公开(公告)号：US09182358B2

公开(公告)日：2015-11-10

申请号：US13834662

申请日：2013-03-15

Applicant: KLA-Tencor Corporation

Inventor： Zhiwei Xu ,  Christian Wolters ,  Juergen Reich ,  Bret Whiteside ,  Guoheng Zhao ,  Jijen Vazhaeparambil ,  Stephen Biellak ,  Sam Shamouilian ,  Mehdi Vaez-Iravani

IPC: G01N21/00 ,  G01N21/95 ,  G01N21/956

CPC classification number: G01N21/9501 ,  G01N21/956

Abstract: The disclosure is directed to a system and method for inspecting a spinning sample by substantially simultaneously scanning multiple spots on a surface of the sample utilizing a plurality of illumination beams. Portions of illumination reflected, scattered, or radiated from respective spots on the surface of the sample are collected by at least one detector array. Information associated with at least one defect of the sample is determined by at least one computing system in communication with the detector array. According to various embodiments, at least one of scan pitch, spot size, spot separation, and spin rate is controlled to compensate pitch error due to tangential spot separation.

Abstract translation: 本公开涉及一种用于通过基本上同时使用多个照明光束扫描样品表面上的多个点来检查纺丝样品的系统和方法。 通过至少一个检测器阵列收集从样品表面上的各个点反射，散射或辐射的照射部分。 与样品的至少一个缺陷相关联的信息由与检测器阵列通信的至少一个计算系统确定。 根据各种实施例，控制扫描间距，光斑尺寸，光点分离和旋转速率中的至少一个以补偿由于切点分离引起的俯仰误差。

公开(公告)号：US20150055128A1

公开(公告)日：2015-02-26

申请号：US14532989

申请日：2014-11-04

Applicant: KLA-Tencor Corporation

Inventor： Christian Wolters ,  Juergen Reich

IPC: G01N21/95 ,  G01N21/956

CPC classification number: G01N21/9501 ,  G01N21/956 ,  G01N2201/06113 ,  G01N2201/103

Abstract: A surface scanning wafer inspection system with independently adjustable scan pitch and associated methods of operation are presented. The scan pitch may be adjusted independently from an illumination area on the surface of a wafer. In some embodiments, scan pitch is adjusted while the illumination area remains constant. For example, defect sensitivity is adjusted by adjusting the rate of translation of a wafer relative to the rate of rotation of the wafer without additional optical adjustments. In some examples, the scan pitch is adjusted to achieve a desired defect sensitivity over an entire wafer. In other examples, the scan pitch is adjusted during wafer inspection to optimize defect sensitivity and throughput. In other examples, the scan pitch is adjusted to maximize defect sensitivity within the damage limit of a wafer under inspection.

Abstract translation: 提出了具有独立可调的扫描间距和相关操作方法的表面扫描晶片检查系统。 可以独立于晶片表面上的照明区域来调整扫描间距。 在一些实施例中，在照明区域保持恒定的同时调整扫描间距。 例如，通过调整晶片相对于晶片的旋转速率的平移速率来调整缺陷灵敏度，而无需额外的光学调整。 在一些示例中，调整扫描间距以在整个晶片上实现期望的缺陷灵敏度。 在其他示例中，在晶片检查期间调整扫描间距以优化缺陷灵敏度和产量。 在其他示例中，调整扫描间距以使在检查的晶片的损伤极限内的缺陷灵敏度最大化。

公开(公告)号：US20140118729A1

公开(公告)日：2014-05-01

申请号：US13662626

申请日：2012-10-29

Applicant: KLA-Tencor Corporation

Inventor： Christian Wolters ,  Aleksey Petrenko ,  Kurt L. Haller ,  Juergen Reich ,  Zhiwei Xu ,  Stephen Biellak ,  George J. Kren

IPC: G01N21/95

CPC classification number: G01N21/8806 ,  F21V23/003 ,  G01N21/9501 ,  G01N2021/8835

Abstract: The disclosure is directed to a system and method of managing illumination energy applied to illuminated portions of a scanned wafer to mitigate illumination-induced damage without unnecessarily compromising SNR of an inspection system. The wafer may be rotated at a selected spin frequency for scanning wafer defects utilizing the inspection system. Illumination energy may be varied over at least one scanned region of the wafer as a function of radial distance of an illuminated portion from the center of the wafer and the selected spin frequency of the wafer. Illumination energy may be further applied constantly over one or more scanned regions of the wafer beyond a selected distance from the center of the wafer.

Abstract translation: 本公开涉及一种管理照射能量的系统和方法，所述照明能量施加到被扫描的晶片的照明部分，以减轻照射诱发的损伤，而不会不必要地损害检查系统的信噪比。 可以以选定的旋转频率旋转晶片，以利用检查系统扫描晶片缺陷。 照射能量可以在晶片的至少一个扫描区域上作为照射部分离晶片中心的径向距离和晶片的选定旋转频率的函数而变化。 照明能量可以进一步在晶片的一个或多个扫描区域上恒定地超过距离晶片中心的选定距离。