Electronic apparatus
    21.
    发明授权

    公开(公告)号:US11579741B2

    公开(公告)日:2023-02-14

    申请号:US17529679

    申请日:2021-11-18

    Abstract: An electronic apparatus includes a display module divided into a first non-folding area, a folding area foldable along an imaginary folding axis extending in a second direction crossing a first direction, and a second non-folding area, which are sequentially arranged in the first direction, and a sensing sensor including a first base layer disposed under the display module, first sensing coils disposed on the first base layer, second sensing coils insulated from the first sensing coils, and a first cover layer disposed between the first sensing coils and the second sensing coils. The first cover layer has a modulus less than a modulus of the first base layer.

    Electronic apparatus including sensing coil and manufacturing method of the same

    公开(公告)号:US11513653B2

    公开(公告)日:2022-11-29

    申请号:US17092709

    申请日:2020-11-09

    Abstract: An electronic apparatus includes a window, a display panel disposed on a lower surface of the window, and a digitizer disposed on a lower surface of the display panel. The digitizer includes a first photosensitive resin layer, a first sensing coil disposed on one surface of the first photosensitive resin layer, a second photosensitive resin layer disposed spaced apart from the first photosensitive resin layer, and a first adhesive layer disposed between the first photosensitive resin layer and the second photosensitive resin layer and which adheres the first photosensitive resin layer and the second photosensitive resin layer.

    Display device
    25.
    发明授权

    公开(公告)号:US11256377B2

    公开(公告)日:2022-02-22

    申请号:US17139769

    申请日:2020-12-31

    Abstract: A display device includes a display panel and a sensing panel disposed on the display panel. The sensing panel includes a first conductive layer disposed on a first surface of a base layer, a second conductive layer disposed on the first conductive layer, a first auxiliary conductive layer in a folding region on the same layer as the first conductive layer on the first surface of the base layer, a second auxiliary conductive layer in the folding region on the first auxiliary conductive layer and spaced apart from the second conductive layer, a third conductive layer disposed on a second surface of the base layer, and a fourth conductive layer disposed on the third conductive layer in first and second non-folding regions. The second auxiliary conductive layer is electrically connected to the third conductive layer via a contact hole passing through the first auxiliary conductive layer and the base layer.

    DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
    26.
    发明申请
    DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    显示装置及其制造方法

    公开(公告)号:US20160225792A1

    公开(公告)日:2016-08-04

    申请号:US14815772

    申请日:2015-07-31

    Abstract: A display device and a method of manufacturing the same are disclosed. In one aspect, the display device includes a display area formed over a substrate and configured to display an image, and a pad area formed over the substrate surrounding the display area and configured to provide an electrical signal to the display area. The pad area includes a first electrode layer formed over the substrate and electrically connected to the display area and a second electrode layer formed over the first electrode layer and electrically connected to the first electrode layer. The pad area also includes a first organic layer bonded to a portion of the second electrode layer at a first adhesion strength, a third electrode layer bonded to the first organic layer at a second adhesion strength and electrically connected to the second electrode layer, and a flexible PCB electrically connected to the third electrode layer.

    Abstract translation: 公开了一种显示装置及其制造方法。 一方面,显示装置包括形成在基板上并被配置为显示图像的显示区域,以及形成在显示区域周围的基板上的焊盘区域,并且被配置为向显示区域提供电信号。 焊盘区域包括形成在衬底上并电连接到显示区域的第一电极层和形成在第一电极层上并且电连接到第一电极层的第二电极层。 焊盘区域还包括以第一粘合强度结合到第二电极层的一部分的第一有机层,以第二粘合强度结合到第一有机层并电连接到第二电极层的第三电极层,以及 柔性PCB电连接到第三电极层。

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