公开(公告)号：US20200335339A1

公开(公告)日：2020-10-22

申请号：US16867095

申请日：2020-05-05

Applicant: Applied Materials, Inc.

Inventor： Tzu-shun YANG ,  Rui CHENG ,  Karthik JANAKIRAMAN ,  Zubin HUANG ,  Diwakar KEDLAYA ,  Meenakshi GUPTA ,  Srinivas GUGGILLA ,  Yung-chen LIN ,  Hidetaka OSHIO ,  Chao LI ,  Gene LEE

IPC: H01L21/033

Abstract: The present disclosure provides forming nanostructures utilizing multiple patterning process with good profile control and feature transfer integrity. In one embodiment, a method for forming features on a substrate includes forming a first mandrel layer on a material layer disposed on a substrate. A first spacer layer is conformally formed on sidewalls of the first mandrel layer, wherein the first spacer layer comprises a doped silicon material. The first mandrel layer is selectively removed while keeping the first spacer layer. A second spacer layer is conformally formed on sidewalls of the first spacer layer and selectively removing the first spacer layer while keeping the second spacer layer.

公开(公告)号：US20200234932A1

公开(公告)日：2020-07-23

申请号：US16703140

申请日：2019-12-04

Applicant: Applied Materials, Inc.

Inventor： Venkata Sharat Chandra PARIMI ,  Zubin HUANG ,  Jian LI ,  Satish RADHAKRISHNAN ,  Rui CHENG ,  Diwakar N. KEDLAYA ,  Juan Carlos ROCHA-ALVAREZ ,  Umesh M. KELKAR ,  Karthik JANAKIRAMAN ,  Sarah Michelle BOBEK ,  Prashant Kumar KULSHRESHTHA ,  Vinay K. PRABHAKAR ,  Byung Seok KWON

IPC: H01J37/32 ,  C23C16/458 ,  C23C16/46 ,  C23C16/50

Abstract: Embodiments of the present disclosure generally relate to a pedestal for increasing temperature uniformity in a substrate supported thereon. The pedestal comprises a body having a heater embedded therein. The body comprises a patterned surface that includes a first region having a first plurality of posts extending from a base surface of the body at a first height, and a second region surrounding the central region having a second plurality of posts extending from the base surface at a second height that is greater than the first height, wherein an upper surface of each of the first plurality of posts and the second plurality of posts are substantially coplanar and define a substrate receiving surface.

公开(公告)号：US20180071889A1

公开(公告)日：2018-03-15

申请号：US15699645

申请日：2017-09-08

Applicant: Applied Materials, Inc.

Inventor： Zubin HUANG ,  Stephen A. WELLS ,  Ramesh GOPALAN ,  Gangadhar SHEELAVANT ,  Simon YAVELBERG

IPC: B24B37/32 ,  B24B37/04 ,  B24B37/34 ,  G01H11/06 ,  G08C17/02

Abstract: Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) of substrates. In one embodiment, a carrier head for a CMP apparatus is disclosed herein. The carrier head includes a body, a retaining ring, and a sensor assembly. The retaining ring is coupled to the body. The sensor assembly is positioned at least partially in the body. The sensor assembly includes a transmitter, an antenna, and a vibrational sensor. The transmitter has a first end and a second end. The antenna is coupled to the first end of the transmitter. The vibrational sensor is coupled to the second end. The vibrational sensor is configured to detect vibration during chemical mechanical processes with respect to radial, azimuthal, and angular axes of the carrier head.