公开(公告)号：US09496630B2

公开(公告)日：2016-11-15

申请号：US14983183

申请日：2015-12-29

申请人： Intel Corporation

发明人： Tao Liu ,  Tejinder Pal S. Aulakh

IPC分类号： H01R4/50 ,  H01L23/32 ,  H05K7/10 ,  H01R13/62 ,  H01R43/20 ,  H01R13/639

CPC分类号： H01R4/5066 ,  H01L23/32 ,  H01L2924/0002 ,  H01R13/62 ,  H01R13/639 ,  H01R43/205 ,  H05K7/1061 ,  Y10T29/49128 ,  H01L2924/00

摘要： A holding member and system including a first and a second holding member, wherein each of the first holding member and the second holding member are coupled to opposite sides of a load plate of a socket. A holding member includes a body including a pair of arms extending from a first side of the body and spaced to accommodate a portion of an integrated circuit chip package therebetween and at least one clip extending from a second side opposite the first side. Also, a method including coupling an integrated circuit chip package to a first holding member and a second holding member, wherein the first holding member is coupled to a first side of a load plate of a socket and the second holding member is coupled to a second side of the load plate; and inserting the package into a socket of a printed circuit board.

摘要翻译： 一种保持构件和系统，包括第一和第二保持构件，其中第一保持构件和第二保持构件中的每一个联接到插座的负载板的相对侧。 保持构件包括主体，其包括从主体的第一侧延伸的间隔开的一对臂，以容纳其间的集成电路芯片封装的一部分，以及从与第一侧相对的第二侧延伸的至少一个夹子。 另外，包括将集成电路芯片封装耦合到第一保持构件和第二保持构件的方法，其中第一保持构件联接到插座的负载板的第一侧，并且第二保持构件联接到第二保持构件 装载板侧; 并将封装插入印刷电路板的插座中。

公开(公告)号：US20180252483A1

公开(公告)日：2018-09-06

申请号：US15446791

申请日：2017-03-01

申请人： Intel Corporation

发明人： Phil Geng ,  Tejinder Pal S. Aulakh ,  Sandeep Ahuja

IPC分类号： F28F19/00 ,  F28F3/12 ,  F28F3/06 ,  G06F1/20 ,  H05K7/20

CPC分类号： G06F1/20 ,  F28D15/0275 ,  F28D2021/0029 ,  F28F2225/04 ,  G06F1/203 ,  H01L23/3672 ,  H01L23/427 ,  H05K7/20336

摘要： Apparatus and method to increase structural integrity of heatsinks are described herein. In embodiments, an apparatus may include a plurality of thermal dissipation fins; and a base disposed below the plurality of thermal dissipation fins, wherein the base is to include an evacuated space in which one or more thermal transport pipes and one or more stiffener structures are disposed, the evacuated space is to include a first side proximate to the plurality of thermal dissipation fins and a second side opposite the first side, and wherein a stiffener structure of the one or more stiffener structures attaches to the first or second side.