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    WINDOW MANAGEMENT METHOD AND ELECTRONIC DEVICE SUPPORTING THE SAME
    25.
    发明申请
    WINDOW MANAGEMENT METHOD AND ELECTRONIC DEVICE SUPPORTING THE SAME 审中-公开
    窗口管理方法和支持其的电子设备

    公开(公告)号：US20160062552A1

    公开(公告)日：2016-03-03

    申请号：US14835038

    申请日：2015-08-25

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hye Soon JEONG ,  Jun Ho LEE ,  Ji Hoon JEON ,  Kyung Hwan KIM ,  Dong Jeon KIM ,  Jin Wan AN ,  Dae Sik HWANG

    IPC: G06F3/0481 ,  G06F3/0484

    CPC classification number: G06F3/0481 ,  G06F3/0488 ,  G06F2203/04803

    Abstract: A window management method in an electronic device and an electronic device thereof are provided. The method includes receiving, by a controller, a user input event generated in association with a selection of an item displayed in a display area of a display; and outputting, to the display, by a display control module, a plurality of windows corresponding to the selected item and information indicating at least one output capable window corresponding to the selected item and available to be output in a specified form in a specified area.

    Abstract translation: 提供了一种电子设备中的窗口管理方法及其电子设备。 该方法包括由控制器接收与显示在显示器的显示区域中的项目的选择相关联地生成的用户输入事件; 并且通过显示控制模块向显示器输出与所选择的项目相对应的多个窗口，以及指示与所选项目相对应的可输出的至少一个可输出窗口的信息，并且可以在指定区域中以指定的形式输出。

    IMAGE FORMING APPARATUS
    26.
    发明申请
    IMAGE FORMING APPARATUS 有权
    图像形成装置

    公开(公告)号：US20140294453A1

    公开(公告)日：2014-10-02

    申请号：US14225986

    申请日：2014-03-26

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jeong Yong JU ,  Byeong Hwa ANH ,  Jun Ho LEE

    IPC: G03G15/01

    CPC classification number: G03G15/5054 ,  F16H31/001 ,  F16H35/18 ,  G03G15/1615 ,  G03G2215/00156

    Abstract: An image forming apparatus is provided. The image forming apparatus, in a case in which a toner on a transfer belt is checked through a sensing unit, is capable of preventing a rotation of a guide roller, which is configured to guide the transfer belt, by use of a regulation device, so that a check error occurring due to vibration of the guide roller is reduced. Thus, the toner on the transfer belt is checked with increased accuracy and precision.

    Abstract translation: 提供一种图像形成装置。 在通过感测单元检查转印带上的调色剂的情况下，图像形成装置能够通过使用调节装置来防止构造成引导转印带的引导辊的旋转， 使得由于导辊的振动而发生的检查误差降低。 因此，以更高的精度和精度检查转印带上的调色剂。

    IMAGE FORMING APPARATUS
    27.
    发明申请
    IMAGE FORMING APPARATUS 有权

    公开(公告)号：US20130108320A1

    公开(公告)日：2013-05-02

    申请号：US13661506

    申请日：2012-10-26

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jeong Yong JU ,  Byeong Hwa AHN ,  Jun Ho LEE

    IPC: G03G15/16

    CPC classification number: G03G21/1623 ,  G03G15/0189 ,  G03G21/1633 ,  G03G21/1638 ,  G03G2215/00544 ,  G03G2215/0132

    Abstract: An image forming apparatus including a side cover rotatably installed to open and close an opening provided at a body thereof while rotating, a first transfer unit to which a visible image of photoconductors of developing units is transferred, and a second transfer unit movably installed at the side cover to transfer the visible image to a printing medium, wherein the second transfer unit is provided at both sides thereof with a plurality of guide protrusions to perform a position restriction, and the body is provided at both sidewalls of inside thereof with a plurality of guide members to support the plurality of guide protrusions such that the second transfer unit is supported against both sidewalls of the inside of the body through the guide protrusion and the guide member, thereby reducing a reaction force applied to the side cover.

    SEMICONDUCTOR PACKAGE
    29.
    发明公开
    SEMICONDUCTOR PACKAGE 审中-公开

    公开(公告)号：US20240222241A1

    公开(公告)日：2024-07-04

    申请号：US18380361

    申请日：2023-10-16

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Ji Hyun LEE ,  Han Sung RYU ,  Jun Ho LEE

    IPC: H01L23/498 ,  H01L23/538 ,  H01L25/10

    CPC classification number: H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/5383 ,  H01L25/105 ,  H01L24/16 ,  H01L2224/16227

    Abstract: A semiconductor package includes a first substrate. Solder balls are disposed on a lower surface of the first substrate. A first semiconductor chip is on an upper surface of the first substrate. The solder balls include a first ball disposed in a first direction from a center of the first substrate and spaced apart from the center by a first distance. A second ball is disposed in a third direction from the center between the first and second directions and is spaced apart from the center by a second distance less than or equal to the first distance. A first pitch between the first ball and a first adjacent ball disposed immediately to an outer side in the first direction is less than a second pitch between the first ball and a second adjacent ball disposed immediately adjacent to an inner side in the first direction.

    SEMICONDUCTOR PACKAGE
    30.
    发明申请
    SEMICONDUCTOR PACKAGE 有权

    公开(公告)号：US20230047026A1

    公开(公告)日：2023-02-16

    申请号：US17867764

    申请日：2022-07-19

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Seung Soo HA ,  Ju-Youn CHOI ,  In Won O ,  Jun Ho LEE

    IPC: H01L23/498 ,  H01L25/16

    Abstract: A semiconductor package includes: a first wiring structure including a first wiring layer, and a second wiring layer disposed on the first wiring layer, and connected to a first connecting structure placed disposed on the first wiring layer; a first semiconductor chip disposed on the first wiring structure and connected to the first wiring structure through a first connecting pad disposed on a first side of the first semiconductor chip; a second wiring structure disposed on the first semiconductor chip; and an insulating member disposed between the first and second wiring structures, wherein the first wiring structure further includes a first signal pattern that is electrically connected to the first connecting pad, and the first signal pattern redistributes the first connecting pad to the first connecting structure via the insulating member.

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