公开(公告)号：US10957631B2

公开(公告)日：2021-03-23

申请号：US16218102

申请日：2018-12-12

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Chung-Ming Cheng ,  Yuh-Harng Chien ,  Fu-Kang Lee ,  Chia-Yu Chang

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/28 ,  H01L21/48

Abstract: A leadframe comprising a plurality of leads, each of the plurality of leads having a proximal end and a distal end opposite the proximal end, the distal ends positioned along a linear axis. The leadframe further comprises a die pad closer to the proximal ends than the distal ends of the plurality of leads and including an edge positioned along a plane that intersects the linear axis at an angle less than 90 degrees.

公开(公告)号：US10573581B2

公开(公告)日：2020-02-25

申请号：US15280398

申请日：2016-09-29

Applicant: Texas Instruments Incorporated

Inventor： Chih-Chien Ho ,  Chung-Hao Lin ,  Yuh-Harng Chien

IPC: H01L23/495

Abstract: A leadframe has a peripheral frame. A die attach pad (DAP) is positioned inwardly and downwardly of the peripheral frame. Two spaced apart parallel arms engage one side of the DAP. In one embodiment the arms are portions of a U-shaped strap.

公开(公告)号：US20180090419A1

公开(公告)日：2018-03-29

申请号：US15280398

申请日：2016-09-29

Applicant: Texas Instruments Incorporated

Inventor： Chih-Chien Ho ,  Chung-Hao Lin ,  Yuh-Harng Chien

IPC: H01L23/495

Abstract: A leadframe has a peripheral frame. A die attach pad (DAP) is positioned inwardly and downwardly of the peripheral frame. Two spaced apart parallel arms engage one side of the DAP. In one embodiment the arms are portions of a U-shaped strap.

公开(公告)号：US11862538B2

公开(公告)日：2024-01-02

申请号：US17463124

申请日：2021-08-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Chung-Hao Lin ,  Hung-Yu Chou ,  Bo-Hsun Pan ,  Dong-Ren Peng ,  Pi-Chiang Huang ,  Yuh-Harng Chien

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49513 ,  H01L21/4825 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/4952 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2924/181

Abstract: In some examples a semiconductor chip package includes a conductive terminal. In addition, the semiconductor chip package includes a die pad including a top side and a recess extending into the top side. The die pad is downset relative to the conductive terminal. Further, the semiconductor ship package includes a semiconductor die positioned within the recess, wherein the semiconductor die has an outer perimeter, and a solder fillet engaged within the recess and with the outer perimeter of the semiconductor die. Still further, the semiconductor chip package includes a wire bond coupled to the semiconductor die and the conductive terminal, and a mold compound covering the conductive terminal, the wire bond, the die pad, and the semiconductor die.

公开(公告)号：US20210111103A1

公开(公告)日：2021-04-15

申请号：US16600615

申请日：2019-10-14

Applicant: Texas Instruments Incorporated

Inventor： Jason Chien ,  J K Ho ,  Yuh-Harng Chien

IPC: H01L23/495 ,  H01L23/498 ,  H01L23/00

Abstract: A packaged semiconductor device includes a leadframe including a finger pad(s) that is integrated, and spans a finger pad area including a width narrower than its length. A first portion of the finger pad area provides a die support area. A second portion of the finger pad area provides a wire bond area including first and second wire bond pads on a first and second side of the die support area. One of the wire bond pads further includes a lead terminal integrally connected. The IC die has a top side with bond pads and a back side having a non-electrically conductive die attach material attached to the die support area. Bond wires extend from the bond pads to the first and second wire bond pads. A mold compound encapsulates the packaged semiconductor device leaving exposed at least the lead terminal on a bottom side of the packaged semiconductor device.

公开(公告)号：US10811343B2

公开(公告)日：2020-10-20

申请号：US16253151

申请日：2019-01-21

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuh-Harng Chien ,  Chih-Chien Ho ,  Steven Su

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L21/56

Abstract: A leadframe includes a plurality of interconnected support members. A pair of die pads is connected to the support members and configured to receive a pair of dies electrically connected by at least one wire. A support bracket extends between the die pads and includes a surface for maintaining the at least one wire at a predetermined distance from the die pads during overmolding of the leadframe.

公开(公告)号：US10229868B2

公开(公告)日：2019-03-12

申请号：US15896971

申请日：2018-02-14

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuh-Harng Chien ,  Chih-Chien Ho ,  Steven Su

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L21/56

Abstract: A leadframe includes a plurality of interconnected support members. A pair of die pads is connected to the support members and configured to receive a pair of dies electrically connected by at least one wire. A support bracket extends between the die pads and includes a surface for maintaining the at least one wire at a predetermined distance from the die pads during overmolding of the leadframe.

公开(公告)号：US10121733B2

公开(公告)日：2018-11-06

申请号：US15447406

申请日：2017-03-02

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuh-Harng Chien ,  Chih-Chien Ho ,  Steven Su

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L21/56

Abstract: A leadframe includes a plurality of interconnected support members. A pair of die pads is connected to the support members and configured to receive a pair of dies electrically connected by at least one wire. A support bracket extends between the die pads and includes a surface for maintaining the at least one wire at a predetermined distance from the die pads during overmolding of the leadframe.

公开(公告)号：US20170194236A1

公开(公告)日：2017-07-06

申请号：US15447406

申请日：2017-03-02

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuh-Harng Chien ,  Chih-Chien Ho ,  Steven Su

IPC: H01L23/495 ,  H01L25/18 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/49541 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/49503 ,  H01L23/49551 ,  H01L23/49575 ,  H01L23/49861 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48137 ,  H01L2224/48138 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/17747 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A leadframe includes a plurality of interconnected support members. A pair of die pads is connected to the support members and configured to receive a pair of dies electrically connected by at least one wire. A support bracket extends between the die pads and includes a surface for maintaining the at least one wire at a predetermined distance from the die pads during overmolding of the leadframe.