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39 条记录 (耗时 0.025 秒)

    Method of manufacturing a probe card
    31.
    发明授权
    Method of manufacturing a probe card 有权
    探针卡

    公开(公告)号：US07716824B2

    公开(公告)日：2010-05-18

    申请号：US11995276

    申请日：2006-07-11

    申请人： Kiyoshi Takekoshi

    发明人： Kiyoshi Takekoshi

    IPC分类号： H01R9/00 ,  G01R31/02

    CPC分类号： G01R1/06722 ,  G01R1/06727 ,  G01R1/07314 ,  G01R3/00 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49218

    摘要： An object of the present invention is to finely conduct an inspection of high integration devices by making it possible to form guide holes in a support plate of a probe card in a narrower pitch than in the conventional case of forming the guide holes in a support plate of the same area, and to broaden a range of options for an elastic member which works to urge a probe pin. The present invention has a circuit board and a support plate being placed under the circuit board and supporting the probe pin. In the guide hole formed in the support plate, the probe pin composed of an elastic portion and a pin portion is inserted, and a rip of the pin portion protrudes downward from the support plate. The guide hole has a quadrangular horizontal sectional shape.

    摘要翻译： 本发明的目的是通过使得可以以比在常规的形成支撑板中的引导孔的情况更窄的间距在探针卡的支撑板中形成导孔来精细地进行高集成装置的检查 并且扩大了用于推动探针的弹性构件的一系列选项。 本发明具有电路板和支撑板，该电路板和支撑板被放置在电路板的下方并支撑探针。 在支撑板上形成的引导孔中插入由弹性部分和销部分组成的探针，并且销部分的尖端从支撑板向下突出。 导向孔具有四边形水平截面形状。

    Needle load measuring method, needle load setting method and needle load detecting mechanism
    38.
    发明授权
    Needle load measuring method, needle load setting method and needle load detecting mechanism 有权
    针荷载测量方法，针装载设定方法和针装载检测机构

    公开(公告)号：US06707310B2

    公开(公告)日：2004-03-16

    申请号：US10360811

    申请日：2003-02-10

    申请人： Kiyoshi Takekoshi

    发明人： Kiyoshi Takekoshi

    IPC分类号： G01R3100

    CPC分类号： G01R31/2887 ,  G01R1/06794 ,  Y10S414/136

    摘要： Disclosed is a method of inspecting the electrical characteristics of a to-be-inspected object formed on a wafer under the state that the wafer chuck having the wafer placed thereon is overdriven by a lift mechanism, wherein measured is the sinking amount of the wafer chuck caused by the needle load applied from a plurality of probes of a probe card to the wafer chuck. Also disclosed are a needle load measuring method for measuring the applied needle load from the sinking amount, a needle load setting method, and a needle load detecting mechanism.

    摘要翻译： 公开了一种在其上放置有晶片的晶片卡盘被提升机构驱动的状态下检查在晶片上形成的被检查对象的电特性的方法，其中测量的是晶片卡盘的下沉量 由从探针卡的多个探针施加到晶片卡盘的针头负载引起的。 还公开了一种针头负荷测量方法，用于从下沉量测量所施加的针头负荷，针装载设定方法和针装载检测机构。

    Probe apparatus and a method for polishing a probe
    39.
    发明授权
    Probe apparatus and a method for polishing a probe 失效
    探针装置和抛光探针的方法

    公开(公告)号：US6024629A

    公开(公告)日：2000-02-15

    申请号：US10116

    申请日：1998-01-21

    申请人： Kiyoshi Takekoshi

    发明人： Kiyoshi Takekoshi

    IPC分类号： B23Q3/155 ,  G01R3/00 ,  G01R31/28 ,  H01L21/66 ,  B24B1/04

    CPC分类号： G01R31/2887 ,  B23Q3/15526 ,  B24B37/04 ,  G01R3/00 ,  G01R31/2851

    摘要： A probe apparatus according to the present invention comprises a stage carrying an object of inspection thereon and rotatable and movable in the horizontal and vertical directions, a probe located over the stage and adapted to be brought into contact with the object of inspection on the stage in order to subject the object to electrical inspection, a polisher carrying section attached to the stage and capable of carrying thereon a polisher for polishing the probe, a storage mechanism for storing the polisher, and a transportation mechanism for transporting the polisher between the storage mechanism and the polisher carrying section.

    摘要翻译： 根据本发明的探针装置包括载物体的载物台，其可在水平和垂直方向上旋转和移动，探头位于载物台上方并适于与载物台上的检查对象接触 为了使物体进行电气检查，安装在平台上的抛光器承载部分并且能够承载用于抛光探针的抛光机，用于存储抛光机的存储机构，以及用于在存储机构和 抛光机承载部分。