Carrier film disposed on a mother substrate and method of manufacturing a semiconductor package

    公开(公告)号:US12243755B2

    公开(公告)日:2025-03-04

    申请号:US18237115

    申请日:2023-08-23

    Inventor: Taesung Kim

    Abstract: A carrier film for performing a semiconductor package process on a mother substrate including a multi-layer circuit, a mother substrate, and a method of manufacturing a semiconductor package, the carrier film including a base material layer having a predetermined stiffness; and an adhesive layer configured to attach the base material layer onto the mother substrate, the adhesive layer including a water soluble material, wherein the carrier film includes a plurality of openings passing therethrough from a top surface to a bottom surface thereof.

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