Abstract:
A contact arm for bringing ICs to be tested to contact a contact portion, comprises a holding head for holding said electronic devices, a floating mechanism provided between a drive mechanism for moving close to or away from said contact portion and said holding head for supporting said holding head movable about said drive mechanism, a diaphragm cylinder provided between said drive mechanism and said holding head for adjusting a relative pressing pressure from said drive mechanism to said holding head. A plurality of diaphragm cylinders are provided to one holding head.
Abstract:
A semiconductor device testing apparatus having a reduced transverse width and compact in size is provided. Adjacent to a constant temperature chamber 101 containing therein a vertical transport means is located a test chamber 102 which is in turn adjoined by a temperature-stress removing chamber 103 likewise containing therein a vertical transport means, so that the constant temperature chamber 101, the test chamber 102 and the temperature-stress removing chamber 103 are arranged transversely in a line. Further, a loader section 300 is located in front of the constant temperature chamber, and an unloader section 400 is located in front of the test chamber and the temperature-stress removing chamber. With this arrangement, the transverse width of the testing apparatus may be reduced to about three test tray lengths.
Abstract:
A noise-canceling method for simultaneously canceling a plurality of harmonic components of the engine rotational speed contained in engine noise. Reference signals are generated in correspondence with a plurality of harmonic components, and an adaptive signal processing is executed by using each reference signal, a composite-sound signal of the engine sound and a composite noise-canceling sound at a noise-canceling point, thereby generating a noise-canceling signal. The noise-canceling signal is input to a speaker. The reference signal corresponding to a harmonic component of a low level is multiplied by a constant K before it is input to the speaker so as to approximately equalize the levels of all the harmonic components at the noise-canceling point.
Abstract:
Among systems configured by connecting a plurality of sequence controllers to one communication line to intercommunicate, many systems has been disclosed which implement fault location and recovery from the faults. In one of these systems, each substation is connected to a circulating communication line via a branch line and switches are respectively disposed on the branch line and on the communication line at both sides of a connecting point of the branch line and the communication line. Further, the communication line can be formed in a loop by a spare line. In another of these systems, an integrated portion of the communication line is formed near the master station, and the communication line is connected to the master station and is configured of one continuous line which goes and backs in sequence between the integrated portion and vicinity of each substation. In that integrated portion, a switch is disposed on each one of two lines, which connect the integrated portion and each substation. Further, a switch is provided on a line which bypasses these two switches. Other systems are a composite of the above systems. Still other systems have automated portions of fault location and fault recovery.
Abstract:
An orifice structure for a fluid ejection device includes a surface, an orifice formed through the surface, a first region of the surface projecting from the orifice, and a second region of the surface surrounding the first region, with the first region having a first surface energy, and the second region having a second surface energy higher than the first surface energy.
Abstract:
A power converter is preferably mounted in a vehicle. The converter has a power converting unit including an electrical switching element electrically switched on and off selectively in response to a duty ratio of PWM (pulse-width modulation) signal given to the switching element. The converter further has a controller including a drive unit that generates the PWM signal, in addition to a controlling unit and a limiting unit. The controlling unit controls the duty ratio of the PWM signal such that a voltage inputted to the power converter is converted to a voltage to be outputted depending on the duty ratio. The limiting unit limits at least one of a time change amount of the duty ratio of the PWM signal and a maximum duty ratio of the PWM signal.
Abstract:
A power converter capable of activating a control circuit therein without increasing a length of a wiring for conveying an external activation signal. In the power converter, a converter circuit isolates a first voltage of a first power supply, converts the first voltage into a second voltage, and outputs the second voltage to a second power supply. A first power supply connecting circuit connects the first power supply to the converter circuit in response to the activation signal. An activation circuit determines whether or not the activation signal has been received by the first power supply connecting circuit on the basis of a voltage between input terminals of the converter circuit and activates the control circuit when it is determined that the activation signal has been received by the first power supply connecting circuit.
Abstract:
A side shooting ink ejection device may comprise a front surface, side shooting nozzles having ejection orifices for ejecting fluid, and piezoelectric actuators for moving the fluid through vibration for ejecting the fluid out of the nozzle. The side shooting nozzles may be arranged to eject fluid in a side direction of the piezoelectric actuator. The front surface may comprise recessed portions. The side shooting nozzles may open into the recessed portions so that the ejection orifices are countersunk with respect to the front surface.
Abstract:
Pressing an electronic device (2) to be tested to contact terminals (132a and 132b) while bringing a heater (112) having equal or close temperature change characteristics to those of the electronic device to be tested by a test pattern, transmitting a test pattern to the electronic device to be tested in this state, and controlling a power consumption of a heater so that total power of a power consumption of the electronic device to be tested by the test pattern and a power consumption of the heater becomes a constant value.
Abstract:
A pusher 200 that pushes a semiconductor device under test 300 against a test socket 500 in a semiconductor test apparatus 20 is provided that includes a main body section 210 that is thermally coupled with the thermal source 400 and a plurality of device pushing sections 220, each of which is physically and thermally coupled to the thermal source 400, is displaced toward the test socket 500 by the pushing force of the main body section 210 to contact a surface to be pushed of a semiconductor device under test 300, pushes the semiconductor device under test 300, and transmits heat from the thermal source 400 to the semiconductor device under test 300. Thermal conductivity between the pusher and the semiconductor device under test is enhanced to provide a pusher that can quickly and accurately test a semiconductor device.