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公开(公告)号：US5302278A
公开(公告)日：1994-04-12
申请号：US19949
申请日：1993-02-19
摘要： A solution for use in electroplating which comprises at least one monovalent metal such as copper, silver or gold which is complexed by a thiosulfate ion; and a stabilizer of an organic sulfinate compound such as, for example, one having the formula R-SO.sub.2 -X wherein R is an alkyl, heterocyclic or aryl moiety and X is a monovalent cation. The stabilizer is present in an amount sufficient to stabilize the thiosulfate ion when the solution is operated at an acidic pH of less than 7. Also, the solution is substantially free of cyanide.
摘要翻译： 一种用于电镀的溶液，其包含由硫代硫酸根离子络合的至少一种一价金属如铜，银或金; 和有机亚磺酸盐化合物的稳定剂，例如具有式R-SO 2 -X的化合物，其中R是烷基，杂环或芳基，X是一价阳离子。 当溶液在小于7的酸性pH下操作时，稳定剂以足以稳定硫代硫酸根离子的量存在。而且，该溶液基本上不含氰化物。
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公开(公告)号：US5106473A
公开(公告)日：1992-04-21
申请号：US695473
申请日：1991-05-03
申请人： Keith J. Whitlaw , Mark Goodenough
发明人： Keith J. Whitlaw , Mark Goodenough
CPC分类号： H05K3/424 , C25D5/56 , H05K2201/0329 , H05K2203/0783 , H05K2203/0796 , H05K2203/122 , H05K3/427
摘要： A process is provided for metallizing the hole-wall surface of a through-hole provided in a printed circuit board precursor. In an initial step, the hole-wall surface is pre-treated with an oxidizing agent which micro-roughens it. An electro-conductive polymer film is then formed on the micro-roughened surface by oxidatively polymerizing in situ an acidic solution of an organic monomer with an oxidizing agent previously adsorbed on the board. The polymer film includes dopant anions which are acquired from the monomer solution. Finally, a metal layer is electroplated on the electro-conductive polymer film.
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33.发明授权
公开(公告)号：US5094726A
公开(公告)日：1992-03-10
申请号：US585551
申请日：1990-09-20
申请人： Fred I. Nobel , Barnet D. Ostrow , David N. Schram
发明人： Fred I. Nobel , Barnet D. Ostrow , David N. Schram
CPC分类号： C25D3/32 , C25D3/36 , C25D3/56 , C25D3/60 , H05K3/3473
摘要： Baths and methods for electroplating tin or tin-lead alloys wherein the formation of tetravalent tin and stannic oxide sludge is reduced or prevented. These baths contain a soluble divalent tin compound, a soluble alkyl or alkylol sulfonic acid at least one wetting agent, and a hydroxyl phenyl compound reducing agent. Other compounds may be added to the bath for improving its performance during electroplating.
摘要翻译： 用于电镀锡或锡铅合金的浴和方法，其中减少或防止四价锡和氧化锡污泥的形成。 这些浴含有可溶性二价锡化合物，可溶性烷基或烷基磺酸至少一种润湿剂和羟基苯基化合物还原剂。 可以向浴中加入其它化合物以改善其在电镀过程中的性能。
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公开(公告)号：US4994155A
公开(公告)日：1991-02-19
申请号：US409914
申请日：1989-09-20
摘要： An electrolyte, system and process for depositing tin, lead or tin/lead alloys upon a substrate by high speed electroplating, which includes a basis solution of an alkyl or alkylol sulfonic acid; and at least one of a solution soluble tin compound or a solution soluble lead compound; and an alkylene oxide condensation compound of (1) an aliphatic hydrocarbon having seven, preferably six or less, carbon atoms and at least one hydroxy group, or (2) an organic compound having no more than a total of twenty carbon atoms in one or two independent or joined rings optionally substituted with an alkyl moeity of less than six carbon atoms.
摘要翻译： 一种用于通过高速电镀将锡，铅或锡/铅合金沉积在基底上的电解质，系统和方法，其包括烷基或烷基磺酸的基础溶液; 和溶液可溶性锡化合物或溶液可溶性铅化合物中的至少一种; 和（1）具有7个，优选6个或更少个碳原子和至少一个羟基的脂族烃的环氧烷缩合化合物，或（2）在一个或多个碳原子中不超过总共20个碳原子的有机化合物 两个独立或连接的环，任选地被小于6个碳原子的烷基摩尔量所取代。
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35.发明授权Akaline cyanide-free Cu-Zu strike baths and electrodepositing processes for the use thereof 失效不含Akaline氰化物的Cu-Zu冲洗浴和电沉积方法用于其使用
公开(公告)号：US4904354A
公开(公告)日：1990-02-27
申请号：US269240
申请日：1988-11-09
摘要： Alkaline cyanide-free copper strike baths are provided for the purposes of electrodepositing a copper-zinc alloy strike coating unto a metal based substrate so as to prevent immersion coating by the copper on the metal substrate and thereby provide a basis for the subsequent addition to the substrate of composite electrodeposits which are blister free and highly adherent. Electrochemical coating processes for employing such strike baths and the resulting products are disclosed.
摘要翻译： 提供无碱性无氰铜冲击浴，用于将铜 - 锌合金冲击涂层电沉积到金属基底上，以防止金属基底上的铜浸渍，从而为后续加入 复合电沉积物的底物是无泡和高附着性的。 公开了采用这种冲洗浴的电化学涂覆方法和所得到的产品。
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公开(公告)号：US4877450A
公开(公告)日：1989-10-31
申请号：US314537
申请日：1989-02-23
申请人： William R. Brasch
发明人： William R. Brasch
CPC分类号： C23C18/40
摘要： This invention relates to a formaldehyde-free electroless copper plating solution, containing a solution soluble divalent copper compound in a concentration between about 1/2 and 2 g/l; a reducing agent for the copper compound in an amount of between about 1 and 3 g/l; a complexing and chelating agent mixture of between about 5 and 100 ml/l of an alkanol amine having at least one alkyl group with one to three carbon atoms and between about 1 and 10 g/l of an ethylene diamine compound of the formula ##STR1## wherein R is an alkyl moiety having between 1 and 3 carbon atoms and X is --OH or --COOH; the solution preferably having a pH between about 7 and 8.5 and a temperature preferably between about 130.degree. and 150.degree. F., with the complexing and chelating agent mixture being present to provide stability to the solution and to enable the solution to provide a uniform plating rate of copper upon a substrate which is immersed therein.
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37.发明授权
公开(公告)号：US4741818A
公开(公告)日：1988-05-03
申请号：US24874
申请日：1987-03-17
申请人： Fred I. Nobel , James L. Martin , Michael P. Toben
发明人： Fred I. Nobel , James L. Martin , Michael P. Toben
摘要： Alkaline aqueous electrolytes for the electrodeposition of palladium comprising a soluble palladium compound, one or more complexing agents of an organic compound containing a heterocyclic ring having one or more nitrogen atoms in the ring position, at least one carboxyl group substituted on a ring carbon, and at least one hydroxyl or carbonyl oxygen attached to a ring carbon. The palladium compound and complexing agents are soluble in the electrolyte. Optionally, one or more soluble alloying metal compounds can be added to the electrolyte when palladium alloys are to be electrodeposited therefrom. Also, methods for formulating these electrolytes and for electrodepositing palladium or palladium alloys therefrom.
摘要翻译： 用于电沉积钯的碱性水性电解质，其包含可溶性钯化合物，一种或多种含有环中具有一个或多个氮原子的杂环的有机化合物络合剂，至少一个在环碳上取代的羧基，以及 至少一个与环碳连接的羟基或羰基氧。 钯化合物和络合剂可溶于电解质。 任选地，当钯合金从其中电沉积时，可以向电解质中加入一种或多种可溶性合金化金属化合物。 而且，用于配制这些电解质和从其中电沉积钯或钯合金的方法。
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公开(公告)号：US4628165A
公开(公告)日：1986-12-09
申请号：US774634
申请日：1985-09-11
申请人： Fred I. Nobel , James L. Martin , Michael P. Toben
发明人： Fred I. Nobel , James L. Martin , Michael P. Toben
CPC分类号： H01H11/041 , C25D3/567 , C25D5/10 , H01H1/023 , H01H2011/046 , Y10T428/1259 , Y10T428/12868 , Y10T428/12875 , Y10T428/12896 , Y10T428/12903 , Y10T428/12944
摘要： Methods for increasing the ductility and reducing the porosity and cracking tendency of a palladium or palladium-silver electrodeposit which comprises providing an underlayer of a palladium/nickel or palladium/cobalt alloy electrodeposit. Also dual layer composite electroplated deposits and their use in electrical contacts or connectors.
摘要翻译： 增加钯或钯 - 银电沉积物的延展性和降低孔隙率和开裂倾向的方法，其包括提供钯/镍或钯/钴合金电沉积物的底层。 还有双层复合电镀沉积物及其在电触点或连接器中的应用。
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39.发明授权
公开(公告)号：US4599149A
公开(公告)日：1986-07-08
申请号：US564516
申请日：1983-12-22
申请人： Fred I. Nobel , Barnet Ostrow , David N. Schram
发明人： Fred I. Nobel , Barnet Ostrow , David N. Schram
CPC分类号： C25D3/60 , C25D3/32 , C25D3/36 , C25D3/56 , H05K3/3473
摘要： This invention relates to the electrodeposition of tin, lead and particularly tin-lead alloys from an electroplating bath comprising a lead and/or tin alkylsulfonate, and alkylsulfonic acid in a sufficient amount to impart a pH below about 3 to the bath, and various additives to improve the brightness of the deposits, the useful current density ranges, and/or the solderability of tin-lead alloy deposits including quaternary nitrogen wetting agents containing a fatty acid radical, alkylene oxides, pyridine compounds, aromatic aldehydes, acetaldehyde and/or a bismuth compound. The bath is formulated to have a cloud point above about 90.degree. F.
摘要翻译： 本发明涉及从包含铅和/或锡烷基磺酸铅的电镀浴和足够量的烷基磺酸将锡，铅和特别是锡铅合金电沉积以使pH低于约3的pH，以及各种添加剂 改善沉积物的亮度，有用的电流密度范围和/或锡 - 铅合金沉积物的可焊性，包括含有脂肪酸基团，环氧烷烃，吡啶化合物，芳族醛，乙醛和/或 铋化合物。 该浴被配制成具有高于约90°F的浊点。
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40.发明授权Method of improving the adhesion of electroless metal deposits employing colloidal copper activator 失效使用胶体铜活化剂改善无电金属沉积物的附着力的方法
公开(公告)号：US4233344A
公开(公告)日：1980-11-11
申请号：US926392
申请日：1978-07-20
申请人： William Brasch
发明人： William Brasch
CPC分类号： C23C18/28
摘要： The present invention relates to a method for promoting and improving the adhesion of an electroless metal deposit to the metal surface of a composite substrate having both a conductive metal area and an activated non-conductive surface. The process comprises treating such a substrate, subsequent to catalyzation or activation of the substrate, and prior to electroless metal deposition thereon, with an adhesion promotor compound or mixture of compounds.
摘要翻译： 本发明涉及促进和改善化学金属沉积物对具有导电金属区域和活化的非导电表面的复合衬底的金属表面的粘附性的方法。 该方法包括在催化或活化底物之后，以及在其上无电金属沉积之前用粘合促进剂化合物或化合物混合物处理这样的底物。
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