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公开(公告)号：US20210090908A1
公开(公告)日：2021-03-25
申请号：US16911153
申请日：2020-06-24
Applicant: Apple Inc.
Inventor： Kishore N. Renjan , Bilal Mohamed Ibrahim Kani , Kyusang Kim , Manoj Vadeentavida , Pierpaolo Lupo , Prashanth S. Holenarsipur , Praveesh Chandran , Vinodh Babu , Yuta Kuboyama
IPC: H01L21/56 , H01L23/31 , H01L23/498 , H01L23/538 , H01L23/00 , H01L25/065
Abstract: Optical packages and methods of fabrication are described. In an embodiment, a controller chip is embedded along with optical components, including a photodetector (PD) and one or more emitters, in a single package.
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公开(公告)号：US20250105228A1
公开(公告)日：2025-03-27
申请号：US18475054
申请日：2023-09-26
Applicant: Apple Inc.
Inventor： Kyusang Kim , David M Kindlon , Kishore N Renjan , Manoj Vadeentavida , Bilal Mohamed Ibrahim Kani , Benjamin J Grena , Ali N Ergun , Jerzy S Guterman , Jee Tung Tan , Steven Webster , Parin R Dedhia , Howell John Chua Toc , Mandar S Painaik , Abhay Maheshwari , Wyeman Chen , Yanfeng Chen , Andrew N Leopold , Jun Zhang , Dhruv Gaba
IPC: H01L25/16
Abstract: Packages and methods of assembly are described in which barriers are utilized during overmolding to improve volumetric efficiency. In one embodiment, a barrier includes multiple variable height components located on an interior of the barrier, where the barrier prevents the variable height components from being overmolded during the encapsulation process. In one embodiment, a barrier includes a camera module mounted on an image sensor located on an interior of the barrier, where the barrier prevents the camera module and image sensor from being overmolded during the encapsulation process. In an embodiment, a barrier is mounted on a secondary tier with the secondary tier mounted on a primary tier, where the barrier prevents multiple connector components located on an interior of the barrier from being overmolded during the encapsulation process.
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公开(公告)号：US12153268B2
公开(公告)日：2024-11-26
申请号：US17646784
申请日：2022-01-03
Applicant: Apple Inc.
Inventor： Scott D. Morrison , Bilal Mohamed Ibrahim Kani , Kishore N. Renjan , Kyusang Kim , Lan H. Hoang , Manoj Vadeentavida
Abstract: Optical packages and methods of assembly are described in which various optical structures are integrated to increase efficiency. In an embodiment, an optical package includes an optical component with integrated guard fence to prevent the flow of adjacent opaque insulating material onto an optical surface. Additional optic structures are described such as light blocking structures within routing layer to reduce total internal reflection (TIR) within the routing layers, optical lenses, and the use of sacrificial layers to protect optical surfaces of the optical components during assembly.
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Patent Agency Ranking
公开(公告)号：US12095185B2
公开(公告)日：2024-09-17
申请号：US17478221
申请日：2021-09-17
Applicant: Apple Inc.
Inventor： Lan H. Hoang , Takayoshi Katahira , Bilal Mohamed Ibrahim Kani , Kishore N. Renjan , Manoj Vadeentavida , Jing Tao
CPC classification number: H01R12/718 , H01R12/52 , H01R12/57 , H01R12/58 , H01R12/62 , H01R12/79 , H01R13/6205 , H01R13/631
Abstract: Stacked circuit board structures and methods of assembly are described. In an embodiment, a stacked circuit board structure includes first circuit board and a second circuit board including a plurality of pins mounted thereon, and the plurality of pins are secured in a plurality of receptacles that are coupled with the first circuit board to provide electrical connection between the first circuit board and the second circuit board.
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公开(公告)号：US20240032203A1
公开(公告)日：2024-01-25
申请号：US18480303
申请日：2023-10-03
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Benjamin J. Grena , Kyusang Kim , David M. Kindlon , Pierpaolo Lupo , Kishore N. Renjan , Manoj Vadeentavida
CPC classification number: H05K1/186 , H05K1/189 , H05K1/0298 , H05K2201/10121 , H05K2201/10159 , H05K2201/10083 , H05K2201/10106 , H05K2201/10151 , H05K1/0274
Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.
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公开(公告)号：US11651976B2
公开(公告)日：2023-05-16
申请号：US16911153
申请日：2020-06-24
Applicant: Apple Inc.
Inventor： Kishore N. Renjan , Bilal Mohamed Ibrahim Kani , Kyusang Kim , Manoj Vadeentavida , Pierpaolo Lupo , Prashanth S. Holenarsipur , Praveesh Chandran , Vinodh Babu , Yuta Kuboyama
IPC: H01L21/56 , H01L23/31 , H01L23/498 , H01L23/538 , H01L23/00 , H01L25/065
CPC classification number: H01L21/565 , H01L21/561 , H01L21/568 , H01L23/3121 , H01L23/49811 , H01L23/49827 , H01L23/5383 , H01L23/5389 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/97 , H01L25/0655 , H01L2224/02372 , H01L2224/02373 , H01L2224/04105 , H01L2224/12105 , H01L2224/13099 , H01L2224/48135
Abstract: Optical packages and methods of fabrication are described. In an embodiment, a controller chip is embedded along with optical components, including a photodetector (PD) and one or more emitters, in a single package.
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公开(公告)号：US20210181039A1
公开(公告)日：2021-06-17
申请号：US16711247
申请日：2019-12-11
Applicant: Apple Inc.
Inventor： Pierpaolo Lupo , Bilal Mohamed Ibrahim Kani , Kishore N. Renjan , Kyusang Kim , Manoj Vadeentavida
Abstract: Temperature sensor packages and methods of fabrication are described. The temperature sensor packages in accordance with embodiments may be rigid or flexible. In some embodiments the temperature sensor packages are configured for touch sensing, and include an electrically conductive sensor pattern such as a thermocouple or resistance temperature detector (RTD) pattern. In some embodiments, the temperature sensor packages are configured for non-contact sensing an include an embedded transducer.
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公开(公告)号：US20180053731A1
公开(公告)日：2018-02-22
申请号：US15241665
申请日：2016-08-19
Applicant: Apple Inc.
Inventor： Phillip R. Sommer , Kishore N. Renjan , Manoj Vadeentavida
IPC: H01L23/552 , H01L21/56 , H01L23/29
CPC classification number: H01L23/552 , H01L21/56 , H01L21/565 , H01L23/293 , H01L23/3121 , H01L25/0655 , H01L2924/14 , H01L2924/1815 , H01L2924/3025 , H05K9/0024 , H05K9/0045
Abstract: A method for shielding a compartment in a module of an electronic device includes molding the module using a mold material that activates when a laser is applied. The method also includes cutting a trench on the mold of the module around a certain portion of the module using the laser. The method further includes plating the trench using a certain metal. The method also includes filling the trench with a filler material. The method further includes encapsulating the module, the mold, the trench, and the filler material.
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