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公开(公告)号:US20180287269A1
公开(公告)日:2018-10-04
申请号:US15869532
申请日:2018-01-12
申请人: LOTES CO., LTD
发明人: Ted Ju
CPC分类号: H01R4/027 , H01R12/57 , H01R12/7076 , H01R12/714 , H01R12/716 , H01R13/2407 , H01R13/2442 , H01R43/02 , H01R43/0221 , H01R43/16 , H05K3/3436 , H05K2201/10189 , H05K2201/10984 , H05K2203/041
摘要: An electrical connector for electrically connecting a chip module to a circuit board, includes an insulation body having multiple receiving holes vertically running through the insulation body, multiple terminals respectively accommodated in the receiving holes, and multiple metal members not in contact with the chip module. Each metal member and the corresponding terminal are accommodated in a same receiving hole. Each metal member and the corresponding terminal clamp and fix a solder ball together, so that the solder ball is stably fixed by the terminal, thereby greatly reducing gaps between terminals on a strip, so that the terminals do not need to be designed by skipping gaps. When the terminals are assembled into a same row of receiving holes, the insertion of the terminals into the same row of receiving holes may be completed in one time.
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公开(公告)号:US10063002B2
公开(公告)日:2018-08-28
申请号:US15074915
申请日:2016-03-18
申请人: Deako, Inc.
IPC分类号: H05K5/02 , H02G3/08 , H01R13/447 , H05B37/02 , G06F3/041 , H05K5/00 , H05K5/03 , H02G3/12 , H02G3/16 , H01R12/72 , H01R13/24 , H01R13/627 , H01R24/62 , H01R107/00
CPC分类号: H01R13/447 , G06F3/041 , H01R12/724 , H01R13/2407 , H01R13/6275 , H01R24/62 , H01R2107/00 , H02G3/08 , H02G3/12 , H02G3/16 , H05B37/0209 , H05B37/0272 , H05K5/0004 , H05K5/0017 , H05K5/0221 , H05K5/0256 , H05K5/03
摘要: A network includes a first device control assembly and at least one second device control assembly. The first device control assembly is electrically connected to a power distribution panel. The first device control assembly is further configured to regulate a load. The at least one second device control assembly is electrically connected to a power distribution panel. The first device control assembly is in data communication with the at least one second device control assembly. The first device control assembly regulating the load based on the data communication from the at least one second device control assembly.
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公开(公告)号:US20180226738A1
公开(公告)日:2018-08-09
申请号:US15942975
申请日:2018-04-02
发明人: Byunghoon KO , Hyungwoo LEE
IPC分类号: H01R13/24 , H01R13/627 , H01R13/62 , H01R12/78 , H01R13/52
CPC分类号: H01R13/2407 , H01R12/78 , H01R13/5219 , H01R13/62 , H01R13/6271 , H01R13/6278
摘要: A connector assembly includes a first connector body, a first elastic layer disposed on the first connector, a first electrode disposed on the first elastic layer, a second connector body, and a second electrode disposed on the second connector, wherein the first elastic layer is configured to provide a compressive force to the first electrode when the first connector body engages the second connector body.
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公开(公告)号:US20180205033A1
公开(公告)日:2018-07-19
申请号:US15792050
申请日:2017-10-24
申请人: Intel Corporation
发明人: Douglas G. Bennett
IPC分类号: H01L51/52 , H01R12/71 , H01L51/56 , H05K1/02 , H01L23/00 , H01R12/52 , H01R4/48 , H01L27/32 , H01R13/24 , H05K3/32 , H01R12/57
CPC分类号: H01L51/52 , H01L24/72 , H01L27/32 , H01L51/56 , H01R4/48 , H01R12/52 , H01R12/57 , H01R12/718 , H01R13/2407 , H01R13/6485 , H01R2101/00 , H05K1/0215 , H05K3/325 , H05K2201/0311
摘要: Generally, this disclosure provides systems, devices and methods for improved electrical coupling of multiple ground planes of a device. The device may include a plurality of ground planes and an electrically conductive ground clip. The ground clip may include a base portion configured to secure the ground clip to the device and a plurality of spring fingers. Each of the spring fingers may be configured to contact and electrically couple to one of the plurality of ground planes, wherein the ground clip is to provide a conduction path between each of the spring fingers. One of the spring fingers may pass through an opening or cut-through in a first ground plane to contact a second ground plane. The device may be a mobile communication or computing platform.
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公开(公告)号:US20180198234A1
公开(公告)日:2018-07-12
申请号:US15854915
申请日:2017-12-27
发明人: Toru Takane
IPC分类号: H01R13/631 , H01R13/405 , H01R13/24
CPC分类号: H01R13/6315 , H01R12/716 , H01R12/91 , H01R13/2407 , H01R13/405
摘要: To reduce the displacement load of a spring portion in order to improve the workability of insertion and extraction of a movable connector. A spring portion has an upper piece portion and a lower piece portion having a linear shape, and is formed in such a square wave shape that an outer vertical piece portion having a linear portion extends from a first end of the upper piece portion, a central vertical piece portion having a linear shape and connected to a first end of the lower piece portion extends from a second end of the upper piece portion, and an inner vertical piece portion having a linear shape extends from a second end of the lower piece portion.
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公开(公告)号:US09985368B2
公开(公告)日:2018-05-29
申请号:US15392480
申请日:2016-12-28
申请人: Molex, LLC
发明人: Jun Deng , Masahiro Sakano , Cheng-Bing Qiu
IPC分类号: H01R12/71 , H01R13/24 , H01R105/00
CPC分类号: H01R12/714 , H01R13/2407 , H01R13/2435 , H01R2105/00
摘要: An electrical connector comprises an insulative housing and a plurality of conductive terminals. The terminals are respectively provided in grooves of the housing. Each terminal has a portion fixed to the housing, an upper elastic portion extending from a top end of the fixed portion and a lower elastic portion extending from a bottom end of the fixed portion. The upper portion has a first arm extending from the fixed portion, a first contact section extending from the first arm, extending out of a top surface of the housing and bending, and a second arm extending from the first section, and a distal end of the second arm abuts against abutted structures in the corresponding groove when the first section is pressed down.
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公开(公告)号:US09979150B2
公开(公告)日:2018-05-22
申请号:US15368562
申请日:2016-12-02
发明人: Soongeol Hwang , Hyunguen Iy
CPC分类号: H01R33/74 , H01R12/526 , H01R12/58 , H01R12/7076 , H01R12/716 , H01R13/2407 , H01R13/2492 , H01R2201/20
摘要: A socket pin for electrically connecting a semiconductor substrate to a test substrate, comprising: a pin head; a pin body configured to support the pin head; and a length adjusting part provided below the pin body; wherein: the length adjusting part comprises at least a portion protruding from the pin body and a resilient structure; and the length adjusting part is movable to change a length of the portion protruding from the pin body as the resilient structure distorts.
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公开(公告)号:US09861133B2
公开(公告)日:2018-01-09
申请号:US14583684
申请日:2014-12-27
发明人: Yonghai Li , Zhongli Xu , Yonglu Guo , Jianhua Weng , Yansheng Zhang
CPC分类号: A24F47/008 , H01R13/2407 , H05B3/06
摘要: An electronic cigarette includes an atomizer and a battery pack. A pluggable connecting means is provided between the atomizer and the battery pack. The pluggable connecting means is designed as an elastic snap connection or a detachable clip means so that the atomizer and the battery pack can be connected together pluggably to prevent the threaded connection.
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公开(公告)号:US09847592B2
公开(公告)日:2017-12-19
申请号:US15384731
申请日:2016-12-20
申请人: DENSO CORPORATION
发明人: Satoshi Hino
IPC分类号: H01R13/24 , H01R13/428 , G01M15/10 , H01R13/405 , H01R13/33
CPC分类号: H01R13/2407 , G01M15/104 , H01R13/2464 , H01R13/33 , H01R13/405 , H01R13/428
摘要: A sensor includes contact springs placed in contact with electrode terminals on major surfaces of a sensor device. At least one of the contact springs includes a spring contact portion, a spring holding portion, a spring bent portion, and a spring connecting portion. The spring contact portion contacts an outer surface of one of the electrode terminals. The spring holding portion is turned from the spring contact portion and extends outside the spring contact portion so as to overlap the spring contact portion in the contacting direction. The spring bent portion is bent inwardly from the spring holding portion and extends at a given angle to the contacting direction. The spring connecting portion is bent from the spring bent portion and extends in the axial direction of the sensor. Such a structure enables the contact spring to be reduced in size and thickness without sacrificing a required mechanical strength thereof.
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公开(公告)号:US09807909B1
公开(公告)日:2017-10-31
申请号:US15506540
申请日:2015-08-27
申请人: ENPLAS CORPORATION
发明人: Shin Kobayashi
IPC分类号: H05K7/20 , H05K7/10 , H01R12/50 , H01R13/10 , H01R13/627 , H01R13/24 , H01R12/57 , H01R13/635 , H01R13/652 , H01R4/50 , H01R33/76 , H01L23/34
CPC分类号: H05K7/2049 , G01R1/0458 , G01R1/0466 , G01R1/0483 , H01L23/34 , H01L23/367 , H01L23/4093 , H01R4/5066 , H01R12/57 , H01R13/10 , H01R13/2407 , H01R13/6278 , H01R13/635 , H01R13/652 , H01R23/6806 , H01R33/76 , H05K7/10
摘要: A socket for an electric component includes a socket body in which a contact pin is provided in a housing part and a cover member provided so as to be rotatable with respect to the socket body. The cover member has a cover member body and a heat slug in contact with an electric component. The heat slug is configured so as to move downward and press the electric component by being pressed from above by a cooling head in a state in which the cover member is closed. In a state in which the electric component is housed in the housing part, a restricting mechanism allows the downward movement of the heat slug, whereas in a state in which the electric component is not housed in the housing part, the restricting mechanism prevents the downward movement of the heat slug.
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