公开(公告)号：US20180275462A1

公开(公告)日：2018-09-27

申请号：US15795186

申请日：2017-10-26

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Haixu Li

IPC: G02F1/1335 ,  H01L33/32 ,  H01L33/06 ,  H01L27/12 ,  H01L33/00 ,  H01L33/60 ,  G02F1/1368

CPC classification number: G02F1/133603 ,  G02F1/133608 ,  G02F1/133621 ,  G02F1/1362 ,  G02F1/1368 ,  G02F2001/133302 ,  G02F2202/10 ,  G02F2202/108 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/1214 ,  H01L27/1259 ,  H01L33/007 ,  H01L33/0075 ,  H01L33/06 ,  H01L33/32 ,  H01L33/60

Abstract: This disclosure provides an array substrate for a liquid crystal display panel, comprising: a base substrate; a light-emitting diode back light source deposited on one surface of the base substrate; and thin film transistor on the other surface of the base substrate. This disclosure also provides a production method of an array substrate, a liquid crystal display panel, and a display apparatus.

公开(公告)号：US12249529B2

公开(公告)日：2025-03-11

申请号：US17427628

申请日：2020-10-30

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Haixu Li ,  Xiao Zhang ,  Fei Wang ,  Mingxing Wang ,  Shulei Li ,  Xue Dong ,  Guangcai Yuan ,  Zhanfeng Cao ,  Xin Gu ,  Ke Wang ,  Feng Qu ,  Xuan Liang ,  Junwei Yan

IPC: H01L21/683 ,  H01L25/075 ,  H01L33/62

Abstract: A light-emitting diode substrate, a manufacturing method thereof, and a display device are disclosed. The manufacturing method of the light-emitting diode substrate includes: forming an epitaxial layer group of M light-emitting diode chips on a substrate; transferring N epitaxial layer groups on N substrates onto a transition carrier substrate, the N epitaxial layer groups on the N substrates being densely arranged on the transition carrier substrate; and transferring at least part of N*M light-emitting diode chips corresponding to the N epitaxial layer groups on the transition carrier substrate onto a driving substrate, an area of the transition carrier substrate is greater than or equal to a sum of areas of the N substrates, M is a positive integer greater than or equal to 2, and N is a positive integer greater than or equal to 2.

公开(公告)号：US11650637B2

公开(公告)日：2023-05-16

申请号：US16643919

申请日：2019-08-14

Applicant: BOE Technology Group Co., Ltd.

Inventor： Haixu Li ,  Zhanfeng Cao ,  Ke Wang ,  Jianguo Wang

IPC: G06F1/18 ,  G02F1/1362 ,  H05K1/11 ,  H05K3/02 ,  H05K3/10 ,  H05K3/18

CPC classification number: G06F1/189 ,  G02F1/136295 ,  H05K1/11 ,  H05K3/02 ,  H05K3/108 ,  H05K3/188

Abstract: The present disclosure provides a wiring structure, a preparation method thereof, and a display device. The wiring structure includes a substrate; a pre-arranged layer located on the substrate; and an electrode wiring covering the pre-arranged layer; wherein in the direction perpendicular to an extending direction of the electrode wiring and parallel to a plane on which the substrate is located, an orthographic projection of the pre-arranged layer on the substrate is located within an orthographic projection of the electrode wiring on the substrate, and a side surface of the pre-arranged layer is inclined relative to the plane on which the substrate is located.

公开(公告)号：US11437265B2

公开(公告)日：2022-09-06

申请号：US16770655

申请日：2019-06-13

Applicant: BOE Technology Group Co., Ltd.

Inventor： Xue Dong ,  Guangcai Yuan ,  Zhijun Lv ,  Haixu Li ,  Zhiwei Liang ,  Huijuan Wang ,  Ke Wang ,  Zhanfeng Cao ,  Hsuanwei Mai

IPC: H01L21/683 ,  H01L25/075 ,  H01L33/62

Abstract: The present disclosure discloses a mass transfer method and system for micro light emitting diodes, wherein the mass transfer method includes: providing a component substrate on which a plurality of micro light emitting diodes are formed; picking up the micro light emitting diodes on the component substrate at least once by a plurality of bonding structures on a first medium load substrate, and transferring micro light emitting diodes picked up every time to a second medium load substrate; and transferring the micro light emitting diodes on the second medium load substrate into corresponding sub-pixels on a target substrate at one time, wherein one of the micro light emitting diodes on the second medium load substrate corresponds to one of the sub-pixels on the target substrate.

公开(公告)号：US11316003B2

公开(公告)日：2022-04-26

申请号：US16959010

申请日：2020-02-25

Applicant: BOE Technology Group Co., Ltd.

Inventor： Xue Dong ,  Guangcai Yuan ,  Haixu Li ,  Zhanfeng Cao ,  Ke Wang ,  Zhijun Lv ,  Fei Wang ,  Huijuan Wang ,  Zhiwei Liang ,  Xinhong Lu

IPC: H01L27/32

Abstract: Disclosed are an array substrate, and a display device, and a method for manufacturing the same. The array substrate includes: a base substrate, and a thin film transistor, a planarization pattern, a bonding pattern, and a conductive structure that are disposed on the base substrate. The thin film transistor, the planarization pattern, and the bonding pattern are laminated in a direction going distally from the base substrate. The planarization pattern is provided with a via and a groove, the conductive structure is disposed in the via, wherein the bonding pattern is conductive and is electrically connected to the thin film transistor by the conductive structure, an orthographic projection of the bonding pattern on the base substrate falls outside an orthographic projection of the groove on the base substrate, and the groove is configured to accommodate an adhesive.

公开(公告)号：US11257852B2

公开(公告)日：2022-02-22

申请号：US16966146

申请日：2019-12-25

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Haixu Li ,  Zhanfeng Cao ,  Ke Wang

IPC: H01L27/12 ,  H01L25/16 ,  H01L33/62 ,  H01L23/00

Abstract: A circuit backplane of a display panel, a method for manufacturing the same, and a display panel are provided. The circuit backplane includes a substrate and a plurality of circuit regions on the substrate. Each of the plurality of circuit regions includes a cathode soldered electrode, an anode soldered electrode, and a flow blocking island that are on the substrate. The flow blocking island is between the cathode soldered electrode and the anode soldered electrode, and in a thickness direction of the circuit backplane, a height of the flow blocking island is greater than each of a height of the cathode soldered electrode and a height of the anode soldered electrode.

公开(公告)号：US11244966B2

公开(公告)日：2022-02-08

申请号：US16682395

申请日：2019-11-13

Applicant: BOE Technology Group Co., Ltd.

Inventor： Haixu Li ,  Zhanfeng Cao ,  Ke Wang

IPC: H01L27/12 ,  H01L25/075

Abstract: A micro LED display panel and a method for fabricating the same are disclosed, and the micro LED display panel includes a TFT back panel, and a micro LED fixed on the TFT back panel, wherein the TFT back panel includes a substrate, and a first insulation layer and a second insulation layer stacked over the substrate in that order, wherein the first insulation layer includes a groove filled with the second insulation layer, and a normal projection of the groove onto the substrate does not overlap with a normal projection of a TFT area in the TFT back panel onto the substrate, wherein the rigidity of the second insulation layer is lower than the rigidity of the first insulation layer.

公开(公告)号：US11239221B2

公开(公告)日：2022-02-01

申请号：US16631016

申请日：2018-11-02

Applicant: BOE Technology Group Co., Ltd.

Inventor： Haixu Li

IPC: H01L25/16 ,  H01L27/12 ,  H01L33/62

Abstract: An array substrate and a fabrication method thereof, and an electronic apparatus are disclosed. The array substrate includes a base substrate, a thin film transistor, a first connection electrode and a first insulation layer. The thin film transistor is on the base substrate and including a first electrode and a second electrode; the first connection electrode in a layer different from the first electrode and electrically connected with the first electrode; and the first insulation layer covering at least a portion of the first connection electrode; an area of an orthographic projection of the first connection electrode on the base substrate is larger than an area of an orthographic projection of the first electrode on the base substrate, and the first insulation layer is made from an organic insulation material.

公开(公告)号：US20210066267A1

公开(公告)日：2021-03-04

申请号：US16631016

申请日：2018-11-02

Applicant: BOE Technology Group Co., Ltd.

Inventor： Haixu Li

IPC: H01L25/16 ,  H01L27/12 ,  H01L33/62

Abstract: An array substrate and a fabrication method thereof, and an electronic apparatus are disclosed. The array substrate includes a base substrate, a thin film transistor, a first connection electrode and a first insulation layer. The thin film transistor is on the base substrate and including a first electrode and a second electrode; the first connection electrode in a layer different from the first electrode and electrically connected with the first electrode; and the first insulation layer covering at least a portion of the first connection electrode; an area of an orthographic projection of the first connection electrode on the base substrate is larger than an area of an orthographic projection of the first electrode on the base substrate, and the first insulation layer is made from an organic insulation material.

公开(公告)号：US20210064104A1

公开(公告)日：2021-03-04

申请号：US16643919

申请日：2019-08-14

Applicant: BOE Technology Group Co., Ltd.

Inventor： Haixu Li ,  Zhanfeng Cao ,  Ke Wang ,  Jianguo Wang

IPC: G06F1/18

Abstract: The present disclosure provides a wiring structure, a preparation method thereof, and a display device. The wiring structure includes a substrate; a pre-arranged layer located on the substrate; and an electrode wiring covering the pre-arranged layer; wherein in the direction perpendicular to an extending direction of the electrode wiring and parallel to a plane on which the substrate is located, an orthographic projection of the pre-arranged layer on the substrate is located within an orthographic projection of the electrode wiring on the substrate, and a side surface of the pre-arranged layer is inclined relative to the plane on which the substrate is located.