Abstract:
A method of fabricating a semiconductor device comprises: forming an etch stop layer to cover sidewall and top surfaces of first and second dummy gate patterns on a substrate; and forming an interlayer insulating layer on the substrate and the etch stop layer. The interlayer insulating layer is planarized to expose the etch stop layer on the first and second dummy gate patterns, and the etch stop layer is etched to expose the top surfaces and upper sidewall surfaces of the first and second dummy gate patterns, thereby forming a groove between the interlayer insulating layer and the first and second dummy gate patterns. The dummy gate patterns are removed, and gate electrodes are formed in their places.
Abstract:
A clothes-treating apparatus includes: a housing including an accommodating space to accommodate clothes therein; and a plurality of air conditioning modules provided inside the housing and different in an air conditioning function from each other, wherein each of the plurality of air conditioning modules is provided to be switched over between an exposing status in which the air conditioning function is activated and a blocking status in which the air conditioning function is inactivated, and a first air conditioning module among the plurality of air conditioning modules is in the exposing status while a second air conditioning module is in the blocking status. Thus, the clothes-treating apparatus prevents the air conditioning functions of the plurality of air conditioning modules from being offset by each other, thereby improving the effects of the air conditioning functions and extending the life of each air conditioning module.
Abstract:
An interface circuit including: a first transmission circuit outputting a first signal to a transmission line via first transfer pads; and a second transmission circuit outputting a second signal to the transmission line via second transfer pads, the first transmission circuit includes a first termination resistor block including a switch and a first termination resistor connected between the first transfer pads, the second transmission circuit includes a second termination resistor block including a switch and a second termination resistor connected between the second transfer pads, and when the first transmission circuit outputs the first signal, the second termination resistor block detects the first signal, and when the first transmission circuit is in a low-power operation mode, the second termination resistor block disconnects the second termination resistor, and when the first transmission circuit is in a high-speed data transfer mode, the second termination resistor block connects the second termination resistor.
Abstract:
Embodiments of the inventive concepts provide a method of manufacturing a semiconductor device and a cleaning composition for an adhesive layer. The method includes preparing a semiconductor substrate to which an adhesive layer adheres, removing the adhesive layer from the semiconductor substrate, and applying a cleaning composition to the semiconductor substrate to remove a residue of the adhesive layer. The cleaning composition includes a solvent including a ketone compound and having a content that is equal to or greater than 40 wt % and less thaadminn 90 wt %, quaternary ammonium salt, and primary amine.
Abstract:
A clothes-treating apparatus includes: a housing including an accommodating space to accommodate clothes therein; and a plurality of air conditioning modules provided inside the housing and different in an air conditioning function from each other, wherein each of the plurality of air conditioning modules is provided to be switched over between an exposing status in which the air conditioning function is activated and a blocking status in which the air conditioning function is inactivated, and a first air conditioning module among the plurality of air conditioning modules is in the exposing status while a second air conditioning module is in the blocking status. Thus, the clothes-treating apparatus prevents the air conditioning functions of the plurality of air conditioning modules from being offset by each other, thereby improving the effects of the air conditioning functions and extending the life of each air conditioning module.
Abstract:
Embodiments of the inventive concepts provide a method of manufacturing a semiconductor device and a cleaning composition for an adhesive layer. The method includes preparing a semiconductor substrate to which an adhesive layer adheres, removing the adhesive layer from the semiconductor substrate, and applying a cleaning composition to the semiconductor substrate to remove a residue of the adhesive layer. The cleaning composition includes a solvent including a ketone compound and having a content that is equal to or greater than 40 wt % and less than 90 wt %, quaternary ammonium salt, and primary amine.
Abstract:
A method of compressing a texture includes receiving a texel block obtained by dividing texels forming a texture into units of blocks of texels, determining a block pattern of the texel block, and compressing the texel block based on the block pattern.