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公开(公告)号：US20160118178A1
公开(公告)日：2016-04-28
申请号：US14981679
申请日：2015-12-28
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hwan Soo LEE , Hye Yeon CHA , Jung Min PARK , Kang Heon HUR , Moon Soo PARK
IPC: H01F27/24 , H01F27/29 , H01F27/255 , H01F27/28
CPC classification number: H01L28/10 , H01F27/24 , H01F27/255 , H01F27/2804 , H01F27/292
Abstract: Disclosed herein is a chip inductor. The chip inductor according to the present invention includes a substrate on which a trough-hole is formed, a conductive coil that is formed on the substrate, an upper resin composite magnetic layer that is filled to surround the conductive coil so that a core is formed on a center portion of the substrate, a lower resin composite magnetic layer that is formed on a bottom portion of the substrate, and an external electrode that is formed on both sides of the upper and lower resin composite magnetic layers.
Abstract translation: 这里公开了一种芯片电感器。 根据本发明的片式电感器包括形成有槽孔的基板，形成在基板上的导电线圈，被填充以包围导电线圈以形成芯的上部树脂复合磁性层 在基板的中心部分上，形成在基板的底部的下部树脂复合磁性层和形成在上部和下部树脂复合磁性层两侧的外部电极。
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公开(公告)号：US20150340149A1
公开(公告)日：2015-11-26
申请号：US14541552
申请日：2014-11-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dong Hwan LEE , Chan YOON , Hye Yeon CHA , Jin Woo HAN
CPC classification number: H01F27/2804 , H01F17/0013 , H01F27/24 , H01F27/292 , H01F2017/0066 , H01F2017/0073 , H01F2027/2809 , H05K1/111 , H05K1/165 , H05K1/181 , H05K3/241 , H05K2201/0347 , H05K2201/086 , H05K2201/09727 , H05K2201/09736 , H05K2201/098 , H05K2201/1003 , H05K2201/10636 , H05K2203/1476 , Y02P70/611
Abstract: A chip electronic component may include a magnetic material body including an insulating substrate and coil conductor patterns formed on at least one surface of the insulating substrate, and external electrodes disposed on both end portions of the magnetic material body so as to be connected to end portions of the coil conductor patterns, respectively. In a cross section of the magnetic material body in a length direction, a thickness of an innermost loop/section of the coil conductor patterns may be smaller than a thickness of the remaining loops/sections of the coil conductor pattern.
Abstract translation: 芯片电子部件可以包括：磁性材料体，包括绝缘基板和形成在绝缘基板的至少一个表面上的线圈导体图案;以及外部电极，设置在磁性材料体的两端部，以便连接到端部 的线圈导体图案。 在磁性材料体的长度方向的截面中，线圈导体图案的最内圈/截面的厚度可以小于线圈导体图案的剩余环/厚度。
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公开(公告)号：US20200098508A1
公开(公告)日：2020-03-26
申请号：US16294333
申请日：2019-03-06
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kwang Il PARK , Hye Yeon CHA , Young Sun KIM
Abstract: A coil component includes a body having one surface and another surface opposing each other in one direction, a plurality of walls each connecting the one surface to the other surface, and a coil portion disposed therein. A recess extends along at least portions of edges common to the one surface and to walls of the plurality of walls. A lower insulating layer is disposed in the recess and on the one surface. First and second external electrodes penetrate through the lower insulating layer, are spaced apart from each other on the one surface of the body, and are connected to the coil portion. A shielding layer is disposed on the other surface of the body and the plurality of walls of the body, and extends to the one surface of the body to be spaced apart from the first and second external electrodes.
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公开(公告)号：US20180158584A1
公开(公告)日：2018-06-07
申请号：US15665263
申请日：2017-07-31
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ho Sik PARK , Sang Jae LEE , Youn Soo SEO , Yong Sam LEE , Hye Yeon CHA , Jae Ha KIM
CPC classification number: H01F5/003 , H01F5/04 , H01F17/0013 , H01F41/041
Abstract: A coil component includes a body having a coil part disposed in the body. The coil part may include: a first coil pattern formed on one surface of the insulating layer; and a second coil pattern including an external pattern formed on the other surface of the insulating layer. The second coil pattern may further include an embedded pattern embedded in the insulating layer and the external pattern may be disposed on the embedded pattern. The coil component can have improved low direct current resistance characteristics and inductance.
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公开(公告)号：US20180148854A1
公开(公告)日：2018-05-31
申请号：US15881296
申请日：2018-01-26
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hye Yeon CHA , Dong Hwan LEE , Jung Hyuk JUNG , Chan Yoon , Hye Min Bang , Tae Young KIM
Abstract: There are provided a chip electronic component and a manufacturing method thereof, and more particularly, a chip electronic component having an internal coil structure capable of preventing the occurrence of short-circuits between coil portions and having a high aspect ratio (AR) by increasing a thickness of a coil as compared to a width of the coil, and a manufacturing method thereof.
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Patent Agency Ranking
公开(公告)号：US20180137975A1
公开(公告)日：2018-05-17
申请号：US15674202
申请日：2017-08-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Il Ho CHA , Sang Jae LEE , Ho Sik PARK , Hye Hun PARK , Kwang Jik LEE , Hye Yeon CHA , Jae Ha KIM
CPC classification number: H01F41/042 , H01F10/00 , H01F17/0006 , H01F17/0013 , H01F27/292 , H01F27/324 , H01F41/10 , H01F41/125 , H01F2017/002 , H01F2017/048
Abstract: A thin film-type inductor includes a body including a support member, a coil disposed. on at least one surface of the support member, and a filler embedding the support member on which the coil is disposed, and an external electrode disposed. on an external surface of the body. An insulating layer is not disposed on an edge portion of the support member and the edge portion is in direct contact with a filler. The insulating layer is only disposed on an upper surface of the coil to conform to a surface of the coil.
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公开(公告)号：US20180033542A1
公开(公告)日：2018-02-01
申请号：US15728161
申请日：2017-10-09
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Woon Chul CHOI , Sung Hyun KIM , Hye Yeon CHA
CPC classification number: H01F27/2804 , H01F17/0013 , H01F27/292 , H01F41/042
Abstract: An inductor may include: a body, and a first and a second external electrode formed on end surfaces of the body. The body may include a coil support layer, a conductive coil formed on at least one surface of the coil support layer, a lamination part formed in a gap of the conductive coil and on an upper surface thereof, an insulating coating part formed to enclose an overall surface of the conductive coil on which the lamination part is formed, and upper and lower cover layers covering the overall surface of the conductive coil on which the insulating coating part is formed.
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公开(公告)号：US20170200549A1
公开(公告)日：2017-07-13
申请号：US15470381
申请日：2017-03-27
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Moon Soo PARK , Ic Seob KIM , Hwan Soo LEE , Dong Hyeok CHOI , Hye Yeon CHA
IPC: H01F27/255 , H01F27/28
CPC classification number: H01F27/255 , F27D7/06 , H01F1/01 , H01F1/26 , H01F27/2804 , H01F27/292 , H01F41/046 , H01F41/14 , H01F41/16 , H01F2017/048 , Y10T29/4902
Abstract: Disclosed herein are a metal-polymer complex film for an inductor and a method for manufacturing an inductor, the inductor being manufactured by using the metal-polymer complex film for an inductor, including: a metal powder; and an amorphous epoxy resin, wherein the metal-polymer complex film is made in a film type by using a mixture where a weight ratio of the metal powder is 75˜98 wt %, so that a plurality of inductors can be simultaneously manufactured to thereby improve production efficiency and characteristic values of the inductor can be also improved.
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公开(公告)号：US20160329146A1
公开(公告)日：2016-11-10
申请号：US15215247
申请日：2016-07-20
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hwan-Soo LEE , Kang Heon HUR , Jung Min PARK , Hye Yeon CHA
IPC: H01F27/28 , H01F27/245 , H01F27/255 , H01F27/29
CPC classification number: H01F27/2804 , H01F17/0033 , H01F27/245 , H01F27/255 , H01F27/29 , H01F27/292 , H01F41/046 , H01F41/10 , Y10T29/4902
Abstract: There is provided a power inductor including: a lower substrate formed of a magnetic material; an inductor main body formed on an upper surface of the lower substrate; at least one coil portion including a conductive via and formed inside the inductor main body; and external electrodes formed at both ends of the inductor main body and electrically connected to the at least one coil portion.
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公开(公告)号：US20150270053A1
公开(公告)日：2015-09-24
申请号：US14485402
申请日：2014-09-12
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hye Yeon CHA , Dong Hwan LEE , Jung Hyuk JUNG , Chan YOON , Hye Min BANG , Tae Young KIM
CPC classification number: C25D7/001 , C25D5/02 , C25D5/10 , C25D5/16 , H01F17/0013 , H01F17/04 , H01F27/292 , H01F41/046
Abstract: There are provided a chip electronic component and a manufacturing method thereof, and more particularly, a chip electronic component having an internal coil structure capable of preventing the occurrence of short-circuits between coil portions and having a high aspect ratio (AR) by increasing a thickness of a coil as compared to a width of the coil, and a manufacturing method thereof.
Abstract translation: 提供了一种芯片电子部件及其制造方法，更具体地，涉及一种具有能够防止线圈部分之间发生短路并具有高纵横比（AR）的内部线圈结构的芯片电子部件，通过增加 与线圈的宽度相比，线圈的厚度及其制造方法。
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