公开(公告)号：US20210193558A1

公开(公告)日：2021-06-24

申请号：US17187470

申请日：2021-02-26

申请人： Intel Corporation

发明人： Ralph V. Miele ,  Phil Geng ,  Mengqi Liu ,  David Shia ,  Sandeep Ahuja ,  Eric W. Buddrius ,  Jeffory L. Smalley

IPC分类号： H01L23/40

摘要： Techniques for processor loading mechanisms are disclosed. In the illustrative embodiment, a heat sink is in contact with a top surface of a processor, applying a downward force on the processor. A load plate is also in contact with the processor, applying a downward force to the processor as well. The combination of the downward force from the load plate and the heat sink keep the processor in good physical contact with pins of the processor socket. The heat sink has enough force applied to the processor to be in good thermal contact with the processor without applying higher stress to the heat sink. The load plate can apply force to the processor without regard to the thermal characteristics of the load plate. Other embodiments are envisioned and described.

公开(公告)号：US10950958B2

公开(公告)日：2021-03-16

申请号：US16021269

申请日：2018-06-28

申请人： Intel Corporation

发明人： Phil Geng ,  Xiang Li ,  Mani Prakash ,  George Vergis

IPC分类号： H01R13/62 ,  H01R13/64 ,  H01R13/627 ,  H01R12/70 ,  H05K1/14 ,  H01R12/73 ,  H05K3/36 ,  H01R12/72 ,  H05K1/11

摘要： A memory module connector includes a memory module receiving slot configured to receive a memory module. The memory module connector further includes a restraining mechanism configured to release the memory module if a force applied by the memory module to the restraining mechanism is above a pre-determined force threshold.

公开(公告)号：US20180252483A1

公开(公告)日：2018-09-06

申请号：US15446791

申请日：2017-03-01

申请人： Intel Corporation

发明人： Phil Geng ,  Tejinder Pal S. Aulakh ,  Sandeep Ahuja

IPC分类号： F28F19/00 ,  F28F3/12 ,  F28F3/06 ,  G06F1/20 ,  H05K7/20

CPC分类号： G06F1/20 ,  F28D15/0275 ,  F28D2021/0029 ,  F28F2225/04 ,  G06F1/203 ,  H01L23/3672 ,  H01L23/427 ,  H05K7/20336

摘要： Apparatus and method to increase structural integrity of heatsinks are described herein. In embodiments, an apparatus may include a plurality of thermal dissipation fins; and a base disposed below the plurality of thermal dissipation fins, wherein the base is to include an evacuated space in which one or more thermal transport pipes and one or more stiffener structures are disposed, the evacuated space is to include a first side proximate to the plurality of thermal dissipation fins and a second side opposite the first side, and wherein a stiffener structure of the one or more stiffener structures attaches to the first or second side.