公开(公告)号：US09536299B2

公开(公告)日：2017-01-03

申请号：US14542430

申请日：2014-11-14

Applicant: KLA-Tencor Corporation

Inventor： Allen Park

IPC: G06T7/00 ,  H01L21/67

CPC classification number: G06T7/001 ,  G06T2207/30148 ,  H01L21/67288

Abstract: Methods and systems for detecting defects on a wafer are provided. One method includes acquiring output for a wafer generated by an inspection system. Different dies are printed on the wafer with different process conditions. The different process conditions correspond to different failure modes for the wafer. The method also includes comparing the output generated for a first of the different dies printed with the different process conditions corresponding to a first of the different failure modes with the output generated for a second of the different dies printed with the different process conditions corresponding to a second of the different failure modes opposite to the first of the different failure modes. In addition, the method includes detecting defects on the wafer based on results of the comparing step.

Abstract translation: 提供了用于检测晶片上的缺陷的方法和系统。 一种方法包括获取由检查系统产生的晶片的输出。 在不同的工艺条件下在晶片上印刷不同的模具。 不同的工艺条件对应于晶片的不同故障模式。 该方法还包括将针对不同工艺条件印刷的不同模具中的第一种不同的不同模具产生的输出与对应于不同工艺条件的不同工艺条件相对应地印刷在不同模具中的第二种模具 与第一种不同故障模式相反的不同故障模式的第二种。 此外，该方法包括基于比较步骤的结果检测晶片上的缺陷。

公开(公告)号：US09535010B2

公开(公告)日：2017-01-03

申请号：US14709390

申请日：2015-05-11

Applicant: KLA-Tencor Corporation

Inventor： Rohan Gosain ,  Somit Joshi

IPC: G01N21/00 ,  G01N21/88 ,  G06T7/00 ,  G01N21/95 ,  H01J37/22 ,  G01N23/225 ,  H01L21/66

CPC classification number: G01N21/8851 ,  G01N21/9501 ,  G01N23/2251 ,  G01N2223/418 ,  G01N2223/6466 ,  G01N2223/66 ,  G06T7/001 ,  G06T2207/30148 ,  H01J37/222 ,  H01J2237/063 ,  H01J2237/24592 ,  H01L22/12 ,  H01L22/20

Abstract: Various embodiments for generating a defect sample for electron beam review are provided. One method includes combining, on a defect-by-defect basis, one or more first attributes for defects determined by optical inspection of a wafer on which the defects were detected with one or more second attributes for the defects determined by optical review of the wafer thereby generating combined attributes for the defects. The method also includes separating the defects into bins based on the combined attributes for the defects. The bins correspond to different defect classifications. In addition, the method includes sampling one or more of the defects for the electron beam review based on the bins into which the defects have been separated thereby generating a defect review sample for the electron beam review.

Abstract translation: 提供了用于产生用于电子束检查的缺陷样本的各种实施例。 一种方法包括在缺陷缺陷的基础上组合一个或多个第一属性，用于通过对其上检测到缺陷的晶片进行光学检查而确定的缺陷，所述缺陷用于通过晶片的光学审查确定的缺陷的一个或多个第二属性 从而为缺陷生成组合属性。 该方法还包括基于缺陷的组合属性将缺陷分离成箱体。 箱对应于不同的缺陷分类。 此外，该方法包括基于已经分离缺陷的箱体对用于电子束检查的一个或多个缺陷进行采样，从而产生用于电子束检查的缺陷评估样本。

公开(公告)号：US09430743B2

公开(公告)日：2016-08-30

申请号：US14637242

申请日：2015-03-03

Applicant: KLA-Tencor Corporation

Inventor： Martin Plihal

IPC: G06T7/00 ,  G06N99/00 ,  G06N5/02

CPC classification number: G06N99/005 ,  G06N5/025 ,  G06T7/001 ,  G06T2207/10061 ,  G06T2207/20081 ,  G06T2207/30148

Abstract: Methods and systems for classifying defects detected on a wafer are provided. One method includes inputting information for defects detected on a wafer into each of at least two defect classifiers included in a composite defect classifier. Such a method also includes, for at least one of the defects that is assigned to two or more bins in the composite defect classifier, determining a bin for the at least one of the defects based on a rank assigned to the two or more bins. The rank is assigned to the two or more bins based on one or more characteristics determined for the two or more bins, and the one or more characteristics are determined based on a comparison of predetermined defect classifications for defects in a training set and defect classifications determined for the defects in the training set by the at least two defect classifiers.

Abstract translation: 提供了用于分类在晶片上检测到的缺陷的方法和系统。 一种方法包括将在晶片上检测到的缺陷的信息输入到复合缺陷分类器中包括的至少两个缺陷分类器中的每一个中。 这种方法还包括对于分配给复合缺陷分类器中的两个或更多个箱的至少一个缺陷，基于分配给两个或多个箱的等级来确定所述至少一个缺陷的仓。 基于为两个或多个箱确定的一个或多个特性将等级分配给两个或更多个箱，并且基于针对训练集中的缺陷的预定缺陷分类和确定的缺陷分类的比较来确定一个或多个特性 对于由至少两个缺陷分类器设置的训练中的缺陷。

公开(公告)号：US09377416B2

公开(公告)日：2016-06-28

申请号：US14709427

申请日：2015-05-11

Applicant: KLA-Tencor Corporation

Inventor： Ivan Maleev ,  Venkata Kode

IPC: G01N21/00 ,  G01N21/95 ,  G01N21/55 ,  G01N21/47

CPC classification number: G01N21/9503 ,  G01N21/47 ,  G01N21/55 ,  G01N2201/025 ,  G01N2201/061

Abstract: Methods and systems for determining wafer inspection coordinates for fixed location(s) on a wafer are provided. One system includes an illumination subsystem configured to direct light to a spot on an edge of a wafer. The spot extends beyond the edge of the wafer. The system also includes a stage that rotates the wafer thereby causing the spot to be scanned over the edge of the wafer. The system also includes a detector configured to detect light from the spot while the spot is being scanned over the edge and to generate output responsive thereto. The system further includes a computer processor configured to determine wafer inspection coordinates of two or more locations on the edge of the wafer based on the output and to determine wafer inspection coordinates of fixed location(s) on the wafer based on the wafer inspection coordinates of the two or more locations on the edge.

Abstract translation: 提供了用于确定晶片上固定位置的晶片检查坐标的方法和系统。 一个系统包括被配置为将光引导到晶片边缘上的点的照明子系统。 斑点延伸超过晶片的边缘。 该系统还包括使晶片旋转的台，从而使光斑在晶片的边缘上扫描。 该系统还包括检测器，其被配置为在斑点被扫描在边缘上时检测来自斑点的光并且响应于此产生输出。 该系统还包括计算机处理器，其被配置为基于输出来确定晶片边缘上的两个或更多个位置的晶片检查坐标，并且基于晶片的晶片检查坐标来确定晶片上固定位置的晶片检查坐标 边缘上的两个或多个位置。

公开(公告)号：US09355440B1

公开(公告)日：2016-05-31

申请号：US13649080

申请日：2012-10-10

Applicant: KLA-Tencor Corporation

Inventor： Haiguang Chen ,  Michael D. Kirk ,  Stephen Biellak ,  Jaydeep Sinha

IPC: G06T7/00 ,  G01N21/88

CPC classification number: G06T7/0012 ,  G01N21/8851 ,  G01N21/95623 ,  G01N2021/8887 ,  G06K9/4633 ,  G06K2209/19 ,  G06T7/0004 ,  G06T7/60 ,  G06T2207/20056 ,  G06T2207/20061 ,  G06T2207/30148

Abstract: Methods and systems for detection of selected defects in relatively noisy inspection data are provided. One method includes applying a spatial filter algorithm to inspection data acquired across an area on a substrate to determine a first portion of the inspection data that has a higher probability of being a selected type of defect than a second portion of the inspection data. The selected type of defect includes a non-point defect. The inspection data is generated by combining two or more raw inspection data corresponding to substantially the same locations on the substrate. The method also includes generating a two-dimensional map illustrating the first portion of the inspection data. The method further includes searching the two-dimensional map for an event that has spatial characteristics that approximately match spatial characteristics of the selected type of defect and determining if the event corresponds to a defect having the selected type.

Abstract translation: 提供了用于检测相对噪声检查数据中选定缺陷的方法和系统。 一种方法包括将空间滤波器算法应用于跨越衬底上的区域获取的数据，以确定检查数据的第一部分与检查数据的第二部分相比具有较高选择类型的缺陷概率。 所选择的缺陷类型包括非点缺陷。 通过组合对应于基板上基本上相同的位置的两个或更多个原始检查数据来生成检查数据。 该方法还包括生成示出检查数据的第一部分的二维映射。 该方法还包括搜索具有近似匹配所选类型的缺陷的空间特征的空间特征的事件的二维地图，并且确定该事件是否对应于具有所选类型的缺陷。

公开(公告)号：US09293298B2

公开(公告)日：2016-03-22

申请号：US14528941

申请日：2014-10-30

Applicant: KLA-Tencor Corporation

Inventor： Jan A. Lauber

IPC: H01J37/26 ,  G01N23/22 ,  G01N23/00 ,  G01N21/00

CPC classification number: H01J37/261 ,  H01J2237/2817 ,  H01L22/12 ,  H01L22/20

Abstract: Various embodiments for classifying defects detected on a wafer are provided. One method includes acquiring an electron beam image generated by a defect review tool for a location of a defect detected on a wafer by a wafer inspection tool. The method also includes determining a classification of the defect based on at least the electron beam image and without input from a user. The method may also include feeding back the classification results to the wafer inspection tool and optimizing the parameters of the tool to maximize sensitivity to the defects of interest.

Abstract translation: 提供了用于分类在晶片上检测到的缺陷的各种实施例。 一种方法包括获取由缺陷检查工具生成的电子束图像，用于通过晶片检查工具在晶片上检测到的缺陷的位置。 该方法还包括至少基于电子束图像确定缺陷的分类，并且不需要来自用户的输入。 该方法还可以包括将分类结果反馈到晶片检查工具并优化工具的参数以使对感兴趣缺陷的敏感度最大化。

公开(公告)号：US09291575B2

公开(公告)日：2016-03-22

申请号：US14530805

申请日：2014-11-02

Applicant: KLA-Tencor Corporation

Inventor： Guoheng Zhao ,  Jenn-Kuen Leong ,  Mehdi Vaez-Iravani

IPC: G01J4/00 ,  G01N21/95 ,  G01N21/88 ,  G01N21/21 ,  G01N21/47 ,  H01L21/66

CPC classification number: G01N21/9501 ,  G01N21/21 ,  G01N21/47 ,  G01N21/8806 ,  G01N2201/06113 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Systems and methods for inspecting a wafer are provided. One system includes an illumination subsystem configured to illuminate the wafer; a collection subsystem configured to collect light scattered from the wafer and to preserve the polarization of the scattered light; an optical element configured to separate the scattered light collected in different segments of the collection numerical aperture of the collection subsystem, where the optical element is positioned at a Fourier plane or a conjugate of the Fourier plane of the collection subsystem; a polarizing element configured to separate the scattered light in one of the different segments into different portions of the scattered light based on polarization; and a detector configured to detect one of the different portions of the scattered light and to generate output responsive to the detected light, which is used to detect defects on the wafer.

Abstract translation: 提供了用于检查晶片的系统和方法。 一个系统包括配置成照亮晶片的照明子系统; 收集子系统，被配置为收集从晶片散射的光并保持散射光的偏振; 光学元件，被配置为将收集在收集子系统的收集数值孔径的不同段中的散射光分离，其中所述光学元件位于所述收集子系统的傅立叶平面或所述傅立叶平面的共轭处; 偏振元件，被配置为基于极化将所述不同段中的一个中的散射光分离成所述散射光的不同部分; 以及检测器，被配置为检测散射光的不同部分中的一个，并且响应于检测到的光而产生输出，所述检测光用于检测晶片上的缺陷。

公开(公告)号：US09183624B2

公开(公告)日：2015-11-10

申请号：US14303602

申请日：2014-06-13

Applicant: KLA-Tencor Corporation

Inventor： Laurent Karsenti ,  Brian Duffy

IPC: G06K9/00 ,  G06T7/00

CPC classification number: G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148

Abstract: Methods and systems for detecting defects on a wafer are provided. One method includes creating a searchable database for a design for a wafer, which includes assigning values to different portions of the design based on patterns in the different portions of the design and storing the assigned values in the searchable database. Different portions of the design having substantially the same patterns are assigned the same values in the searchable database. The searchable database is configured such that searching of the database can be synchronized with generation of output for the wafer by one or more detectors of a wafer inspection system. Therefore, as the wafer is being scanned, design information for the output can be determined as fast as the output is generated, which enables multiple, desirable design based inspection capabilities.

Abstract translation: 提供了用于检测晶片上的缺陷的方法和系统。 一种方法包括创建用于晶片设计的可搜索数据库，其包括基于设计的不同部分中的图案将值设计到设计的不同部分，并将所分配的值存储在可搜索的数据库中。 具有基本上相同图案的设计的不同部分在可搜索数据库中被分配相同的值。 可搜索数据库被配置为使得可以通过晶片检查系统的一个或多个检测器与数据库的搜索同步生成晶片的输出。 因此，当正在扫描晶片时，可以确定输出的设计信息与产生的输出一样快，这样可以实现多种基于设计的检测能力。

公开(公告)号：US09134254B2

公开(公告)日：2015-09-15

申请号：US13830539

申请日：2013-03-14

Applicant: KLA-Tencor Corporation

Inventor： Vijayakumar Ramachandran

IPC: G06F17/50 ,  G01N21/95

CPC classification number: G01N21/9501

Abstract: Systems and methods for determining a position of output of an inspection system in design data space are provided. One method includes merging more than one feature in design data for a wafer into a single feature that has a periphery that encompasses all of the features that are merged. The method also includes storing information for the single feature without the design data for the features that are merged. The information includes a position of the single feature in design data space. The method further includes aligning output of an inspection system for the wafer to the information for the single feature such that positions of the output in the design data space can be determined based on the position of the single feature in the design data space.

Abstract translation: 提供了用于确定设计数据空间中的检查系统的输出位置的系统和方法。 一种方法包括将用于晶片的设计数据中的多于一个特征合并成具有包含所合并的所有特征的周边的单个特征。 该方法还包括存储单个特征的信息，而不需要合并的特征的设计数据。 该信息包括设计数据空间中单个功能的位置。 该方法还包括将用于晶片的检查系统的输出与用于单个特征的信息对齐，使得可以基于设计数据空间中的单个特征的位置来确定设计数据空间中的输出的位置。

公开(公告)号：US08948495B2

公开(公告)日：2015-02-03

申请号：US13783291

申请日：2013-03-02

Applicant: KLA-Tencor Corporation

Inventor： Gino Marcuccilli ,  Amir Widmann ,  Ellis Chang ,  John Robinson ,  Allen Park

IPC: G06K9/00 ,  G06T7/00

CPC classification number: G06T7/0004 ,  G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148

Abstract: Methods for inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer are provided. One method includes acquiring images for multiple die printed on a wafer, each of which is printed by performing a double patterning lithography process on the wafer and which include two or more die printed at nominal values of overlay for the double patterning lithography process and one or more die printed at modulated values of the overlay; comparing the images acquired for the multiple die printed at the nominal values to the images acquired for the multiple die printed at the modulated values; and detecting defects in the multiple die printed at the modulated values based on results of the comparing step.

Abstract translation: 提供了检查晶片和/或预测在晶片上形成的器件的一个或多个特性的方法。 一种方法包括获取用于多个印刷在晶片上的图像，每个图像通过在晶片上执行双重图案化平版印刷工艺而被印刷，并且包括两个或更多个以双重图案化平版印刷工艺的覆盖的标称值印刷的模具，以及一个或 更多地以覆盖层的调制值打印; 将以标称值印刷的多个印模获得的图像与以调制值印刷的多个印模获得的图像进行比较; 并且基于比较步骤的结果检测以调制值印刷的多个印模中的缺陷。