , Saujit Bandhu , Ravi Palaniswamy , Matthew S. Stay
IPC: G06F3/044
CPC classification number: G06F3/044 , G06F2203/04103
Abstract: Electrically conductive films are provided. An electrically conductive film includes a dielectric substrate having a first region adapted to be used in a touch sensor and a second region, adjacent to the first region, not adapted to be used in the touch sensor. The electrically conductive film further includes electrically conductive spaced apart electrodes disposed on the substrate in the first region and adapted to form drive or receive electrodes in the touch sensor, and an electrically conductive pattern disposed on the substrate in the second region. Each electrode extends into the second region and is electrically and physically connected to the conductive first pattern, the conductive first pattern electrically connecting the plurality of the first electrodes. Also, assemblies and methods for removing static electric charge from electrically conductive patterns are provided.
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公开(公告)号：US20170104143A1
公开(公告)日：2017-04-13
申请号：US15316028
申请日：2015-05-26
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
CPC classification number: H01L33/62 , B32B7/12 , B32B15/08 , B32B27/281 , B32B2255/10 , B32B2255/20 , B32B2307/202 , B32B2457/202 , H01L33/486 , H01L33/58 , H01L2933/0033 , H01L2933/0058 , H01L2933/0066 , H05K1/0306 , H05K1/0346 , H05K1/036 , H05K1/189 , H05K3/28 , H05K2201/0154 , H05K2201/017 , H05K2201/0179 , H05K2201/09827 , H05K2201/09881 , H05K2201/10106
Abstract: Flexible LED assemblies (300) are described. More particularly, flexible LED (320) assemblies having flexible substrates (302) with conductive features (304, 306) positioned on or in the substrate, and layers of ceramic (310) positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.
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公开(公告)号：US12004424B2
公开(公告)日：2024-06-04
申请号：US17779623
申请日：2019-12-06
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ravi Palaniswamy , Antonny Flor , Sheldon B. Ruiz , Milind B. Sabade
IPC: H10N10/01 , H10N10/13 , H10N10/17 , H10N10/852 , H10N10/855
CPC classification number: H10N10/01 , H10N10/13 , H10N10/17 , H10N10/852 , H10N10/855
Abstract: The present disclosure relates to a method of fabricating a thermoelectric device. The method includes disposing a metal layer on a dielectric layer to form a sub-assembly, forming patterned circuits on the metal layer, forming blind vias in the dielectric layer, fabricating first thermoelectric elements in a first series of blind vias, and fabricating second thermoelectric elements in a second series of blind vias to form thermoelectric units with the first thermoelectric elements and the patterned circuits. The sub-assembly is configured to be joined to an adjacent sub-assembly along a first direction, and the first and second thermoelectric elements of each thermoelectric unit are aligned in a second direction substantially perpendicular to the first direction. The present disclosure further relates to a thermoelectric device which includes a plurality of thermoelectric units forming a strip extending in a first direction.
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Patent Agency Ranking
公开(公告)号：US20240011679A1
公开(公告)日：2024-01-11
申请号：US18035864
申请日：2021-12-02
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Milind B. Sabade , Ravi Palaniswamy , Ryan J. Rogers , Diane L. Emslander , Dominic J. Julian
Abstract: The present invention is a thermal management device including a power source, a flexible thermoelectric module, and a first phase change material.
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公开(公告)号：US11338236B2
公开(公告)日：2022-05-24
申请号：US16609005
申请日：2018-04-19
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Jae Yong Lee , Mahmut Aksit , Ravi Palaniswamy , Antonny E. Flor , James F. Poch , Michael A. Meis , Alejandro Aldrin A. Narag, II , Siang Sin Foo , Donato G. Caraig
Abstract: Systems and methods for monitoring the status of air filters are provided. One or more thermoelectric sensors are provided to have an upstream sensing surface positioned adjacent the inlet surface of the air filter, and a downstream sensing surface positioned adjacent the outlet surface of the air filter. Sensing circuitry are connected to the thermoelectric sensors, configured to receive signals from the thermoelectric sensors and process the signals to obtain status information of the air filter.
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公开(公告)号：US20210202818A1
公开(公告)日：2021-07-01
申请号：US16948395
申请日：2019-03-14
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ravi Palaniswamy , Donato G. Caraig , Jian Xia Gao , Alejandro Aldrin A. Narag, II , Siang Sin Foo , Antonny E. Flor
Abstract: Flexible thermoelectric devices including an array of slot openings on a flexible substrate, and methods of making and using the same are provided. The slot openings on the flexible substrate can help remove the tension or compression induced during bending of the devices. Slot openings each extend along a cross direction substantially perpendicular to the longitudinal direction of the substrate.
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公开(公告)号：US10580940B2
公开(公告)日：2020-03-03
申请号：US15748663
申请日：2016-08-30
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Alejandro Aldrin A. Narag, II , Ravi Palaniswamy
Abstract: A flexible dielectric substrate (102) defines a LESD mounting region (120) including two conductive filled vias (105, 106) extending through the flexible dielectric substrate (102) and the LESD mounting region is substantially surrounded by two conductive frame portions (112, 116). The frame portions are in electrical connection with the conductive filled vias (105, 106), respectively. The conductive filled vias (105, 106) form conductive features in the mounting region (120) that are co-planar with each other.
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公开(公告)号：US10438897B2
公开(公告)日：2019-10-08
申请号：US15753426
申请日：2016-08-30
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Siang Sin Foo , Hiromitsu Kosugi , Alejandro Aldrin A. Narag, II , Ravi Palaniswamy
IPC: H01L23/544 , H01L23/498 , H01L23/00 , H05K1/02 , H05K1/18 , H01L33/62 , H01L21/48 , H05K1/11 , H05K3/32 , H05K3/34
Abstract: A flexible multilayer construction (100) for mounting a light emitting semiconductor device (200) (LESD), includes a flexible dielectric substrate (110) having an LESD mounting region (120), first and second electrically conductive pads (130, 140) disposed in the LESD mounting region for electrically connecting to corresponding first and second electrically conductive terminals of an LESD (200) received in the LESD mounting region, and a first fiducial alignment mark (150) for an accurate placement of an LESD in the LESD mounting region. The first fiducial alignment mark is disposed within the LESD mounting region.
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