公开(公告)号：US20240107249A1

公开(公告)日：2024-03-28

申请号：US18119600

申请日：2023-03-09

Applicant: Apple Inc.

Inventor： Kyusang KIM ,  Ali N. Ergun ,  Anthony D. Minervini ,  Bilal Mohamed Ibrahim Kani ,  Kishore N. Renjan

IPC: H04R31/00 ,  H04R1/04

CPC classification number: H04R31/00 ,  H04R1/04

Abstract: Embodiments of the present disclosure include a structure with a substrate, an electronic device, and a molding compound layer. The substrate has a first surface and a second surface opposite to the first surface, where the substrate includes a first opening. The electronic device is disposed on the first surface of the substrate and includes a second opening aligned with the first opening of the substrate. Further, the molding compound layer is disposed on the second surface of the substrate and includes a third opening aligned with the second opening of the electronic device.

公开(公告)号：US20230386865A1

公开(公告)日：2023-11-30

申请号：US18316962

申请日：2023-05-12

Applicant: Apple Inc.

Inventor： Kishore N. Renjan ,  Bilal Mohamed Ibrahim Kani ,  Kyusang Kim ,  Manoj Vadeentavida ,  Pierpaolo Lupo ,  Prashanth S. Holenarsipur ,  Praveesh Chandran ,  Vinodh Babu ,  Yuta Kuboyama

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/538 ,  H01L23/498 ,  H01L23/31 ,  H01L25/065

CPC classification number: H01L21/565 ,  H01L24/13 ,  H01L21/568 ,  H01L23/5389 ,  H01L23/5383 ,  H01L23/49827 ,  H01L23/49811 ,  H01L23/3121 ,  H01L24/97 ,  H01L21/561 ,  H01L25/0655 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/13099 ,  H01L2224/02373 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/02372 ,  H01L2224/48135

Abstract: Optical packages and methods of fabrication are described. In an embodiment, a controller chip is embedded along with optical components, including a photodetector (PD) and one or more emitters, in a single package.

公开(公告)号：US20230189445A1

公开(公告)日：2023-06-15

申请号：US18164180

申请日：2023-02-03

Applicant: Apple Inc.

Inventor： Bilal Mohamed Ibrahim Kani ,  Benjamin J. Grena ,  Kyusang Kim ,  David M. Kindlon ,  Pierpaolo Lupo ,  Kishore N. Renjan ,  Manoj Vadeentavida

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K1/186 ,  H05K1/189 ,  H05K1/0298 ,  H05K1/0274 ,  H05K2201/10083 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10159

Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.

公开(公告)号：US20230078536A1

公开(公告)日：2023-03-16

申请号：US17832346

申请日：2022-06-03

Applicant: Apple Inc.

Inventor： Ali N. Ergun ,  Bilal Mohamed Ibrahim Kani ,  Chang Liu ,  Ethan L. Huwe ,  Jeffrey J. Terlizzi ,  Jerzy S. Guterman ,  Jue Wang ,  Kishore N. Renjan ,  Kyusang Kim ,  Lan H. Hoang ,  Mandar S. Painaik ,  Manoj Vadeentavida ,  Sarah B. Gysbers ,  Takayoshi Katahira ,  Zhiqi Wang

IPC: H05K1/02 ,  H05K1/11 ,  H01Q1/22 ,  H01Q1/36

Abstract: System-in-package modules that can provide a high level of functionality, are space efficient, and are readily manufactured. In an example, a high-functionality system-in-package module can include both a wireless circuit and an antenna. In an example, a space-efficient system-in-package module can include different vertical interconnect paths that can be used to connect the wireless circuit to the antenna. In an example, instead of being shaped as a traditional rectangular cuboid, a space-efficient system-in-package module can have a shape that more closely matches contours of an enclosure for an electronic device.

公开(公告)号：US20230056922A1

公开(公告)日：2023-02-23

申请号：US17806412

申请日：2022-06-10

Applicant: Apple Inc.

Inventor： Bilal Mohamed Ibrahim Kani ,  Ali N. Ergun ,  Kishore N. Renjan ,  Kyusang Kim ,  Manoj Vadeentavida ,  Benjamin J. Grena ,  David M. Kindlon ,  Lan H. Hoang

IPC: H01L25/16 ,  H01L23/498 ,  H01R12/79 ,  H01R13/6581 ,  H01L23/31 ,  H01R12/62 ,  H01L21/56 ,  H01R43/20 ,  H01R12/59 ,  G01D11/24

Abstract: Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.

公开(公告)号：US20220270955A1

公开(公告)日：2022-08-25

申请号：US17685630

申请日：2022-03-03

Applicant: Apple Inc.

Inventor： Pierpaolo Lupo ,  Bilal Mohamed Ibrahim Kani ,  Kishore N. Renjan ,  Kyusang Kim ,  Manoj Vadeentavida

IPC: H01L23/498 ,  G01K13/20 ,  G01K1/08 ,  G01K7/02 ,  G01K7/16 ,  H01L23/00 ,  H01L23/28 ,  H01L23/538

Abstract: Temperature sensor packages and methods of fabrication are described. The temperature sensor packages in accordance with embodiments may be rigid or flexible. In some embodiments the temperature sensor packages are configured for touch sensing, and include an electrically conductive sensor pattern such as a thermocouple or resistance temperature detector (RTD) pattern. In some embodiments, the temperature sensor packages are configured for non-contact sensing an include an embedded transducer.

公开(公告)号：US20210337671A1

公开(公告)日：2021-10-28

申请号：US17212983

申请日：2021-03-25

Applicant: Apple Inc.

Inventor： Bilal Mohamed Ibrahim Kani ,  Benjamin J. Grena ,  Kyusang Kim ,  David M. Kindlon ,  Pierpaolo Lupo ,  Kishore N. Renjan ,  Manoj Vadeentavida

IPC: H05K1/18 ,  H05K1/02

Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.