公开(公告)号：US08468691B2

公开(公告)日：2013-06-25

申请号：US12279483

申请日：2007-02-15

Applicant: Bruno Lefevre ,  Christian Schwartz ,  Jean-Yves Moreno

Inventor： Bruno Lefevre ,  Christian Schwartz ,  Jean-Yves Moreno

IPC: H05K3/34 ,  H05K3/30

CPC classification number: H05K13/00 ,  B23K3/047 ,  H05K1/181 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/3494 ,  H05K13/0465 ,  H05K2201/10515 ,  H05K2201/10848 ,  H05K2203/1115 ,  H05K2203/1476 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53174

Abstract: A process for manufacturing an electronic module including a printed-circuit board, at least one first-type component and one second-type component is disclosed. The process involves placing solder on the board, putting the first-type component in a first position, heating the entire board to melt the solder, resulting in soldering of the first-type component, putting the second-type component in a second position such that the second-type component has leads bearing on the board via the solder, and heating the solder locally to melt the solder such that the second-type component is soldered by applying two electrodes on each lead of the second-type component and making an electrical current flow between the electrodes to heat each lead of the second-type component. Each of the two electrodes directly contacts each lead of the second-type component to make the current flow between the two electrodes via the corresponding lead of the second-type component.

Abstract translation: 公开了一种用于制造包括印刷电路板，至少一个第一类型部件和一个第二类型部件的电子模块的方法。 该过程包括将焊料放置在板上，将第一类型部件放置在第一位置，加热整个板以熔化焊料，导致第一类型部件的焊接，将第二类型部件放置在第二位置 所述第二类型部件具有通过所述焊料在所述板上承受的引线，并且局部加热所述焊料以熔化所述焊料，使得所述第二类型部件通过在所述第二类型部件的每个引线上施加两个电极而被焊接， 在电极之间的电流流动以加热第二类型部件的每个引线。 两个电极中的每一个直接接触第二类型部件的每个引线，以使电流在第二类型部件的相应引线之间在两个电极之间流动。

公开(公告)号：US20130148320A1

公开(公告)日：2013-06-13

申请号：US13742922

申请日：2013-01-16

Applicant: Bruno Lefevre ,  Jean-Yves Moreno ,  Christian Schwartz

Inventor： Bruno Lefevre ,  Jean-Yves Moreno ,  Christian Schwartz

IPC: H05K1/18

CPC classification number: H05K13/00 ,  B23K3/047 ,  H05K1/181 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/3494 ,  H05K13/0465 ,  H05K2201/10515 ,  H05K2201/10848 ,  H05K2203/1115 ,  H05K2203/1476 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53174

Abstract: An electronic module includes a board with a printed circuit, at least one component of a first type soldered to the board, and at least one component of a second type. The component of the second type extends above the at least one component of the first type. The at least one component of the first type is placed at least partially between the at least one component of the second type and the board and the at least one component of the second type includes a plurality of pads soldered to the board.

Abstract translation: 电子模块包括具有印刷电路的板，焊接到板的第一类型的至少一个部件和第二类型的至少一个部件。 第二类型的部件在第一类型的至少一个部件的上方延伸。 第一类型的至少一个部件至少部分地放置在第二类型的至少一个部件和板之间，并且第二类型的至少一个部件包括焊接到板的多个焊盘。

公开(公告)号：US20110241819A1

公开(公告)日：2011-10-06

申请号：US13164315

申请日：2011-06-20

Applicant: Joseph Szwarc ,  Dany Mazliah ,  Makio Sato ,  Toru Okamoto

Inventor： Joseph Szwarc ,  Dany Mazliah ,  Makio Sato ,  Toru Okamoto

IPC: H01C1/034

CPC classification number: H01C1/14 ,  H01C1/144 ,  H01C7/003 ,  H01C17/006 ,  H01C17/28 ,  H05K3/3426 ,  H05K2201/10651 ,  H05K2201/10848 ,  Y02P70/613 ,  Y10T29/49082

Abstract: A chip resistor having first and second opposite ends includes a rigid insulated substrate having a top surface and an opposite bottom surface, a first electrically conductive termination pad and a second electrically conductive termination pad, both termination pads on the top surface of the rigid insulated substrate, a layer of resistive material between the first and second electrically conductive termination pads, and a first and a second flexible lead, each made of an electrically conductive metal with a solder enhancing coating. The first flexible lead attached and electrically connected to the first electrically conductive termination pad and the second flexible lead attached and electrically connected to the second electrically conductive termination pad. Each of the flexible leads has a plurality of lead sections facilitating bending around the end of the chip resistor.

Abstract translation: 具有第一和第二相对端的芯片电阻器包括具有顶表面和相对底表面的刚性绝缘基板，第一导电终端焊盘和第二导电终端焊盘，刚性绝缘基板的顶表面上的两个端接焊盘 ，在第一和第二导电终端焊盘之间的电阻材料层，以及每个由具有焊料增强涂层的导电金属制成的第一和第二柔性引线。 第一柔性引线附接并电连接到第一导电终端焊盘和第二柔性引线，并且电连接到第二导电终端焊盘。 每个柔性引线具有多个引线部分，便于围绕芯片电阻器的端部弯曲。

公开(公告)号：US20110111609A1

公开(公告)日：2011-05-12

申请号：US12913882

申请日：2010-10-28

Applicant: Hideki GOTO

Inventor： Hideki GOTO

IPC: H01R12/00 ,  H05K1/11

CPC classification number: H01R13/03 ,  H01R12/585 ,  H01R43/16 ,  H05K3/308 ,  H05K2201/10189 ,  H05K2201/10848 ,  H05K2201/10863

Abstract: A printed circuit board terminal includes a rectangular metal wire rod having a substantially rectangle cross-section. One longitudinal end portion of the printed circuit board terminal includes an insertion portion that is configured to be inserted into a through hole provided in a printed circuit board and soldered. A conducting metal plated layer is provided on an entire surface of the rectangular metal wire rod. One marginal portion of the insertion portion, which faces a long side direction of the rectangle cross-section, is removed to reduce a dimension in the long side direction corresponding to a width direction.

Abstract translation: 印刷电路板端子包括具有大致矩形横截面的矩形金属线材。 印刷电路板端子的一个纵向端部包括插入部，该插入部被配置为插入设置在印刷电路板中的通孔中并被焊接。 导电金属镀层设置在矩形金属线材的整个表面上。 移除面向矩形横截面的长边方向的插入部分的一个边缘部分，以减小对应于宽度方向的长边方向的尺寸。

公开(公告)号：US20110051389A1

公开(公告)日：2011-03-03

申请号：US12843346

申请日：2010-07-26

Applicant: Hideki GOTO

Inventor： Hideki GOTO

IPC: H01R12/30 ,  H01B5/00 ,  H05K1/14 ,  H05K1/11

CPC classification number: H05K3/308 ,  H01R12/58 ,  H01R43/16 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/10303 ,  H05K2201/10848

Abstract: A board terminal includes a metal wire and concave portions formed on peripheral surfaces along the length of the wire. The metal wire is cut to a predetermined length, and the concave portions are formed by pressing the peripheral surfaces of the wire at intermediate portions along the length thereof.

Abstract translation: 板端子包括金属线和形成在沿线的长度的周边表面上的凹部。 将金属丝切割成预定长度，并且通过在其长度的中间部分处按压线的外周表面形成凹部。

公开(公告)号：US20110008936A1

公开(公告)日：2011-01-13

申请号：US12885654

申请日：2010-09-20

Applicant: John TELLKAMP

Inventor： John TELLKAMP

IPC: H01L21/56

CPC classification number: H01L23/49548 ,  H01L21/4828 ,  H01L21/4842 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/10848 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012

Abstract: A packaged surface-mount semiconductor device has the outer, un-encapsulated lead segments structured in five adjoining portions: The first portion protrudes from the encapsulation about horizontally; the second portion forms a convex bend downwardly; the third portion is approximately straight downwardly; the fourth portion forms a concave bend upwardly; and the fifth portion is straight horizontally. Each segment has across the width a first groove in the third portion, either on the bottom surface or on the top surface. Preferably, the groove is about 2 leadframe thicknesses vertically over the bottom surface of the fifth lead portion. When stamped, the groove may have an angular outline about 5 and 50 μm deep; when etched, the groove may have an approximately semicircular outline about 50 to 125 μm deep. A second groove may be located in the second segment portion; a third groove may be located in the transition region from the third to the fourth segment portions.

Abstract translation: 封装的表面贴装半导体器件具有构造在五个相邻部分中的外部未封装引线段：第一部分围绕水平从封装突出; 第二部分向下形成凸起的弯曲部分; 第三部分大致直线向下; 第四部分向上形成凹弯; 第五部分是水平的。 每个段在宽度上具有第三部分中的第一凹槽，无论是在底表面上还是在顶表面上。 优选地，凹槽在垂直于第五引线部分的底表面上的约2个引线框厚度。 当冲压时，凹槽可以具有约5和50μm深的角轮廓; 当蚀刻时，凹槽可以具有约50至125μm深的近似半圆形轮廓。 第二槽可以位于第二段部分中; 第三凹槽可以位于从第三分段部分到第四分段部分的过渡区域中。

公开(公告)号：US07841859B2

公开(公告)日：2010-11-30

申请号：US12229012

申请日：2008-08-18

Applicant: Fang-Chu Liao ,  Chun-Yi Chang

Inventor： Fang-Chu Liao ,  Chun-Yi Chang

IPC: H01R12/00

CPC classification number: H01R12/707 ,  H01R12/716 ,  H05K3/3426 ,  H05K2201/10325 ,  H05K2201/10818 ,  H05K2201/10848 ,  Y02P70/613

Abstract: A socket, for electrically connecting an IC package and a printed circuit board, comprises an insulative housing and a plurality of contacts received in the insulative housing. The insulative housing has an opening in a center thereof, a solder pad is received in the opening and has a soldering board which is soldered to the printed circuit board to enhance a mechanical connection between the socket and the printed circuit board.

Abstract translation: 用于电连接IC封装和印刷电路板的插座包括绝缘壳体和容纳在绝缘壳体中的多个触点。 绝缘壳体在其中心具有开口，焊盘被容纳在开口中，并且具有焊接到印刷电路板的焊接板，以增强插座和印刷电路板之间的机械连接。

公开(公告)号：US07709947B2

公开(公告)日：2010-05-04

申请号：US11763150

申请日：2007-06-14

Applicant: Jun Ishikawa

Inventor： Jun Ishikawa

IPC: H01L23/48

CPC classification number: H01L25/072 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49109 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/30107 ,  H01L2924/351 ,  H05K1/0306 ,  H05K3/328 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10848 ,  H05K2203/0285 ,  H01L2924/00 ,  H01L2224/45099

Abstract: The first external electrode has a main body portion a part of which is buried in a side wall of a case and joining portions protruding from an end of the main body portion toward the inside of the case. Each joining portion of the first external electrode is formed to have a thickness smaller than that of the main body portion, and an end portion of each joining portion is directly joined onto a wiring pattern of the insulating substrate through ultrasonic joining. Therefore, a load and ultrasonic vibration necessary for joining the joining portion onto the wiring pattern can be suppressed, which makes it possible to directly join the first external electrode onto the wiring pattern of the insulating substrate without damaging an insulating member of the insulating substrate.

Abstract translation: 第一外部电极具有主体部分，其一部分被埋在壳体的侧壁中，并且从主体部分的端部朝向壳体的内部突出的接合部分。 第一外部电极的每个接合部分形成为具有比主体部分的厚度小的厚度，并且每个接合部分的端部通过超声波接合直接接合到绝缘基板的布线图案上。 因此，可以抑制将接合部分接合到布线图案上所需的负载和超声波振动，这使得可以在不损坏绝缘基板的绝缘构件的情况下将第一外部电极直接接合到绝缘基板的布线图案上。

公开(公告)号：US20090068864A1

公开(公告)日：2009-03-12

申请号：US12222321

申请日：2008-08-07

Applicant: Takayoshi Honda ,  Minoru Hozuka

Inventor： Takayoshi Honda ,  Minoru Hozuka

IPC: H01R12/00

CPC classification number: H05K3/3447 ,  H01R12/57 ,  H01R12/58 ,  H01R12/724 ,  H01R43/0256 ,  H05K1/116 ,  H05K2201/09381 ,  H05K2201/10189 ,  H05K2201/10787 ,  H05K2201/1084 ,  H05K2201/10848 ,  H05K2201/10856 ,  H05K2201/10871 ,  H05K2203/1178

Abstract: An electronic device includes a printed circuit board and an electronic element having a terminal. The terminal has a surface section and an insertion section. The printed circuit board includes a through hole extending from a first surface to a second surface of the printed circuit board, a surface land disposed on the first surface, and an insertion land integrally disposed on a sidewall of the through hole and on a periphery around the through hole. The surface section is coupled with the surface land through a solder. The insertion section is disposed in the through hole and is coupled with the insertion land through the solder. The surface section has a recess part and a portion of recess part is disposed so as to be axially aligned with a portion of the through hole.

Abstract translation: 电子设备包括印刷电路板和具有端子的电子元件。 端子具有表面部分和插入部分。 印刷电路板包括从印刷电路板的第一表面延伸到第二表面的通孔，设置在第一表面上的表面焊盘，以及一体地设置在通孔的侧壁上和周围的周边的插入槽 通孔。 表面部分通过焊料与表面焊盘耦合。 插入部设置在通孔中，并通过焊料与插入平台联接。 表面部分具有凹部，凹部的一部分设置成与通孔的一部分轴向对齐。

公开(公告)号：US20060089019A1

公开(公告)日：2006-04-27

申请号：US11244163

申请日：2005-10-06

Applicant: Tomohiro Mitani

Inventor： Tomohiro Mitani

IPC: H05K1/00

CPC classification number: G01C19/5628 ,  H05K3/308 ,  H05K2201/10151 ,  H05K2201/10757 ,  H05K2201/10848

Abstract: An angular velocity sensor includes a tuning fork unit; a base block provided with a terminal for outputting an output signal from the tuning fork unit to the exterior; a cover for housing the tuning fork unit in a space defined by combination with the base block; a circuit board for fixing the terminal on the base block, the circuit board being provided with a processing circuit for processing the output signal from the tuning fork unit; and a casing for housing the base block, the cover, and the circuit board therein, wherein the terminal on the base block is fixed to the circuit board, with a clearance being defined by the base block and the circuit board, the terminal on the base block in the clearance has a flexure portion, and the flexure portion absorbs a vibration of a high frequency applied from the exterior.

Abstract translation: 角速度传感器包括音叉单元; 基部块，设置有用于将来自音叉单元的输出信号输出到外部的端子; 用于将音叉单元容纳在与基座组合定义的空间中的盖子; 用于将所述端子固定在所述基座上的电路板，所述电路板设置有用于处理来自音叉单元的输出信号的处理电路; 以及用于将基座，盖和电路板容纳在其中的壳体，其中基座上的端子固定到电路板，间隙由基座和电路板限定，端子在 间隙中的基块具有挠曲部分，并且挠曲部分吸收从外部施加的高频振动。