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    Light emitting diode package and method for manufacturing the same
    21.
    发明授权
    Light emitting diode package and method for manufacturing the same 有权
    发光二极管封装及其制造方法

    公开(公告)号：US08853733B2

    公开(公告)日：2014-10-07

    申请号：US13965185

    申请日：2013-08-12

    Applicant: Advanced Optoelectronic Technology, Inc.

    Inventor： Che-Hsang Huang ,  Pin-Chuan Chen ,  Lung-Hsin Chen ,  Wen-Liang Tseng ,  Yu-Liang Huang

    IPC: H01L33/00 ,  H01L25/075 ,  H01L23/00 ,  H01L27/15 ,  H01L33/62

    CPC classification number: H01L27/15 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: An light-emitting diode (LED) package includes a substrate, a electrode structure embedded in the substrate, and a plurality of LED chips electrically connecting with the electrode structure. The substrate includes a main portion and a protruding portion extending from a bottom surface of the main portion. The main portion is located above the protruding portion. The electrode structure includes a first, a second and a third electrode spaced from each other. The third electrode is located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of the top surface of the main portion. Bottom surfaces of the first and second electrodes are exposed out of the bottom surface of the main portion. Bottom surface of the third electrode is covered by the protruding portion. The present disclosure also relates to a method for manufacturing the LED package.

    Abstract translation: 发光二极管（LED）封装包括衬底，嵌入衬底中的电极结构以及与电极结构电连接的多个LED芯片。 基板包括从主要部分的底表面延伸的主要部分和突出部分。 主要部分位于突出部分的上方。 电极结构包括彼此间隔开的第一，第二和第三电极。 第三电极位于第一和第二电极之间。 第一，第二和第三电极的顶表面暴露在主要部分的顶表面之外。 第一和第二电极的底表面暴露在主体部分的底表面之外。 第三电极的底表面被突出部分覆盖。 本公开还涉及一种用于制造LED封装的方法。

    Lens for light emitting device
    23.
    发明授权
    Lens for light emitting device 有权

    公开(公告)号：US10222024B2

    公开(公告)日：2019-03-05

    申请号：US15096277

    申请日：2016-04-12

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： Hsin-Chiang Lin ,  Lung-Hsin Chen ,  Wen-Liang Tseng

    IPC: F21V5/04 ,  G02B19/00 ,  F21Y115/10

    Abstract: A light emitting device includes a light source and a lens. The lens includes a light emitting surface, a top surface, four edge surfaces, and a bottom surface. The light emitting surface includes a central recess and two convex regions connecting the central recess at opposite sides. The light emitting surface is symmetrical about the central recess. The lens further defines a receiving space in the bottom surface and four positioning pins on the bottom surface. The receiving space includes a light incident surface. The two convex regions of the light emitting surface and the light incident surface are non-spherical surfaces. A maximum distance, dn, between the light source and the light incident surface is larger than a maximum distance, Dm, between the light incident surface and the light emitting surface. The light emitting device provides a wide-angle light distribution.

    Liquid crystal display base
    24.
    发明授权
    Liquid crystal display base 有权

    公开(公告)号：US10133133B1

    公开(公告)日：2018-11-20

    申请号：US15636582

    申请日：2017-06-28

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： Hsin-Chiang Lin ,  Chien-Cheng Kuo ,  Pin-Chuan Chen ,  Lung-Hsin Chen ,  Wen-Liang Tseng

    IPC: G02F1/1345 ,  G02F1/1368 ,  H01L27/12

    Abstract: A liquid crystal display base includes a liquid crystal module, both a power circuit and a integration circuit, a electric device mounted on the power circuit. The liquid crystal module includes a TFT array substrate and a color filter substrate mounted on the TFT array substrate. The power circuit board mounted on the TFT array substrate. The TFT array substrate has a first surface and a second surface opposite to the first surface, a plurality of through holes extend through the first surface and the second surface, each through hole has equal inner diameter from the first surface to the second surface. the TFT array substrate 11 is made of glass, sapphire, ceramic, a plurality of conductive layers are in the plurality of through holes, both the electric device, the integration circuit and the power circuit board are coupled with the liquid crystal module.

    LED package
    26.
    发明授权
    LED package 有权
    LED封装

    公开(公告)号：US09543482B2

    公开(公告)日：2017-01-10

    申请号：US14523425

    申请日：2014-10-24

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： Hou-Te Lin ,  Chao-Hsiung Chang ,  Pin-Chuan Chen ,  Lung-Hsin Chen

    IPC: H01L33/20 ,  H01L33/38 ,  H01L33/50 ,  H01L33/54

    CPC classification number: H01L33/507 ,  H01L33/505

    Abstract: The present invention is related to a light emitting diode (LED) package. The LED package includes a blue LED chip, a first electrode, a second electrode and a phosphor layer. The phosphor layer covers an outer periphery of the blue LED chip, except a bottom surface of the blue LED chip. The phosphor layer is mixed by yellow fluorescent powder and glue. The phosphor layer includes a main portion corresponding to a central portion of an emitting angle of the blue LED chip and an extending portion corresponding to a periphery of the emitting angle. An average thickness of the main portion is larger than the thickness of the extending portion.

    Abstract translation: 本发明涉及一种发光二极管（LED）封装。 LED封装包括蓝色LED芯片，第一电极，第二电极和荧光体层。 除了蓝色LED芯片的底面之外，荧光体层覆盖蓝色LED芯片的外周。 荧光粉层由黄色荧光粉和胶水混合。 磷光体层包括对应于蓝色LED芯片的发光角的中心部分的主要部分和对应于发光角度的周边的延伸部分。 主要部分的平均厚度大于延伸部分的厚度。

    Light emitting diode package
    29.
    发明授权
    Light emitting diode package 有权
    发光二极管封装

    公开(公告)号：US09018668B2

    公开(公告)日：2015-04-28

    申请号：US14077220

    申请日：2013-11-12

    Applicant: Advanced Optoelectronic Technology, Inc.

    Inventor： Hou-Te Lin ,  Pin-Chuan Chen ,  Lung-Hsin Chen

    IPC: H01L33/00 ,  H01L33/62 ,  H01L33/48 ,  H01L33/60

    CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/13 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A light emitting diode (LED) package includes a substrate, a first electrode, a second electrode, an LED die mounted on the substrate and electrically connected to the first and the second electrodes, and an encapsulation layer encapsulating the LED die. Both the first and the second electrodes are embedded in the substrate and spaced from each other. Each of the first and the second electrodes includes a top face and a bottom face, with the top face and the bottom face thereof being exposed at a top surface and a bottom surface of the substrate, respectively. The top face of the first electrode defines a first groove therein. An oxidation-resistant metal coating layer is filled in the first groove. A positive bonding pad of the LED die directly contacts with a top face of the first oxidation-resistant metal coating layer.

    Abstract translation: 发光二极管（LED）封装包括基板，第一电极，第二电极，安装在基板上并电连接到第一和第二电极的LED管芯，以及封装LED管芯的封装层。 第一和第二电极都嵌入基板并彼此间隔开。 第一电极和第二电极中的每一个分别包括顶面和底面，其顶面和底面分别在基板的顶表面和底表面处露出。 第一电极的顶面在其中限定第一凹槽。 在第一槽中填充抗氧化金属涂层。 LED管芯的正极接合焊盘直接与第一耐氧化金属被覆层的顶面接触。

    Method for manufacturing LED package struture and method for manufacturing LEDs using the LED packange struture
    30.
    发明授权
    Method for manufacturing LED package struture and method for manufacturing LEDs using the LED packange struture 有权
    LED封装结构的制造方法以及使用LED封装结构制造LED的方法

    公开(公告)号：US08846422B2

    公开(公告)日：2014-09-30

    申请号：US13714418

    申请日：2012-12-14

    Applicant: Advanced Optoelectronic Technology, Inc.

    Inventor： Pin-Chuan Chen ,  Hsin-Chiang Lin ,  Lung-Hsin Chen

    IPC: H01L21/00 ,  H01L33/60

    CPC classification number: H01L33/60 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/12041 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A method for manufacturing an LED package structure is disclosed wherein a substrate with a first electrode, a second electrode and a connecting layer is provided. A photoresist coating is provided to cover the substrate, the first electrode, the second electrode and the connecting layer. A portion of the photoresist coating is removed to define a groove corresponding to the connecting layer. A metal layer is formed in the groove to join the connecting layer. A remaining portion of the photoresist coating is removed and a concave is formed and surrounded by the metal layer. A reflective layer is formed on an inside surface of the concave to join the metal layer to form a reflective cup. An LED die is mounted in the reflective cup and electrically connects with the first and second electrodes.

    Abstract translation: 公开了一种制造LED封装结构的方法，其中提供了具有第一电极，第二电极和连接层的衬底。 提供光致抗蚀剂涂层以覆盖基板，第一电极，第二电极和连接层。 去除光刻胶涂层的一部分以限定对应于连接层的凹槽。 在槽中形成金属层以连接连接层。 去除光致抗蚀剂涂层的剩余部分，并形成凹陷并被金属层包围。 在凹面的内表面上形成反射层以连接金属层以形成反射杯。 LED管芯安装在反射杯中并与第一和第二电极电连接。

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