公开(公告)号：US20150271920A1

公开(公告)日：2015-09-24

申请号：US14220913

申请日：2014-03-20

Applicant: QUALCOMM Incorporated

Inventor： Daeik Daniel KIM ,  Jonghae KIM ,  Chengjie ZUO ,  Changhan Hobie YUN ,  Mario Francisco VELEZ ,  Robert Paul MIKULKA

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/30 ,  H05K1/03 ,  H05K1/18

CPC classification number: H05K3/303 ,  H01L23/48 ,  H01L23/5385 ,  H01L23/645 ,  H01L2924/0002 ,  H01L2924/19101 ,  H05K1/0243 ,  H05K1/0306 ,  H05K1/111 ,  H05K1/141 ,  H05K1/144 ,  H05K1/165 ,  H05K1/18 ,  H05K3/3436 ,  H05K3/368 ,  H05K3/4007 ,  H05K3/4015 ,  H05K2201/1003 ,  H05K2201/10477 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/041 ,  H05K2203/1316 ,  Y10T29/4902 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  H01L2924/00

Abstract: Systems and methods relate to a semiconductor package comprising a first substrate or a 2D passive-on-glass (POG) structure with a passive component and a first set of one or more package pads formed on a face of a glass substrate. The semiconductor package also includes a second or laminate substrate with a second set of one or more package pads formed on a face of the second or laminate substrate. Solder balls are dropped, configured to contact the first set of one or more package pads with the second set of one or more package pads, wherein the first substrate or the 2D POG structure is placed face-up on the face of the second or laminate substrate. A printed circuit board (PCB) can be coupled to a bottom side of the second or laminate substrate.

Abstract translation: 系统和方法涉及包括第一衬底或2D无源玻璃（POG）结构的半导体封装，其具有无源部件和形成在玻璃衬底的表面上的一个或多个封装焊盘的第一组。 半导体封装还包括具有第二组一个或多个封装焊盘的第二或层压衬底，其形成在第二层压衬底的表面上。 焊球被落下，被配置为使第一组一个或多个封装焊盘与第二组一个或多个封装焊盘接触，其中第一基板或2D POG结构朝上放置在第二或层压板的表面上 基质。 印刷电路板（PCB）可以耦合到第二或层压基板的底侧。

公开(公告)号：US20140231996A1

公开(公告)日：2014-08-21

申请号：US14349653

申请日：2012-10-03

Applicant: CANON KABUSHIKI KAISHA

Inventor： Yoshitomo Fujisawa

IPC: H01L23/00

CPC classification number: H01L25/105 ,  H01L21/4867 ,  H01L23/485 ,  H01L23/488 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49883 ,  H01L2224/32225 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/0002 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19101 ,  H01L2924/3511 ,  H01L2924/37001 ,  H05K1/0271 ,  H05K1/09 ,  H05K3/3484 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2203/0425 ,  H01L2924/0001

Abstract: The printed circuit board (100) includes the interposer (2) where the semiconductor element (1) is mounted and the electrode pad (8) is formed on one surface, the printed wiring board (3) where the electrode pad (9) is formed on one surface facing the interposer (2), and the joint material (70) for bonding the electrode pads (8) and (9). The joint material (70) includes the solder layer (60) formed by the solder material (11) and the metal layers (50), (50) provided to the electrode pads (8) and (9). Each metal layer (50) includes the metal particle aggregate (10) in which metal particles are integrated with voids and is formed by filling the voids in the metal particle aggregate (10) with melted solder material (11). It is possible to ensure the height of the solder, improve reliability of the bonding, and downsize the semiconductor device by using such joint material.

Abstract translation: 印刷电路板（100）包括其中安装半导体元件（1）并且电极焊盘（8）形成在一个表面上的插入器（2），其中电极焊盘（9）是印刷电路板 形成在面向插入件（2）的一个表面上，以及用于接合电极焊盘（8）和（9）的接合材料（70）。 接合材料（70）包括由焊料（11）形成的焊料层（60）和设置在电极焊盘（8）和（9）上的金属层（50），（50）。 每个金属层（50）包括其中金属颗粒与空隙一体化的金属颗粒聚集体（10），并且通过用熔化的焊料材料（11）填充金属颗粒聚集体（10）中的空隙而形成。 可以确保焊料的高度，提高接合的可靠性，并且可以通过使用这种接合材料来减小半导体器件的尺寸。

公开(公告)号：US08084300B1

公开(公告)日：2011-12-27

申请号：US12953588

申请日：2010-11-24

Applicant: Romarico S. San Antonio ,  Michael H. McKerreghan ,  Anang Subagio ,  Allan C. Toriaga ,  Lenny Christina Gultom

Inventor： Romarico S. San Antonio ,  Michael H. McKerreghan ,  Anang Subagio ,  Allan C. Toriaga ,  Lenny Christina Gultom

IPC: H01L21/82

CPC classification number: H01L23/552 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6836 ,  H01L23/3121 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2221/68331 ,  H01L2221/68336 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/19101 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45147 ,  H01L2924/00015 ,  H01L2224/05599

Abstract: A method for manufacturing a semiconductor device package to provide RF shielding. The device is mounted on a laminated substrate having conducting pads on its top surface. A molding compound covers the substrate top surface and encapsulates the devices. The substrate is disposed on a tape; the molding compound and the substrate are cut through, forming package units separated by the saw cut width and exposing a portion of a conducting pad. In an embodiment, the tape is stretched to widen the gap between package units. A conductive shield is applied to cover each package unit and to make electrical contact with the exposed conducting pad portion, thereby connecting to a ground trace beneath the device and providing RF shielding for the device. A single-unit molding process may be used, in which the conducting pad is exposed during and after molding.

Abstract translation: 一种用于制造半导体器件封装以提供RF屏蔽的方法。 该装置安装在其顶表面上具有导电垫的层压基板上。 模塑料覆盖衬底顶表面并封装器件。 基板设置在带上; 切割模塑料和基材，形成由锯切宽度分开的包装单元并暴露导电垫的一部分。 在一个实施例中，带被拉伸以加宽包装单元之间的间隙。 施加导电屏蔽以覆盖每个封装单元并且与暴露的导电焊盘部分电接触，从而连接到器件下方的接地迹线并为器件提供RF屏蔽。 可以使用单组分成型工艺，其中在模制期间和之后导电焊盘露出。

公开(公告)号：US20110304016A1

公开(公告)日：2011-12-15

申请号：US13154565

申请日：2011-06-07

Applicant: Junichi NAKAMURA ,  Kentaro Kaneko ,  Shunichiro Matsumoto

Inventor： Junichi NAKAMURA ,  Kentaro Kaneko ,  Shunichiro Matsumoto

IPC: H01L29/02 ,  H01L23/48 ,  H01L21/28

CPC classification number: H01L23/13 ,  H01L21/4857 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/642 ,  H01L24/16 ,  H01L24/73 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/814 ,  H01L2924/1205 ,  H01L2924/1207 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/18161 ,  H01L2924/19101 ,  H01L2924/19105 ,  H05K1/111 ,  H05K3/244 ,  H05K3/284 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2203/0369 ,  H05K2203/0376 ,  H05K2203/308

Abstract: A wiring board includes a structure in which a plurality of wiring layers are stacked with insulating layers interposed therebetween, a plurality of pads for mounting an electronic component, the pads being formed on an outermost insulating layer on one surface side of the structure and exposed to the surface of the outermost insulating layer, and a recessed portion formed at a place corresponding to a mounting area for the electronic component. The recessed portion is formed in the outermost insulating layer at an area between the pads to which electrode terminals of the electronic component to be mounted are to be connected, respectively.

Abstract translation: 布线基板包括多个布线层层叠有绝缘层的结构，多个用于安装电子部件的焊盘，该焊盘形成在该结构的一个表面侧上的最外侧的绝缘层上并暴露于 最外层绝缘层的表面和形成在与电子部件的安装区域对应的位置的凹部。 凹陷部分分别形成在要连接的电子部件的电极端子的焊盘之间的区域中的最外层绝缘层中。