Defect sampling for electron beam review based on defect attributes from optical inspection and optical review
    1.
    发明授权
    Defect sampling for electron beam review based on defect attributes from optical inspection and optical review 有权
    基于光学检查和光学检查的缺陷属性的电子束检查的缺陷采样

    公开(公告)号:US09535010B2

    公开(公告)日:2017-01-03

    申请号:US14709390

    申请日:2015-05-11

    Abstract: Various embodiments for generating a defect sample for electron beam review are provided. One method includes combining, on a defect-by-defect basis, one or more first attributes for defects determined by optical inspection of a wafer on which the defects were detected with one or more second attributes for the defects determined by optical review of the wafer thereby generating combined attributes for the defects. The method also includes separating the defects into bins based on the combined attributes for the defects. The bins correspond to different defect classifications. In addition, the method includes sampling one or more of the defects for the electron beam review based on the bins into which the defects have been separated thereby generating a defect review sample for the electron beam review.

    Abstract translation: 提供了用于产生用于电子束检查的缺陷样本的各种实施例。 一种方法包括在缺陷缺陷的基础上组合一个或多个第一属性,用于通过对其上检测到缺陷的晶片进行光学检查而确定的缺陷,所述缺陷用于通过晶片的光学审查确定的缺陷的一个或多个第二属性 从而为缺陷生成组合属性。 该方法还包括基于缺陷的组合属性将缺陷分离成箱体。 箱对应于不同的缺陷分类。 此外,该方法包括基于已经分离缺陷的箱体对用于电子束检查的一个或多个缺陷进行采样,从而产生用于电子束检查的缺陷评估样本。

    Defect Sampling for Electron Beam Review Based on Defect Attributes from Optical Inspection and Optical Review
    2.
    发明申请
    Defect Sampling for Electron Beam Review Based on Defect Attributes from Optical Inspection and Optical Review 有权
    基于光学检测和光学检查的缺陷属性的电子束检测缺陷采样

    公开(公告)号:US20150330912A1

    公开(公告)日:2015-11-19

    申请号:US14709390

    申请日:2015-05-11

    Abstract: Various embodiments for generating a defect sample for electron beam review are provided. One method includes combining, on a defect-by-defect basis, one or more first attributes for defects determined by optical inspection of a wafer on which the defects were detected with one or more second attributes for the defects determined by optical review of the wafer thereby generating combined attributes for the defects. The method also includes separating the defects into bins based on the combined attributes for the defects. The bins correspond to different defect classifications. In addition, the method includes sampling one or more of the defects for the electron beam review based on the bins into which the defects have been separated thereby generating a defect review sample for the electron beam review.

    Abstract translation: 提供了用于产生用于电子束检查的缺陷样本的各种实施例。 一种方法包括在缺陷缺陷的基础上组合一个或多个第一属性,用于通过对其上检测到缺陷的晶片进行光学检查而确定的缺陷,所述缺陷用于通过晶片的光学审查确定的缺陷的一个或多个第二属性 从而为缺陷生成组合属性。 该方法还包括基于缺陷的组合属性将缺陷分离成箱体。 箱对应于不同的缺陷分类。 此外,该方法包括基于已经分离缺陷的箱体对用于电子束检查的一个或多个缺陷进行采样,从而产生用于电子束检查的缺陷评估样本。

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