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    OPTICAL ZOOM CAMERA MODULE AND ASSEMBLING METHOD THEREFOR
    23.
    发明申请
    OPTICAL ZOOM CAMERA MODULE AND ASSEMBLING METHOD THEREFOR 有权

    公开(公告)号：US20210382270A1

    公开(公告)日：2021-12-09

    申请号：US17284267

    申请日：2019-08-19

    Applicant: NINGBO SUNNY OPOTECH CO., LTD.

    Inventor： Mingzhu WANG ,  Takehiko TANAKA ,  Yinli FANG ,  Chunmei LIU

    IPC: G02B13/00 ,  G02B7/09 ,  G02B7/00 ,  G02B7/02 ,  G02B7/10

    Abstract: The present application provides an optical zoom camera module, including: at least two camera module components and glue material; each of the at least two camera module components has at least one lens group, and each lens group includes at least one lens, all of the lens groups of the at least two camera module components together constitute an imagable optical system, and wherein at least two of the lens groups are a movable lens group, and the at least two movable lens groups are respectively fixed with different motor carriers, so as to move separately under the driving of a motor; and the cured glue material fixes and supports the at least two camera module components, so that relative positions of the at least two camera modules are maintained at relative positions determined by an active alignment. The application also provides a corresponding method for assembling the optical zoom camera module. The present application can realize a stepless zoom; it is beneficial to improve the imaging quality of the zoom camera module; and it can reduce the production cost.

    SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR DEVICE BASED ON MOLDING PROCESS
    24.
    发明申请
    SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR DEVICE BASED ON MOLDING PROCESS 有权

    公开(公告)号：US20210313385A1

    公开(公告)日：2021-10-07

    申请号：US17352961

    申请日：2021-06-21

    Applicant: NINGBO SUNNY OPOTECH CO., LTD.

    Inventor： Mingzhu WANG ,  Bojie ZHAO ,  Takehiko TANAKA ,  Zhenyu CHEN ,  Heng JIANG ,  Nan GUO

    IPC: H01L27/146 ,  H01L21/02 ,  H01L23/06

    Abstract: The present invention provides a semiconductor packaging method and semiconductor device based on a molding process. In the packaging method, first, at least a portion of a compensation part is kept on at least a portion of a bonding region formed between a first adjoining surface of a semiconductor element and a second adjoining surface of a packaging component, to form a semi-finished product of a semiconductor device; then, during hardening of the packaging component, the compensation part is caused to undergo different degrees of deformation at different positions to compensate for a difference between a magnitude of deformation of the packaging component and a magnitude of deformation of the semiconductor element, so as to package the semiconductor element to form the semiconductor device. By means of the method, undesirable phenomena such as cracking and deformation of the surface of the semiconductor element can be avoided.

    OPTICAL LENS, IMAGING MODULE AND ASSEMBLY METHOD THEREOF
    26.
    发明申请
    OPTICAL LENS, IMAGING MODULE AND ASSEMBLY METHOD THEREOF 有权

    公开(公告)号：US20210173169A1

    公开(公告)日：2021-06-10

    申请号：US17179887

    申请日：2021-02-19

    Applicant: NINGBO SUNNY OPOTECH CO., LTD.

    Inventor： Takehiko TANAKA ,  Heng JIANG

    IPC: G02B7/02 ,  G02B7/00

    Abstract: The present disclosure provides an optical lens, which includes a first lens member, a second lens member and a first adhesive. The first lens member includes at least one first lens. The second lens member includes a second lens barrel and at least one second lens mounted in the second lens barrel. The at least one second lens and the at least one first lens together forms an imaging optical system. The second lens member has a second optical region and a second structural region surrounding the second optical region. The second structural region has a second top surface and the second top surface has a groove. The first adhesive locates in a first gap between the first lens member and the second lens member, and the first adhesive is accommodated in the groove. The first adhesive is adapted to flow in the groove when uncured.

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