摘要:
An acoustic wave element of the present disclosures has a piezoelectric substrate and an acoustic wave resonator S1 on a main surface of the piezoelectric substrate. The acoustic wave resonator S1 is one being divided into a first IDT electrode and a second IDT electrode which are electrically connected to the first IDT electrode. The first IDT electrode includes a first comb-shaped electrode on the signal input side and a second comb-shaped electrode on the signal output side. The second IDT electrode includes a third comb-shaped electrode on the signal input side and a fourth comb-shaped electrode on the signal output side. The direction of arrangement of the third comb-shaped electrode and the fourth comb-shaped electrode from the third comb-shaped electrode toward the fourth comb-shaped electrode is different from the direction of arrangement from the first comb-shaped electrode toward the second comb-shaped electrode.
摘要:
In an elastic wave device, a first electrode structure and a second electrode structure are provided on a piezoelectric substrate. The first electrode structure and the second electrode structure define first and second elastic wave element portions, respectively. A support frame on the piezoelectric substrate surrounds the first elastic wave element portion and the second elastic wave element portion. The support frame includes a dividing wall portion that divides the first elastic wave element portion and the second elastic wave element portion. A conductive shield electrode is provided in a groove provided in the dividing wall portion.
摘要:
An acoustic wave element of the present disclosures has a piezoelectric substrate and an acoustic wave resonator S1 on a main surface of the piezoelectric substrate. The acoustic wave resonator S1 is one being divided into a first IDT electrode and a second IDT electrode which are electrically connected to the first IDT electrode. The first IDT electrode includes a first comb-shaped electrode on the signal input side and a second comb-shaped electrode on the signal output side. The second IDT electrode includes a third comb-shaped electrode on the signal input side and a fourth comb-shaped electrode on the signal output side. The direction of arrangement of the third comb-shaped electrode and the fourth comb-shaped electrode from the third comb-shaped electrode toward the fourth comb-shaped electrode is different from the direction of arrangement from the first comb-shaped electrode toward the second comb-shaped electrode.
摘要:
An SAW filter and a duplexer excellent in electrical characteristics will be provided. An SAW filter has a piezoelectric substrate 40, a surface acoustic wave element 10 having a first IDT electrode 1 on the piezoelectric substrate 40, a first signal line 31 electrically connected to the first IDT electrode 1, and a ring-shaped reference potential line 9 which has a first intersecting portion intersecting with the first signal line 31 through an insulation member 41 and surrounds the surface acoustic wave element 10.
摘要:
An electronic device includes: a wiring substrate; a plurality of device chips that are flip-chip mounted on an upper surface of the wiring substrate through bumps, have gaps which expose the bumps between the device chips and the upper surface of the wiring substrate, and include at least one device chip that has a substrate having a thermal expansion coefficient more than a thermal expansion coefficient of the wiring substrate; a junction substrate that is joined to the plurality of device chips, and has a thermal expansion coefficient equal to or less than the thermal expansion coefficient of the substrate included in the at least one device chip; and a sealer that covers the junction substrate, and seals the plurality of device chips.
摘要:
To provide a receiving side filter of a duplexer and a duplexer capable of preventing a leakage of an electric field and a magnetic field to the outside. In a receiving side filter having a longitudinal mode resonator type filter including cross finger electrodes and reflectors respectively formed on a piezoelectric substrate and an unbalanced input signal path and balanced output ports respectively provided on an input side and on an output side of the longitudinal mode resonator type filter, and used on a receiving side of a duplexer, a shield electrode connected to a ground electrode side of the cross finger electrode is disposed to surround a periphery of the receiving side filter so that an electric field and a magnetic field leaked to the outside from the receiving side filter are short-circuited by the shield electrode.
摘要:
An SAW filter and a duplexer excellent in electrical characteristics will be provided. An SAW filter has a piezoelectric substrate 40, a surface acoustic wave element 10 having a first IDT electrode 1 on the piezoelectric substrate 40, a first signal line 31 electrically connected to the first IDT electrode 1, and a ring-shaped reference potential line 9 which has a first intersecting portion intersecting with the first signal line 31 through an insulation member 41 and surrounds the surface acoustic wave element 10.
摘要:
An acoustic wave filter device has a balance-unbalance conversion function and has an increased out-of-band attenuation. The acoustic wave filter device includes a 5-IDT-type longitudinally coupled resonator-type acoustic wave filter unit including IDTs that are connected between an unbalanced terminal and first and second balanced terminals, and the IDTs and are connected to the first and second balanced terminals, respectively, that is arranged between the unbalanced terminal and the first and second balanced terminals. A second ground wiring that connects the end portions of the unbalanced-side IDT on the side connected to the ground potential to a ground terminal is separated from a first ground wiring. The second ground wiring includes first and second branched wiring portions, and the first and second branched wiring portions are arranged so as to sandwich an area in which the IDTs are provided.
摘要:
In a fitting region for a SAW filter which includes langasite as its piezoelectric element, there are included an input side terminal electrode and an output side terminal electrode which are connected to an input terminal and to an output terminal of the SAW filter. To each of the terminal electrodes, at a position which is separated by just a predetermined distance from the fitting region of the SAW filter, there is connected a micro strip line which extends in mutually opposite directions along a direction which is parallel to the transmission direction of a frequency signal within the SAW filter. A slit is provided in the fitting region of the SAW filter and extends in a direction which intersects the transmission direction of the frequency signal within the SAW filter. A plurality of through holes are provided in the printed substrate and electrically connect together its surface and its rear surface which is grounded. Furthermore, there is provided a protective member which has a conductive surface and which is in contact with the surface of said filter, and said conductive surface of said protective member which is in contact with the surface of said filter is set so as to be of the same size as the surface of said filter, or so as to be smaller than it.
摘要:
An exemplary system and method for providing differential adjustment of the height of a multilayer substrate in localized areas for improved Q-factor performance of RF devices is disclosed as comprising inter alia: a multilayer substrate (200); an RF component (210) embedded in the substrate (200); a surface mounted component (220); and an RF shield (260) disposed next to the surface mounted component (220), wherein the height of the shield (260) does not extend substantially beyond the height of the surface mounted component (220). Disclosed features and specifications may be variously controlled, configured, adapted or otherwise optionally modified to further improve or otherwise optimize Q, RF performance and/or material characteristics. Exemplary embodiments of the present invention representatively provide for high-performance, high-quality RF devices that may be readily incorporated with existing technologies for the improvement of frequency response, device package form factors, weights and/or other manufacturing, device or material performance metrics.