BONDED STRUCTURE AND METHOD FOR PRODUCING SAME

    公开(公告)号:US20210332267A1

    公开(公告)日:2021-10-28

    申请号:US17369743

    申请日:2021-07-07

    申请人: DENSO CORPORATION

    IPC分类号: C09J5/02 C09J5/06 C09J163/00

    摘要: A bonded structure has a first substrate composed of aluminum or an aluminum alloy, a first thin film layer formed on the surface of the first substrate, and a resin adhesive layer bonded to the surface of the first thin film layer. The first thin film layer is composed of silicate glass that has a metal element with different valency from Si as a solid solution. The resin adhesive layer includes a resin including a structural site derived from ionic polymerization or a resin capable of dehydration condensation.

    ACTIVATING SURFACES FOR SUBSEQUENT BONDING

    公开(公告)号:US20210292603A1

    公开(公告)日:2021-09-23

    申请号:US17340259

    申请日:2021-06-07

    摘要: A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding, the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm2 to about 300 J/cm2. Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.

    ACTIVATING SURFACES FOR SUBSEQUENT BONDING

    公开(公告)号:US20210253806A1

    公开(公告)日:2021-08-19

    申请号:US17184760

    申请日:2021-02-25

    发明人: Brian Deegan

    摘要: A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding, the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm2 to about 300 J/cm2. Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.

    Sulfonated block copolymer laminates with polar or active metal substrates

    公开(公告)号:US11021559B2

    公开(公告)日:2021-06-01

    申请号:US16678198

    申请日:2019-11-08

    摘要: Disclosed herein is a process for laminating a polar substrate with a film cast from a sulfonated block copolymer having at least one end block A and at least one interior block B wherein each A block contains essentially no sulfonic acid or sulfonate ester functional groups and each B block is a polymer block containing from about 10 to about 100 mol percent sulfonic acid or sulfonate ester functional groups based on the number of monomer units. The film is exposed to water and dried onto a polar or active metal substrate. The laminates do not delaminate in the presence of water, or in a humidity of up to 85%, and at a temperature of at least 60° C. The laminates are used for a variety of applications including energy exchange applications.