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    Illumination energy management in surface inspection
    21.
    发明授权
    Illumination energy management in surface inspection 有权
    表面检查中的照明能量管理

    公开(公告)号：US09194812B2

    公开(公告)日：2015-11-24

    申请号：US14336810

    申请日：2014-07-21

    Applicant: KLA-Tencor Corporation

    Inventor： Christian Wolters ,  Aleksey Petrenko ,  Kurt L. Haller ,  Juergen Reich ,  Zhiwei Xu ,  Stephen Biellak ,  George Kren

    IPC: G01N21/00 ,  G01N21/88 ,  G01N21/95 ,  F21V23/00

    CPC classification number: G01N21/8806 ,  F21V23/003 ,  G01N21/9501 ,  G01N2021/8835

    Abstract: The disclosure is directed to a system and method of managing illumination energy applied to illuminated portions of a scanned wafer to mitigate illumination-induced damage without unnecessarily compromising SNR of an inspection system. The wafer may be rotated at a selected spin frequency for scanning wafer defects utilizing the inspection system. Illumination energy may be varied over at least one scanned region of the wafer as a function of radial distance of an illuminated portion from the center of the wafer and the selected spin frequency of the wafer. Illumination energy may be further applied constantly over one or more scanned regions of the wafer beyond a selected distance from the center of the wafer.

    Abstract translation: 本公开涉及一种管理照射能量的系统和方法，所述照明能量施加到被扫描的晶片的照明部分，以减轻照射诱发的损伤，而不会不必要地损害检查系统的信噪比。 可以以选定的旋转频率旋转晶片，以利用检查系统扫描晶片缺陷。 照射能量可以在晶片的至少一个扫描区域上作为照射部分离晶片中心的径向距离和晶片的选定旋转频率的函数而变化。 照明能量可以进一步在晶片的一个或多个扫描区域上恒定地超过距离晶片中心的选定距离。

    Sample inspection system detector
    22.
    发明授权
    Sample inspection system detector 有权
    样品检测系统检测器

    公开(公告)号：US09086389B2

    公开(公告)日：2015-07-21

    申请号：US14062832

    申请日：2013-10-24

    Applicant: KLA-Tencor Corporation

    Inventor： Daniel Ivanov Kavaldjiev ,  Stephen Biellak ,  Guoheng Zhao ,  Mehdi Vaez-Iravani

    IPC: G01N21/00 ,  G01N21/95 ,  H01L27/144

    CPC classification number: G01N21/9501 ,  H01L27/1446

    Abstract: Methods and systems for enhancing the dynamic range of a high sensitivity inspection system are presented. The dynamic range of a high sensitivity inspection system is increased by directing a portion of the light collected from each pixel of the wafer inspection area toward an array of avalanche photodiodes (APDs) operating in Geiger mode and directing another portion of the light collected from each pixel of the wafer inspection area toward another array of photodetectors having a larger range. The array of APDs operating in Geiger mode is useful for inspection of surfaces that generate extremely low photon counts, while other photodetectors are useful for inspection of larger defects that generate larger numbers of scattered photons. In some embodiments, the detected optical field is split between two different detectors. In some other embodiments, a single detector includes both APDs operating in Geiger mode and other photodetectors having a larger range.

    Abstract translation: 介绍了提高高灵敏度检测系统动态范围的方法和系统。 高灵敏度检测系统的动态范围通过将从晶片检查区域的每个像素收集的光的一部分引导到以盖革模式操作的雪崩光电二极管（APD）阵列并且引导从每个 晶片检查区域的像素朝向具有较大范围的另一个光电检测器阵列。 以Geiger模式操作的APD阵列对于检查产生极低光子数的表面是有用的，而其他光电探测器可用于检查产生更大数量的散射光子的较大缺陷。 在一些实施例中，检测到的光场在两个不同的检测器之间被分开。 在一些其他实施例中，单个检测器包括以盖革模式操作的APD和具有较大范围的其它光电探测器。

    Image Intensifier Tube Design for Aberration Correction and Ion Damage Reduction
    23.
    发明申请
    Image Intensifier Tube Design for Aberration Correction and Ion Damage Reduction 有权
    图像增强管设计用于畸变校正和离子损伤减少

    公开(公告)号：US20140063502A1

    公开(公告)日：2014-03-06

    申请号：US13957890

    申请日：2013-08-02

    Applicant: KLA-Tencor Corporation

    Inventor： Ximan Jiang ,  Qing Li ,  Stephen Biellak

    IPC: H01J40/16

    CPC classification number: H01J40/16 ,  H01J31/50

    Abstract: The disclosure is directed to image intensifier tube designs for field curvature aberration correction and ion damage reduction. In some embodiments, electrodes defining an acceleration path from a photocathode to a scintillating screen are configured to provide higher acceleration for off-axis electrons along at least a portion of the acceleration path. Off-axis electrons and on-axis electrons are accordingly focused on the scintillating screen with substantial uniformity to prevent or reduce field curvature aberration. In some embodiments, the electrodes are configured to generate a repulsive electric field near the scintillating screen to prevent secondary electrons emitted or deflected by the scintillating screen from flowing towards the photocathode and forming damaging ions.

    Abstract translation: 本发明涉及用于场曲率像差校正和离子损伤降低的图像增强管设计。 在一些实施例中，限定从光电阴极到闪烁屏幕的加速路径的电极被配置为沿着加速路径的至少一部分为离轴电子提供更高的加速度。 因此，离轴电子和轴上电子聚焦在闪烁屏上，具有大致均匀性以防止或减小场曲率像差。 在一些实施例中，电极被配置为在闪烁屏幕附近产生排斥电场，以防止由闪烁屏幕发射或偏转的二次电子朝向光电阴极流动并形成有害离子。

    Multi-Pass Imaging Using Image Sensors with Variably Biased Channel-Stop Contacts
    25.
    发明申请
    Multi-Pass Imaging Using Image Sensors with Variably Biased Channel-Stop Contacts 审中-公开

    公开(公告)号：US20190288028A1

    公开(公告)日：2019-09-19

    申请号：US16355265

    申请日：2019-03-15

    Applicant: KLA-Tencor Corporation

    Inventor： Tzi-Cheng Lai ,  Jehn-Huar Chern ,  Stephen Biellak

    IPC: H01L27/148 ,  H01L27/146 ,  H04N5/357 ,  H04B3/32

    Abstract: First and second images of a semiconductor die or portion thereof are generated. Generating each image includes performing a respective instance of time-domain integration (TDI) along a plurality of pixel columns in an imaging sensor, while illuminating the imaging sensor with light scattered from the semiconductor die or portion thereof. The plurality of pixel columns comprises pairs of pixel columns in which the pixel columns are separated by respective channel stops. While performing a first instance of TDI to generate the first image, a first bias is applied to electrically conductive contacts of the channel stops. While performing a second instance of TDI to generate the second image, a second bias is applied to the electrically conductive contacts of the channel stops. Defects in the semiconductor die or portion thereof are identified using the first and second images.

    System and method for reducing radiation-induced false counts in an inspection system
    26.
    发明授权
    System and method for reducing radiation-induced false counts in an inspection system 有权

    公开(公告)号：US10241217B2

    公开(公告)日：2019-03-26

    申请号：US15795028

    申请日：2017-10-26

    Applicant: KLA-Tencor Corporation

    Inventor： Ximan Jiang ,  Anatoly Romanovsky ,  Christian Wolters ,  Stephen Biellak ,  Mous Tatarkhanov

    IPC: G01T1/24 ,  G01N21/95

    Abstract: An inspection system with radiation-induced false count mitigation includes a radiation count controller coupled to one or more radiation sensors positioned proximate to an illumination sensor oriented to detect illumination from a sample. The radiation count controller may identify a set of radiation detection events based on radiation signals received from the radiation sensors during operation of the illumination sensor. The inspection system may further include an inspection controller to identify a set of illumination detection events based on an illumination signal, identify one or more features on the sample based on the set of illumination detection events, receive the set of radiation detection events from the radiation count controller, compare the set of radiation detection events to the set of illumination detection events to identify a set of coincidence events, and refine the one or more identified features on the sample based on the set of coincidence events.

    System and Method for Reducing Radiation-Induced False Counts in an Inspection System
    27.
    发明申请
    System and Method for Reducing Radiation-Induced False Counts in an Inspection System 审中-公开

    公开(公告)号：US20180045837A1

    公开(公告)日：2018-02-15

    申请号：US15795028

    申请日：2017-10-26

    Applicant: KLA-Tencor Corporation

    Inventor： Ximan Jiang ,  Anatoly Romanovsky ,  Christian Wolters ,  Stephen Biellak ,  Mous Tatarkhanov

    IPC: G01T1/24 ,  G01N21/95

    CPC classification number: G01T1/24 ,  G01N21/9501

    Abstract: An inspection system with radiation-induced false count mitigation includes a radiation count controller coupled to one or more radiation sensors positioned proximate to an illumination sensor oriented to detect illumination from a sample. The radiation count controller may identify a set of radiation detection events based on radiation signals received from the radiation sensors during operation of the illumination sensor. The inspection system may further include an inspection controller to identify a set of illumination detection events based on an illumination signal, identify one or more features on the sample based on the set of illumination detection events, receive the set of radiation detection events from the radiation count controller, compare the set of radiation detection events to the set of illumination detection events to identify a set of coincidence events, and refine the one or more identified features on the sample based on the set of coincidence events.

    High resolution high quantum efficiency electron bombarded CCD or CMOS imaging sensor
    29.
    发明授权
    High resolution high quantum efficiency electron bombarded CCD or CMOS imaging sensor 有权
    高分辨率高量子效率电子轰击CCD或CMOS成像传感器

    公开(公告)号：US09460886B2

    公开(公告)日：2016-10-04

    申请号：US14614088

    申请日：2015-02-04

    Applicant: KLA-Tencor Corporation

    Inventor： Ximan Jiang ,  Stephen Biellak ,  John Fielden

    IPC: H01J40/14 ,  H01J31/26 ,  G01N21/88 ,  H01J29/46

    CPC classification number: H01J31/26 ,  G01N21/88 ,  H01J29/46

    Abstract: An electron-bombarded detector for detecting low light signals includes a vacuum tube structure defining a cylindrical vacuum tube chamber, a photocathode disposed at a first end of the vacuum tube chamber, a sensor disposed at a second end of the vacuum tube chamber, ring electrodes disposed in the vacuum tube chamber for generating an electric field that accelerates emitted photoelectrons toward the sensor, and a magnetic field generator configured to generate a symmetric magnetic field that applies a focusing lens effect on the photoelectrons. The ring electrodes and magnetic field generator are operating using one of a reduced distance focusing approach and an acceleration/deceleration approach such that the photoelectrons have a landing energy below 2 keV. The use of reflective mode photocathodes is enabled using either multi-pole deflector coils, or ring electrodes formed by segmented circular electrode structures. Large angle deflections are achieved using magnetic or electrostatic deflectors.

    Abstract translation: 用于检测低光信号的电子轰击检测器包括限定圆柱形真空管室的真空管结构，设置在真空管室的第一端的光电阴极，设置在真空管室的第二端的传感器，环形电极 设置在真空管室中，用于产生将发射的光电子朝向传感器加速的电场;以及磁场发生器，被配置为产生对光电子产生聚焦透镜效应的对称磁场。 环形电极和磁场发生器使用减小的距离聚焦方法和加速/减速方法之一进行操作，使得光电子具有低于2keV的着陆能量。 使用反射模式光电阴极可以使用多极偏转线圈或由分段圆形电极结构形成的环形电极。 使用磁性或静电偏转器实现大角度偏转。

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