Abstract:
A structure fabricating method plastically deforms a target portion of a substrate, to thereby fabricate a structure having an inclined segment that is inclined relative to a principal surface of the substrate. The method includes forming a projection on the target portion to project from the principal surface of the substrate or from an opposing surface of the substrate on the side opposite to the principal surface, and applying a force to the projection to plastically deform the target portion such that the target portion is bent in a direction from one surface of the substrate on the side where the projection is formed, toward another surface on the side opposite to the one surface.
Abstract:
A handling member is prepared that provides a channel that can withstand subsequent back face processing as to a substrate having elements made up of a substrate and a membrane, and the handling member is fixed to the substrate so that at least a portion within the elements are supported by the handling member. This provides a manufacturing method wherein the physical strength of an element at the time of manufacturing an electromechanical transducing apparatus is strengthened, and the handling member is easily detached in a short time after processing of the element.
Abstract:
A groove is formed on a handling member, on a face to be fixed to an element, the groove making up a portion of a channel that externally communicates in the state of being fixed to the element. The handling member is fixed so that the cleavage direction of the vibrating membrane and the edge direction of the groove of the handling member intersect. Thus, the probability that a membrane will break during handling or processing of the substrate is reduced, and the handling member can be quickly removed from the substrate.
Abstract:
A micro-structure fabrication method fabricates a micro-structure including an inclined part inclined to a principal plane of a substrate by plastically deforming a work piece having the substrate with the principal plane. The structure fabrication method includes the steps of providing in the work piece a projection configured to protrude from a first surface and away from the principal plane of the substrate, and bending the work piece toward a second surface opposite to the first surface. The bending is accomplished by applying a force on a block including an inclined pressure plane that is abutted on the projection for plastically deforming the work piece, in which in bending the work piece, the direction of a first force applied on the work piece intersects with the direction of a second force of the inclined pressure plane pushing the projection.
Abstract:
This invention includes energizing an electrode in which the surface facing a cavity is exposed as one electrode for electrolytic etching and the other electrode provided at the outside and contacting an electrolytic etching solution to perform electrolytic etching of a sacrificial layer to form a cavity. Thereafter, a removal agent is introduced from an etching hole to reduce residues of the sacrificial layer due to the electrolytic etching.
Abstract:
In an electromechanical transducer which includes a vibration membrane provided with an upper electrode, a substrate provided with a lower electrode, and a support member adapted to support the vibration membrane in such a manner that a gap is formed between the vibration membrane and the substrate with these electrodes being arranged in opposition to each other, it is constructed such that a part of the vibration membrane and a region of the substrate are in contact with each other, and a remaining region of the vibration membrane other than the contact region is able to vibrate. There is an overlap region of the first electrode and second electrode in the contact region, and at least one of these electrodes has a through portion formed therethrough in at least a part of the overlap region.
Abstract:
In the present invention, a thin film transistor is formed on a plastic film substrate (1) having anisotropy of thermal shrinkage rate or coefficient of thermal expansion in in-plane directions of the substrate. A channel is formed such that the direction (7) in which the thermal shrinkage rate or the coefficient of thermal expansion of the substrate is largest is nonparallel to the direction (8) of a current flowing through the channel of the thin film transistor. Then, a thin film transistor having stable and uniform electrical characteristics, which is formed on the plastic film substrate, is provided.
Abstract:
In an electromechanical transducer which includes a vibration membrane provided with an upper electrode, a substrate provided with a lower electrode, and a support member adapted to support the vibration membrane in such a manner that a gap is formed between the vibration membrane and the substrate with these electrodes being arranged in opposition to each other, it is constructed such that a part of the vibration membrane and a region of the substrate are kept in contact with each other without application of an external force, and a remaining region of the vibration membrane other than its region in which the contact state is kept is able to vibrate.
Abstract:
In a method of fabricating a structure by plastically deforming a processing portion provided at a movable segment, a restraint segment configured to restrain movement of the movable segment is provided before an external force is applied to the processing portion. After processing of the processing portion is completed, the restraint segment is removed.
Abstract:
There is provided an etching method of an amorphous oxide layer containing In and at least one of Ga and Zn, which includes etching the amorphous oxide layer using an etchant containing any one of acetic acid, citric acid, hydrochloric acid, and perchloric acid.