公开(公告)号：US20150044445A1

公开(公告)日：2015-02-12

申请号：US14449574

申请日：2014-08-01

Applicant: CORNING INCORPORATED

Inventor： Sean Matthew Garner ,  Ming-Jun Li ,  Xinghua Li

IPC: C03C21/00 ,  C03C23/00

CPC classification number: C03C23/0025 ,  C03C21/002

Abstract: A method for forming ion-exchanged regions in a glass article by contacting an ion source with at least one surface of the glass article, forming a first ion-exchanged region in the glass article by heating a first portion of the glass article with a laser, and forming a second ion-exchanged region in the glass article. Characteristics of the first ion-exchanged region may be different from characteristics of the second ion-exchanged region. A depth of the ion-exchanged region may be greater than 1 μm. A glass article including a first ion-exchanged region, and a second ion-exchanged region having different characteristics from the first ion-exchanged region. The thickness of the glass article is less than or equal to about 0.5 mm.

Abstract translation: 一种通过使离子源与玻璃制品的至少一个表面接触而在玻璃制品中形成离子交换区的方法，通过用激光加热玻璃制品的第一部分，在玻璃制品中形成第一离子交换区 ，并在玻璃制品中形成第二离子交换区。 第一离子交换区的特征可以不同于第二离子交换区的特性。 离子交换区域的深度可以大于1μm。 一种玻璃制品，包括第一离子交换区域和与第一离子交换区域具有不同特性的第二离子交换区域。 玻璃制品的厚度小于或等于约0.5mm。

公开(公告)号：US20240413070A1

公开(公告)日：2024-12-12

申请号：US18700432

申请日：2022-09-28

Applicant: CORNING INCORPORATED

Inventor： Sean Matthew Garner ,  Dhananjay Joshi ,  Chukwudi Azubuike Okoro

IPC: H01L23/498 ,  B22F3/15 ,  H01L21/48 ,  H01L23/15 ,  H01L23/48

Abstract: A via includes a substrate and a porous electrically conductive material. The substrate includes a first surface and a second surface opposite to the first surface. The substrate includes a through-hole extending from the first surface to the second surface. The porous electrically conductive material extends through the through-hole. The porous electrically conductive material includes a first porosity in a central region of the through-hole and a second porosity less than the first porosity proximate the first surface and the second surface of the substrate.

公开(公告)号：US11958780B2

公开(公告)日：2024-04-16

申请号：US17940120

申请日：2022-09-08

Applicant: CORNING INCORPORATED

Inventor： Bruce Gardiner Aitken ,  Sean Matthew Garner ,  Thomas Dale Ketcham ,  Daniel Aloysius Nolan ,  Jun Yang ,  Haitao Zhang

IPC: C04B35/486 ,  B82Y40/00 ,  G11C13/04

CPC classification number: C04B35/486 ,  G11C13/048 ,  B82Y40/00 ,  C04B2235/3227

Abstract: A ceramic waveguide includes: a doped metal oxide ceramic core layer; and at least one cladding layer comprising the metal oxide surrounding the core layer, such that the core layer includes an erbium dopant and at least one rare earth metal dopant being: lanthanum, cerium, praseodymium, neodymium, promethium, samarium, europium, gadolinium, terbium, dysprosium, holmium, thulium, ytterbium, lutetium, scandium, or oxides thereof, or at least one non-rare earth metal dopant comprising zirconium or oxides thereof. Also included is a quantum memory including: at least one doped polycrystalline ceramic optical device with the ceramic waveguide and a method of fabricating the ceramic waveguide.

公开(公告)号：US11777067B2

公开(公告)日：2023-10-03

申请号：US17697196

申请日：2022-03-17

Applicant: CORNING INCORPORATED

Inventor： Jiangwei Feng ,  Sean Matthew Garner ,  Jen-Chieh Lin ,  Robert George Manley ,  Timothy James Orsley ,  Richard Curwood Peterson ,  Michael Lesley Sorensen ,  Pei-Lien Tseng ,  Rajesh Vaddi ,  Lu Zhang

IPC: H01L33/62 ,  H01L27/15

CPC classification number: H01L33/62 ,  H01L27/156 ,  H01L2933/0066

Abstract: Display tiles comprising pixel elements on a first surface of a substrate connected by an electrode, a driver located opposite the first surface, and a connector wrapped around an edge surface of the substrate connecting the driver to the pixel elements. Displays comprised of display tiles and methods of manufacturing display tiles and displays are also disclosed.

公开(公告)号：US20230019958A1

公开(公告)日：2023-01-19

申请号：US17940120

申请日：2022-09-08

Applicant: CORNING INCORPORATED

Inventor： Bruce Gardiner Aitken ,  Sean Matthew Garner ,  Thomas Dale Ketcham ,  Daniel Aloysius Nolan ,  Jun Yang ,  Haitao Zhang

IPC: C04B35/486 ,  G11C13/04

Abstract: A ceramic waveguide includes: a doped metal oxide ceramic core layer; and at least one cladding layer comprising the metal oxide surrounding the core layer, such that the core layer includes an erbium dopant and at least one rare earth metal dopant being: lanthanum, cerium, praseodymium, neodymium, promethium, samarium, europium, gadolinium, terbium, dysprosium, holmium, thulium, ytterbium, lutetium, scandium, or oxides thereof, or at least one non-rare earth metal dopant comprising zirconium or oxides thereof. Also included is a quantum memory including: at least one doped polycrystalline ceramic optical device with the ceramic waveguide and a method of fabricating the ceramic waveguide.

公开(公告)号：US10766809B2

公开(公告)日：2020-09-08

申请号：US15497668

申请日：2017-04-26

Applicant: Corning Incorporated

Inventor： Sean Matthew Garner ,  Michael Lesley Sorensen

IPC: C03C21/00 ,  B32B17/10 ,  C03C3/076 ,  C03C3/089 ,  C03C3/091 ,  C03C4/18 ,  C03C3/083 ,  C03C3/085 ,  C03C3/087 ,  C03C3/078 ,  C03C3/095 ,  B32B17/06 ,  C03C3/093

Abstract: A method of performing ion exchange of a thin, flexible glass substrate having an average thickness equal to or less than about 0.3 mm to chemically strengthen the glass substrate is disclosed. The chemically strengthened glass substrate comprises a first compressive stress layer having a first depth of layer, and a second compressive stress layer having a second depth of layer, the first and second stress layers being separated by a layer of tensile stress. A laminated article comprising the chemically strengthened glass substrate is also described.

公开(公告)号：US10424606B1

公开(公告)日：2019-09-24

申请号：US15972628

申请日：2018-05-07

Applicant: CORNING INCORPORATED

Inventor： Sean Matthew Garner ,  Daniel Wayne Levesque, Jr. ,  Robert George Manley ,  Garrett Andrew Piech ,  Rajesh Vaddi ,  Heather Nicole Vanselous

IPC: H01L27/12 ,  H01L27/15

Abstract: Embodiments are related to systems and methods for forming vias in a substrate, and more particularly to systems and methods for reducing substrate surface disruption during via formation.

公开(公告)号：US10312462B2

公开(公告)日：2019-06-04

申请号：US15840888

申请日：2017-12-13

Applicant: Corning Incorporated

Inventor： Sean Matthew Garner ,  Gregory Scott Glaesemann ,  James Joseph Price

IPC: C03C17/34 ,  H01L51/00 ,  C03C4/00 ,  H01L31/0392

Abstract: A flexible substrate are disclosed comprising an amorphous inorganic composition, wherein the substrate has a thickness of less than about 250 μm and has at least one of: a) a brittleness ratio less than about 9.5 (μm)−1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2. Electronic devices comprising such flexible devices are also disclosed. Also disclosed is a method for making a flexible substrate comprising selecting an amorphous inorganic material capable of forming a substrate having a thickness of less than about 250 μm and having at least one of: a) a brittleness ratio of less than about 9.5 (μm)−1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2; and then forming a substrate from the selected inorganic material.

公开(公告)号：US10273184B2

公开(公告)日：2019-04-30

申请号：US15026691

申请日：2014-10-13

Applicant: Corning Incorporated

Inventor： Sean Matthew Garner ,  Michael Lesley Sorensen

IPC: C03C21/00 ,  B32B17/06 ,  B32B17/10 ,  C03C3/076 ,  C03C3/078 ,  C03C3/083 ,  C03C3/085 ,  C03C3/087 ,  C03C3/089 ,  C03C3/091 ,  C03C3/093 ,  C03C3/095 ,  C03C4/18

Abstract: A method of performing ion exchange of a thin, flexible glass substrate having an average thickness equal to or less than about 0.3 mm to chemically strengthen the glass substrate is disclosed. The chemically strengthened glass substrate comprises a first compressive stress layer having a first depth of layer, and a second compressive stress layer having a second depth of layer, the first and second stress layers being separated by a layer of tensile stress. A laminated article comprising the chemically strengthened glass substrate is also described.

公开(公告)号：US20180102490A1

公开(公告)日：2018-04-12

申请号：US15840888

申请日：2017-12-13

Applicant: Corning Incorporated

Inventor： Sean Matthew Garner ,  Gregory Scott Glaesemann ,  James Joseph Price

IPC: H01L51/00 ,  H01L31/0392 ,  C03C4/00 ,  C03C17/34

CPC classification number: H01L51/0097 ,  C03C4/00 ,  C03C17/34 ,  H01L31/03926 ,  H01L2251/5338 ,  Y02E10/549

Abstract: A flexible substrate are disclosed comprising an amorphous inorganic composition, wherein the substrate has a thickness of less than about 250 μm and has at least one of: a) a brittleness ratio less than about 9.5 (μm)−1/2, or b) a fracture toughness of at least about 0.75 MPa.(m)1/2. Electronic devices comprising such flexible devices are also disclosed. Also disclosed is a method for making a flexible substrate comprising selecting an amorphous inorganic material capable of forming a substrate having a thickness of less than about 250 μm and having at least one of: a) a brittleness ratio of less than about 9.5 (μm)−1/2, or b) a fracture toughness of at least about 0.75 MPa.(m)1/2; and then forming a substrate from the selected inorganic material.