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公开(公告)号：US20230320044A1
公开(公告)日：2023-10-05
申请号：US18332128
申请日：2023-06-09
Inventor： Fei Li , Zhihui Yan , Tianliang Liu , Yifei Wang , Hao Huang , Xu Lu
IPC: H05K7/20
CPC classification number: H05K7/20963
Abstract: Disclosed are a display module and a method for manufacturing the same, and a display device. The display module includes: a display panel, a heat dissipation layer, a heat conduction assembly, and a driving chip, wherein the display panel includes a first part and a second part opposite to each other, and a bending part connecting the first part and the second part; the heat dissipation layer is disposed on a side, proximal to the second part, of the first part; the heat conduction assembly is disposed between the heat dissipation layer and the second part; an area of an orthographic projection of the heat conduction assembly on the first part is smaller than an area of an orthographic projection of the heat dissipation layer on the first part; and the driving chip is disposed on a side, distal from the heat conduction assembly, of the second part distal.
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公开(公告)号：US11521936B2
公开(公告)日：2022-12-06
申请号：US16880592
申请日：2020-05-21
Inventor： Zhen Zhang , Xinwei Wu , Huimin Cao , Kangguan Pan , Fei Li , Yuqing Yang , Yue Wei
IPC: H01L23/544 , G02F1/1333 , G02F1/1345 , H01L27/32
Abstract: A display substrate has a display area and a peripheral area. The display substrate includes a base, a first insulating layer disposed above the base, a first alignment pattern disposed in the peripheral area on a surface of the first insulating layer facing away from the base, and a second alignment pattern disposed in the peripheral area at a side of the first insulating layer away from the base. An orthographic projection of the second alignment pattern on the base and an orthographic projection of the first alignment pattern on the base have a non-overlapping region therebetween, and the second alignment pattern is in contact with the first insulating layer in the non-overlapping region. Adhesion between the second alignment pattern and the first insulating layer is greater than adhesion between the second alignment pattern and the first alignment pattern.
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公开(公告)号：US11417797B2
公开(公告)日：2022-08-16
申请号：US16902358
申请日：2020-06-16
Inventor： Xinfeng Wu , Fei Li , Huihui Li , Xinzhu Wang , Youyuan Hu , Jinxia Hu , Xiaotian Zhang
Abstract: Provided is a micro-LED device, comprising: a light emitting unit comprising a light emitting layer having a first end surface, a second end surface opposite to the first end surface, and a lateral surface between the first end surface and the second end surface; a P-type semiconductor layer on the first end surface; and an N-type semiconductor layer on the second end surface; a transparent insulating layer covering at least the lateral surface of the light emitting layer; and a reflecting layer on a side of the transparent insulating layer away from the light emitting unit, wherein the transparent insulating layer insulates the light emitting unit from the reflecting layer, and the reflecting layer covers at least the lateral surface of the light emitting layer.
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24.发明申请公开(公告)号：US20210273201A1
公开(公告)日：2021-09-02
申请号：US17256187
申请日：2020-03-10
Inventor： Youyuan Hu , Mengyu Luan , Xinfeng Wu , Bowen Liu , Xinzhu Wang , Fei Li , Huihui Li
Abstract: Provided is a packaging structure for packaging a display device, the packaging structure comprising: at least one composite film layer, wherein the composite film layer comprises an inorganic pattern and an organic pattern, the inorganic pattern comprises a plurality of curved structures arranged at intervals, the organic pattern comprises a first organic sub-pattern, and the first organic sub-pattern and the inorganic pattern are located in a same layer and are complementary in position; and wherein an orthographic projection of the composite film layer onto the display device at least covers a display area of the display device. A display substrate, a display apparatus, and a method for packaging a display device are also provided.
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公开(公告)号：US10901144B2
公开(公告)日：2021-01-26
申请号：US16532947
申请日：2019-08-06
Inventor： Fei Li , Binfeng Feng , Qifeng Li , Yonghui Luo , Chao Wang , Ying Liu , Hairui Zhao , Yupeng Chen
Abstract: A light guiding structure, a display device and a method of using the same are provided. The light guiding structure includes a housing including an opening; and a first optical fiber structure, an image collection module, a second optical fiber structure, and an image compensation module in the housing. The first optical fiber structure is configured to transmit light incident into the opening to the image collection module; and the second optical fiber structure is configured to transmit an image displayed by the image compensation module to the opening. The display device includes the light guiding structure.
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Patent Agency Ranking
26.发明申请公开(公告)号：US20190214104A1
公开(公告)日：2019-07-11
申请号：US16120869
申请日：2018-09-04
Inventor： Xianrui Qian , Yuting Chen , Fei Li , Bo Li
CPC classification number: G11C19/28 , G09G3/20 , G09G2300/043 , G09G2300/0809 , G09G2310/0286 , G09G2310/08
Abstract: The embodiments of the present application provide a shift register, a method for controlling the same, a gate driving circuit, and a display apparatus. The shift register includes: an input circuit coupled to a signal input terminal and a pull-up node; a pull-up circuit coupled to the pull-up node, a first clock signal terminal and a signal output terminal; a pull-down circuit coupled to a reset signal terminal, a first voltage signal terminal, the pull-up node, and the signal output terminal; a pull-down control circuit coupled to a second clock signal terminal, the pull-up node, a pull-down node, and the first voltage signal terminal; a first de-noising circuit coupled to the pull-up node, the signal input terminal, the first voltage signal terminal, and a compensation node; and a compensation circuit coupled to the first clock signal terminal, the second clock signal terminal, and the compensation node.
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27.发明申请公开(公告)号：US20250126763A1
公开(公告)日：2025-04-17
申请号：US18567461
申请日：2023-05-23
Inventor： Jiaxiang Wang , Binfeng Feng , Zijie Zhang , Fei Li , Qi Huang , Shangnan Jin
IPC: H05K7/20
Abstract: This disclosure relates to a heat dissipation structure, a display module, an electronic device, and a processing method for a display module. The heat dissipation structure includes: a first heat dissipation layer, a support layer and a second heat dissipation layer. The support layer and the second heat dissipation layer are disposed on a same side of the first heat dissipation layer, and an orthographic projection of the support layer onto the first heat dissipation layer and an orthographic projection of the second heat dissipation layer onto the first heat dissipation layer do not overlap.
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公开(公告)号：US20250008663A1
公开(公告)日：2025-01-02
申请号：US18702389
申请日：2023-08-09
Inventor： Shaopeng Li , Weiben Zhang , Jianhua Shu , Tianjun Deng , Peng Wang , Rongkun Fan , Bilun Zhang , Jialin Wang , Fei Li
Abstract: A display module is provided, which includes a display panel and a flexible circuit board bound to the display panel. The display panel includes a display area, a binding area, and a bending area arranged between the display area and the binding area. The bending area is bent to enable the binding area to be located at a backlight side of the display area. The flexible circuit board includes a bending portion, and a first portion and a second portion arranged at two opposite sides of the bending portion respectively. The first portion is bound to the binding area, and an orthographic projection of the first portion onto the binding area is located within the binding area. The bending portion is bent to enable the second portion to be stacked at a side of the first portion distal to the display panel. A display device is also provided.
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公开(公告)号：US20240310668A1
公开(公告)日：2024-09-19
申请号：US18675035
申请日：2024-05-27
Inventor： Chao Wang , Pan Zhao , Zhiliang Jiang , Fei Li , Dianjie Hou , Song Wang , Chang Liu , Qian Ma
IPC: G02F1/1333 , B32B1/00 , B32B3/04 , B32B3/30 , B32B7/12 , B32B15/04 , B32B15/08 , B32B37/18 , B32B38/00 , G02F1/1345 , H05K5/00
CPC classification number: G02F1/133305 , G02F1/1345 , G02F1/13452 , B32B1/00 , B32B3/04 , B32B3/30 , B32B7/12 , B32B15/043 , B32B15/08 , B32B37/182 , B32B38/0012 , B32B2311/00 , B32B2457/20 , H05K5/0018
Abstract: A display apparatus is provided. The display apparatus includes a display panel having a display portion, a connecting portion, and a bending portion; a main support layer; and an auxiliary support layer including a main portion and a folded-back portion connected to the main portion as a unitary structure. An edge portion of the display apparatus includes a stacked structure. The stacked structure includes the connecting portion; the folded-back portion on the connecting portion; at least a part of the main portion on a side of the folded-back portion away from the connecting portion; a part of the main support layer; and a part of the display portion on a side of the part of the main support layer away from the main portion. Layers of the stacked structure is curved toward a back side of the display apparatus.
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公开(公告)号：US12058807B2
公开(公告)日：2024-08-06
申请号：US17799917
申请日：2021-11-16
Inventor： Qianlin Pu , Fei Li , Zijian Wang , Xu Lu
CPC classification number: H05K1/0218 , H05K1/028 , H05K1/144 , H05K2201/043
Abstract: A circuit board and an electronic device, the circuit board includes a first wiring board including a first substrate and a first wiring layer disposed on a first side surface of the first substrate, and the first wiring layer includes a first ground wiring; the circuit board further includes a first protective layer and a first electromagnetic interference shielding layer sequentially stacked on a side of the first wiring layer away from the first substrate; the first protective layer has a first opening exposing at least a portion of a first ground wiring, the first opening is filled with a first conductive material, height difference between a surface of the first conductive material and a surface of the first protective layer away from the first substrate ranges from 0 to 2 microns, and the first conductive material connects the first electromagnetic interference shielding layer to the first grounding wiring.
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