Abstract:
The present invention provides an apparatus and method for detecting if a person has attempted to tamper with an integrated circuit (IC). The apparatus is located on the IC and comprises detection circuitry that detects a build up of electrical charge on the IC and disablement circuitry that disables the IC when the detection circuitry detects a build up of electrical charge on the IC. The method comprises detecting if a build up of electrical charge on the IC has occurred and disabling the IC when a build up of electrical charge on the IC has been detected.
Abstract:
Disclosed is a circuit for adjusting a voltage supplied to an IC by a power supply circuit that produces a regulated-output voltage based on an output-control signal generated by a resistive voltage divider. The circuit includes a PVT detector configured to generate an interface control signal and an interface circuit (i) connected to PVT detector and to the resistive voltage divider and (ii) configured to adjust its resistance in response to the interface control signal. Adjusting the resistance of the interface circuit causes the voltage of the output-control signal to be adjusted, thus causing the power supply circuit to adjust the regulated output voltage.
Abstract:
A mobile device is configured with electrical circuitry that causes the transmit channel electrical circuitry of the transmitter (Tx) of the mobile device to be electrically coupled to the receive channel electrical circuitry of the receiver (Rx) of the mobile device when one or more predetermined conditions occur. The electrical coupling of the transmit channel circuitry to the receive channel circuitry causes the Rx to be sufficiently damaged to render the mobile device nonoperational, thereby preventing further use of the mobile device. The one or more predetermined conditions correspond to conditions that indicate the mobile device has been lost or stolen and/or that an unauthorized user is attempting to use the mobile device in some manner.
Abstract:
In described embodiments, a thin film transistor (TFT) liquid crystal display (LCD) structure incorporates a white light emitting diode (LED) structure for backlighting. White LEDs are formed behind each TFT cell, allowing for display “black” as a function of a nematic layer, on the TFT substrate, while increasing intensity of the LED LCD backlight structure. A lens structure might be formed between the LEDs and the TFT substrate to reduce a number of LED sources for a given backlight intensity.
Abstract:
A mobile device is configured with electrical circuitry that causes the transmit channel electrical circuitry of the transmitter (Tx) of the mobile device to be electrically coupled to the receive channel electrical circuitry of the receiver (Rx) of the mobile device when one or more predetermined conditions occur. The electrical coupling of the transmit channel circuitry to the receive channel circuitry causes the Rx to be sufficiently damaged to render the mobile device nonoperational, thereby preventing further use of the mobile device. The one or more predetermined conditions correspond to conditions that indicate the mobile device has been lost or stolen and/or that an unauthorized user is attempting to use the mobile device in some manner.
Abstract:
A memory circuit includes an operational memory and a monitor circuit comprising a circuit element in the operational memory and/or a circuit element substantially identical to a corresponding circuit element in the operational memory. The monitor circuit is operative to measure at least one functional characteristic of the operational memory. A control circuit coupled to the monitor circuit is operative to generate a control signal which varies as a function of the measured characteristic of the operational memory. The memory circuit further includes a programmable voltage source coupled to the operational memory which is operative to generate at least a voltage and/or a current supplied to at least a portion of the operational memory which varies as a function of the control signal.
Abstract:
An integrated circuit device incorporating a metallurgical bond to enhance thermal conduction to a heat sink. In a semiconductor device, a surface of an integrated circuit die is metallurgically bonded to a surface of a heat sink. In an exemplary method of manufacturing the device, the upper surface of a package substrate includes an inner region and a peripheral region. The integrated circuit die is positioned over the substrate surface and a first surface of the integrated circuit die is placed in contact with the package substrate. A metallic layer is formed on a second opposing surface of the integrated circuit die. A preform is positioned on the metallic layer and a heat sink is positioned over the preform. A joint layer is formed with the preform, metallurgically bonding the heat sink to the second surface of the integrated circuit die.
Abstract:
A highly accurate tuning circuit for a tunable filter is provided which trims an RC time constant based on variances in both a formed capacitive component as well as variances in formed resistive components. A capacitor and resistor based tuning control circuit includes both a formed capacitor based tuning reference current generator and a formed resistor based tuning voltage reference generator. Each generates a voltage reference which is compared to the other to determine control signals for tuning a tunable resistive component forming the resistive portion of the RC time constant of the relevant filter. The resistive component is tuned by shorting selective resistors in the tunable resistive component. By tuning the RC time constant to the particular variances in capacitor and resistor components formed in the integrated circuit, the RC time constant of the tunable filter can be tuned to a desired absolute value within a tighter tolerance range than was previously available with conventional tuning circuits which provided tuning control based only on the variances of formed resistor elements.
Abstract:
A multifunction reset circuit including low power bandgap, a comparator, and an open drain buffer circuit--with the inclusion of four external components (three resistors and one capacitor) to provide undervoltage monitoring, power failure indicating, manual resetting and other reset control conditions to a single integrated circuit terminal, together with hysteresis tolerance.
Abstract:
Disclosed is a circuit for adjusting a voltage supplied to an IC by a power supply circuit that produces a regulated-output voltage based on an output-control signal generated by a resistive voltage divider. The circuit includes a PVT detector configured to generate an interface control signal and an interface circuit (i) connected to PVT detector and to the resistive voltage divider and (ii) configured to adjust its resistance in response to the interface control signal. Adjusting the resistance of the interface circuit causes the voltage of the output-control signal to be adjusted, thus causing the power supply circuit to adjust the regulated output voltage.