公开(公告)号：US11201863B2

公开(公告)日：2021-12-14

申请号：US16341849

申请日：2017-10-13

Applicant: Samsung Electronics Co., Ltd

Inventor： Ji Young Kim ,  Hakjoo Kim ,  Yong-Jun Park ,  Gwiho Lee ,  Ho-Dong Jwa ,  Wooyoung Choi

IPC: H04L29/06 ,  G06F1/16 ,  G06F21/35 ,  G06F21/31 ,  H04W12/06

Abstract: Various embodiments of the present invention relate to a method for managing a companion device, and an electronic device using the same, the electronic device comprising: a communication unit for connecting a communication channel with at least one first external electronic device; and at least one processor functionally connected with the communication unit, wherein the at least one processor requests, from the at least one first external electronic device, information (companion device authentication information) necessary for registering the at least one first external electronic device as a companion device of a second external electronic device, in response to the connection with the at least one first external electronic device, receives and stores the companion device authentication information, registers the electronic device as a companion device of the second external electronic device when the electronic device is connected with the second external electronic device, and transmits the stored companion device authentication information to the second external electronic device such that the at least one first external electronic device is registered as a companion device of the second external electronic device. Other various embodiments are possible.

公开(公告)号：US10832983B2

公开(公告)日：2020-11-10

申请号：US15673248

申请日：2017-08-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji Min Choi ,  Dong Ryul Lee ,  Ho Ouk Lee ,  Ji Young Kim ,  Chang Hyun Cho

IPC: H01L21/762 ,  H01L23/14 ,  H01L27/108

Abstract: A semiconductor device includes a substrate having a semiconductor layer. A trench is formed within the semiconductor layer. A filling insulating film is disposed within the trench. An insertion liner is disposed within the filling insulating film. The insertion liner is spaced apart from the semiconductor layer and extends along the bottom surface of the trench.

公开(公告)号：US10797509B2

公开(公告)日：2020-10-06

申请号：US16671776

申请日：2019-11-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yu Su Kim ,  Ji Young Kim ,  Se Ho Park ,  Woo Jin Jung ,  Young Joon Park ,  Jung Su Park

IPC: H02J7/00 ,  H02J7/04 ,  H02J50/80 ,  H02J9/00 ,  H02J50/12 ,  H02J7/02

Abstract: An electronic device is provided. The electronic device includes a power receiver (PRx) that includes a receiver coil for receiving a power signal from a wireless power transmitting device and a wireless charging integrated circuit (IC) for converting the power signal into electrical energy, a power management circuit that is electrically connected to the PRx and configured to charge a battery using the electrical energy, and a processor that is electrically connected with the PRx and the power management circuit. The processor activates a power hold mode (PHM) if a charging level of the battery is a fully charged level and controls auxiliary charging of the battery.

公开(公告)号：US10204910B2

公开(公告)日：2019-02-12

申请号：US15722085

申请日：2017-10-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jin A Kim ,  Sun Young Lee ,  Ji Young Kim ,  Chang Hyun Cho

IPC: H01L27/108 ,  H01L29/94 ,  H01L21/762 ,  H01L29/423

Abstract: A semiconductor device is provided. The provided semiconductor device may have enhanced reliability and operating characteristics. The semiconductor device includes a substrate, a device isolation film formed within the substrate, a first gate structure formed within the substrate, a recess formed on at least one side of the first gate structure and within the substrate and the device isolation film, the recess comprising an upper portion and a lower portion wherein the lower portion of the recess is formed within the substrate and the upper portion of the recess is formed across the substrate and the device isolation film, a buried contact filling the recess and an information storage electrically connected to the buried contact.

公开(公告)号：US10064778B2

公开(公告)日：2018-09-04

申请号：US14337684

申请日：2014-07-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyung-Won Moon ,  Ji Young Kim ,  Young-Bo Shim ,  Bok Man Lim

IPC: A61H1/02 ,  A61H3/00 ,  A61B5/103 ,  A61B5/11

Abstract: A walking assistance device may include at least one walking assistance unit configured to assist a user in walking; and/or a controller configured to control, based on a walk pattern of the user, the at least one walking assistance unit to produce torque only in at least one assistance period needing walking assistance in a walk cycle. A method of controlling walking assistance may include: calculating a walking assistance time using a difference between a start time and a termination time of an assistance period needing the walking assistance in a walk pattern; and/or assisting a user in walking when the assistance period begins, by producing torque for the walking assistance time.

公开(公告)号：US11626405B2

公开(公告)日：2023-04-11

申请号：US17201121

申请日：2021-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Hwan Kim ,  Ji Young Kim ,  Bong Soo Kim

IPC: H01L27/08 ,  H01L27/02 ,  H01L27/108 ,  H01L49/02

Abstract: A semiconductor device includes a plurality of lower electrode structures disposed on a substrate, and a supporter pattern disposed between pairs of lower electrode structures of the plurality of lower electrode structures. The semiconductor device further includes a capacitor dielectric layer disposed on surfaces of each of the plurality of lower electrode structures and the supporter pattern, and an upper electrode disposed on the capacitor dielectric layer. The plurality of lower electrode structures includes a first lower electrode and a second lower electrode disposed on the first lower electrode and having a cylindrical shape. The first lower electrode has a pillar shape. The first lower electrode includes an insulating core. The insulating core is disposed in the first lower electrode. An outer side surface of the first lower electrode and an outer side surface of the second lower electrode are coplanar.

公开(公告)号：US10971496B2

公开(公告)日：2021-04-06

申请号：US16409046

申请日：2019-05-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Hwan Kim ,  Ji Young Kim ,  Bong Soo Kim

IPC: H01L27/08 ,  H01L27/02 ,  H01L27/108 ,  H01L49/02

Abstract: A semiconductor device includes a plurality of lower electrode structures disposed on a substrate, and a supporter pattern disposed between pairs of lower electrode structures of the plurality of lower electrode structures. The semiconductor device further includes a capacitor dielectric layer disposed on surfaces of each of the plurality of lower electrode structures and the supporter pattern, and an upper electrode disposed on the capacitor dielectric layer. The plurality of lower electrode structures includes a first lower electrode and a second lower electrode disposed on the first lower electrode and having a cylindrical shape. The first lower electrode has a pillar shape. The first lower electrode includes an insulating core. The insulating core is disposed in the first lower electrode. An outer side surface of the first lower electrode and an outer side surface of the second lower electrode are coplanar.

公开(公告)号：US10204825B2

公开(公告)日：2019-02-12

申请号：US15667118

申请日：2017-08-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong Ryul Lee ,  Joong Chan Shin ,  Dong Jun Lee ,  Ho Ouk Lee ,  Ji Min Choi ,  Ji Young Kim ,  Chan Sic Yoon ,  Chang Hyun Cho

IPC: H01L21/3205 ,  H01L21/764 ,  H01L21/768 ,  H01L29/06 ,  H01L29/49 ,  H01L23/522

Abstract: A method for fabricating a semiconductor device includes providing a substrate including a cell region including a bit line structure, a bit line spacer and a lower electrode and a peripheral circuit region including first to third impurity regions, forming an interlayer insulating film on the peripheral circuit region, forming a first metal layer on the interlayer insulating film, forming a first trench and a second trench in the first metal layer between the first and second impurity regions, the second trench is disposed between the second and third impurity regions and exposes the interlayer insulating film, forming a first capping pattern on the first trench to form an air gap in the first trench, filling the second trench with a first insulating material, and forming, on the first metal layer, a contact connected to the third impurity region.

公开(公告)号：US20180166352A1

公开(公告)日：2018-06-14

申请号：US15673248

申请日：2017-08-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji Min Choi ,  Dong Ryul Lee ,  Ho Ouk Lee ,  Ji Young Kim ,  Chang Hyun Cho

IPC: H01L23/14 ,  H01L21/762

CPC classification number: H01L23/147 ,  H01L21/76205 ,  H01L21/76227 ,  H01L21/76229 ,  H01L27/10894

Abstract: A semiconductor device includes a substrate having a semiconductor layer. A trench is formed within the semiconductor layer. A filling insulating film is disposed within the trench. An insertion liner is disposed within the filling insulating film. The insertion liner is spaced apart from the semiconductor layer and extends along the bottom surface of the trench.

公开(公告)号：US20180109947A1

公开(公告)日：2018-04-19

申请号：US15783451

申请日：2017-10-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hakjoo Kim ,  Yong-Jun Park ,  Gwiho Lee ,  Ho-Dong Jwa ,  Ji Young Kim ,  Sangho Park ,  Hyunseung Lee ,  Wooyoung Choi

IPC: H04W12/06 ,  H04L29/06 ,  H04W12/04 ,  H04W12/08

Abstract: Disclosed are a method and an apparatus for connecting electronic devices based on biometric information without a certification server. An electronic device includes a wireless communication unit configured to perform wireless communication with an external device; a biometric recognition module; a memory; and a processor connected to the wireless communication unit, the biometric recognition module, and the memory. The processor is configured to register, in the external device, authentication information for authenticating the external device through the electronic device, establish a communication connection with the external device through the wireless communication unit, receive a request for authenticating the electronic device from the external device in response to the communication connection, acquire biometric information corresponding to a user of the electronic device using the biometric recognition module in response to the authentication request, perform device authentication for the user based on at least the biometric information, encrypt authentication information when the authentication is successfully performed, and transmit the encrypted authentication information to the external device.