公开(公告)号：US09089076B2

公开(公告)日：2015-07-21

申请号：US13543089

申请日：2012-07-06

申请人： Aaron R. Cox ,  William J. Grady, IV ,  Vinod Kamath ,  Jason A. Matteson ,  Jason E. Minyard

发明人： Aaron R. Cox ,  William J. Grady, IV ,  Vinod Kamath ,  Jason A. Matteson ,  Jason E. Minyard

IPC分类号： H05K7/20 ,  G06F1/20 ,  F28D15/04

CPC分类号： H05K7/20454 ,  F28D15/04 ,  G06F1/20 ,  H05K7/20218 ,  H05K7/20336 ,  Y10T29/49826

摘要： An apparatus and method is provided for conveying heat away from an electronic component. In one embodiment, a method positions a conformable thermal interface element in heat conducting contact with an electronic component. A heat conducting member is disposed within the conformable thermal interface element. The heat conducting member is coupled with a manifold so that the heat conducting member is in heat conducting contact with the manifold. The electronic component may be installed or removed without disassembly of the apparatus.

摘要翻译： 提供了用于将热量从电子部件传送出去的装置和方法。 在一个实施例中，一种方法将适形的热界面元件定位成与电子部件进行热传导接触。 导热构件设置在适形的热界面元件内。 导热构件与歧管连接，使得导热构件与歧管热传导接触。 可以在不拆卸设备的情况下安装或移除电子部件。

公开(公告)号：US08913384B2

公开(公告)日：2014-12-16

申请号：US13527947

申请日：2012-06-20

申请人： Milnes P. David ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Pritish R. Parida ,  Roger R. Schmidt ,  Mark E. Steinke

发明人： Milnes P. David ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Pritish R. Parida ,  Roger R. Schmidt ,  Mark E. Steinke

IPC分类号： H05K7/20 ,  H05K13/00

CPC分类号： H05K7/20745 ,  H05K7/2079 ,  H05K13/00

摘要： Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking of the electronics card within a socket of the electronic system. The thermal transfer structure is, in one embodiment, metallurgically bonded to a coolant-cooled structure and facilitates transfer of heat from the electronics card to coolant flowing through the coolant-cooled structure.

摘要翻译： 提供冷却装置和冷却剂冷却的电子系统，其包括热传递结构，其被配置成与弹簧力接合一个或多个电子卡，其中电子卡在电子系统的相应插座内对接。 冷却装置的热传递结构包括具有第一热传导表面的散热器和耦合到散热器的导电表面的导热弹簧组件，并被定位和配置成驻留在物理上耦合电子器件的第一表面 卡到散热器的第一表面，使电子卡在电子系统的插座内对接。 在一个实施例中，热传递结构是冶金结合到冷却剂冷却结构，并且有助于将热量从电子卡传递到流过冷却剂冷却结构的冷却剂。

公开(公告)号：US08900503B2

公开(公告)日：2014-12-02

申请号：US13247275

申请日：2011-09-28

申请人： Michael A. Boraas ,  Vinod Kamath ,  Michael S. Miller ,  Mark E. Steinke ,  Jamil A. Wakil

发明人： Michael A. Boraas ,  Vinod Kamath ,  Michael S. Miller ,  Mark E. Steinke ,  Jamil A. Wakil

IPC分类号： B29C45/14

CPC分类号： B23P15/26 ,  H01L21/565 ,  H01L23/3737 ,  H01L23/4334 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  Y10T29/53113 ,  H01L2924/00

摘要： Methods, apparatuses, and computer program products for forming an overmolded dual in-line memory module (DIMM) cooling structure are provided. Embodiments include identifying, by a tagging module, contextual information indicating circumstances in which the photograph was taken; based on the contextual information, selecting, by the tagging module, candidate profiles from a plurality of friend profiles associated with a profile of a user; and suggesting, by the tagging module to the user, the selected candidate profiles as potential friends to tag in the photograph.

摘要翻译： 提供了用于形成包覆成型的双列直插存储器模块（DIMM）冷却结构的方法，装置和计算机程序产品。 实施例包括通过标签模块识别指示拍摄照片的情况的上下文信息; 基于上下文信息，由标签模块从与用户的简档相关联的多个朋友简档中选择候选简档; 并且通过标签模块向用户提示所选择的候选简档作为在照片中标记的潜在朋友。

公开(公告)号：US08789384B2

公开(公告)日：2014-07-29

申请号：US12729859

申请日：2010-03-23

申请人： Eric A. Eckberg ,  Vinod Kamath ,  Howard V. Mahaney, Jr. ,  William M. Megarity ,  Mark E. Steinke

发明人： Eric A. Eckberg ,  Vinod Kamath ,  Howard V. Mahaney, Jr. ,  William M. Megarity ,  Mark E. Steinke

IPC分类号： F25B27/00 ,  F25B7/00 ,  F25D23/12 ,  F28D15/00 ,  H05K7/20

CPC分类号： F28D1/0435 ,  F28D1/0477 ,  H05K7/2079

摘要： Embodiments of the present invention include a cooling system and method for cooling a computer rack by circulating liquid coolant through different sections of a rack heat exchanger under separately controlled flow and temperature conditions. In a method according to one embodiment, a first liquid coolant is supplied to a first section of an air-to-liquid heat exchanger. A second liquid coolant is supplied to a second section of the air-to-liquid heat exchanger at a different temperature than the first liquid coolant. Airflow is generated through rack-mounted computer components to the first and second sections of the air-to-liquid heat exchanger. The flow rates of the first and second liquid coolants are independently controlled to enforce a target cooling parameter. The independent operation of the first and second fin tube sections allows for the increased use of un-chilled water without sacrificing heat removal objectives.

摘要翻译： 本发明的实施例包括冷却系统和方法，用于通过在独立控制的流量和温度条件下将液体冷却剂循环通过架式热交换器的不同部分来冷却计算机机架。 在根据一个实施例的方法中，第一液体冷却剂被供应到空气对液体热交换器的第一部分。 第二液体冷却剂以与第一液体冷却剂不同的温度供应到空气至液体热交换器的第二部分。 气流通过机架安装的计算机部件产生到空气 - 液体热交换器的第一和第二部分。 独立地控制第一和第二液体冷却剂的流量，以实施目标冷却参数。 第一和第二翅片管部分的独立操作允许增加使用未冷却的水而不牺牲散热目的。

公开(公告)号：US08587943B2

公开(公告)日：2013-11-19

申请号：US13305092

申请日：2011-11-28

申请人： Richard M. Barina ,  Vinod Kamath ,  Chunjian Ni ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

发明人： Richard M. Barina ,  Vinod Kamath ,  Chunjian Ni ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

IPC分类号： H05K7/20 ,  G06F1/20

CPC分类号： H01L23/473 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/4093 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A liquid-cooled computer memory system includes first and second blocks in fluid communication with a chilled liquid source. A plurality of spaced-apart heat transfer pipes extend along a system board between memory module sockets from the first manifold block to the second manifold block. The heat transfer pipes may be liquid flow pipes circulating the chilled liquid between the memory module sockets. Alternatively, the heat transfer pipes may be closed heat pipes that conduct heat from the memory modules to the liquid-cooled blocks. A separate heat spreader is provided to thermally bridge each memory module to the adjacent heat transfer pipes.

摘要翻译： 液冷计算机存储器系统包括与冷却液体源流体连通的第一和第二块。 多个间隔开的传热管沿着系统板在从第一歧管块到第二歧管块的存储器模块插槽之间延伸。 传热管可以是将冷却液体循环在存储器模块插槽之间的液体流管。 或者，传热管可以是将热量从存储器模块传导到液冷块的封闭热管。 提供单独的散热器以将每个存储器模块热桥接到相邻的传热管。

公开(公告)号：US20130220423A1

公开(公告)日：2013-08-29

申请号：US13403094

申请日：2012-02-23

申请人： Keith M. Campbell ,  Vinod Kamath ,  Christopher L. Wood

发明人： Keith M. Campbell ,  Vinod Kamath ,  Christopher L. Wood

IPC分类号： F17D3/00

CPC分类号： F17D3/00 ,  G01M3/18 ,  Y10T137/0318

摘要： Methods, apparatuses, and computer program products for responding to moisture at one or more zones around an outer surface of a liquid-carrying pipe are provided. Embodiments include monitoring, by a moisture correction controller, a plurality of moisture sensors, each moisture sensor configured to detect moisture at a separate zone around the outer surface of the liquid-carrying pipe; based on the monitoring of the plurality of moisture sensors, calculating and tracking, for each zone, a level of moisture detected by a moisture sensor; based on the tracked levels of moisture detected at the zones, selecting, between condensation or a leak from within the liquid-carrying pipe as a source of the moisture detected at the zones around the liquid-carrying pipe; and administering a corrective action based on the selection of the source of the moisture detected at the zones around the liquid-carrying pipe.

摘要翻译： 提供了用于在液体输送管的外表面周围的一个或多个区域响应水分的方法，装置和计算机程序产品。 实施例包括通过湿度校正控制器监测多个湿度传感器，每个湿度传感器被配置为检测在液体输送管的外表面周围的分离区域的水分; 基于多个湿度传感器的监测，对于每个区域，计算和跟踪由湿度传感器检测的水分的水平; 基于在区域处检测到的水分的跟踪水平，从在液体输送管内的冷凝或泄漏之间选择作为在液体输送管周围的区域检测到的水分的来源; 并且基于在所述液体输送管周围的区域中检测到的水分来源的选择来施加校正动作。

公开(公告)号：US20130096720A1

公开(公告)日：2013-04-18

申请号：US13274835

申请日：2011-10-17

申请人： Thomas M. Brey ,  Vinod Kamath ,  Jason A. Matteson ,  Billy W. Medlin

发明人： Thomas M. Brey ,  Vinod Kamath ,  Jason A. Matteson ,  Billy W. Medlin

IPC分类号： G05D23/00

CPC分类号： G06F1/206 ,  G06F1/3206 ,  H05K7/20209 ,  H05K7/20718 ,  Y02D10/16

摘要： A computer-implemented method comprises accessing historical operating data for a unit of information technology equipment, wherein the historical operating data includes power consumption, fan speed, inlet air temperature, workload, and any processor throttling events at various points in time. The method further comprises receiving user input selecting a fan speed, and using the historical operating data to determine a performance impact that is expected from operating the unit at the selected fan speed, where the power consumption is a proxy for performance. The estimated performance impact of the selected fan speed and one or more alternative fan speeds is then displayed.

摘要翻译： 计算机实现的方法包括访问信息技术设备单元的历史操作数据，其中历史操作数据包括功率消耗，风扇速度，入口空气温度，工作负载以及在不同时间点的任何处理器调节事件。 该方法还包括接收选择风扇速度的用户输入，以及使用历史操作数据来确定在所选择的风扇速度下操作单元所期望的性能影响，其中功耗是性能的代理。 然后显示所选风扇速度和一个或多个替代风扇速度的估计性能影响。

公开(公告)号：US20130073096A1

公开(公告)日：2013-03-21

申请号：US13234563

申请日：2011-09-16

申请人： Thomas M. Brey ,  Vinod Kamath ,  Jason A. Matteson

发明人： Thomas M. Brey ,  Vinod Kamath ,  Jason A. Matteson

IPC分类号： G05D23/19 ,  G05D7/06

CPC分类号： G05B13/02 ,  G05D23/1917 ,  G06F1/206 ,  G06F2200/201 ,  H05K7/20836 ,  Y02D10/16

摘要： A fluid-cooled computer system includes a plurality of heat-generating components and a cooling system configured for supplying a cooling fluid at a controlled cooling fluid flow rate to cool the heat-generating components. A temperature-based cooling control circuit includes a temperature sensor configured for sensing a temperature of the heat-generating components and control logic for increasing a cooling fluid flow rate in response to the temperature exceeding a temperature threshold. A power-based cooling control circuit is configured for identifying and quantifying an increasing power consumption trend over a target time interval and, during a period that the temperature of the electronic device does not exceed the temperature threshold, increasing a cooling fluid flow rate to the electronic device in response to the magnitude of the increasing power consumption trend exceeding a power threshold. In one option, the fluid-cooled computer system is a server and the heat-generating components include a processor.

摘要翻译： 流体冷却的计算机系统包括多个发热部件和冷却系统，该冷却系统构造成以受控的冷却流体流速供应冷却流体以冷却发热部件。 基于温度的冷却控制电路包括温度传感器，其被配置为感测发热部件的温度和控制逻辑，用于响应于超过温度阈值的温度来增加冷却流体流量。 基于功率的冷却控制电路被配置为识别和量化目标时间间隔上的增加的功耗趋势，并且在电子设备的温度不超过温度阈值的时段期间，将冷却流体流量增加到 响应于超过功率阈值的增加的功率消耗趋势的幅度。 在一个选择中，流体冷却的计算机系统是服务器，并且发热组件包括处理器。

公开(公告)号：US08385069B2

公开(公告)日：2013-02-26

申请号：US12785779

申请日：2010-05-24

申请人： Madhusudan K. Iyengar ,  Vinod Kamath ,  Howard V. Mahaney, Jr. ,  Mark E. Steinke ,  Aparna Vallury

发明人： Madhusudan K. Iyengar ,  Vinod Kamath ,  Howard V. Mahaney, Jr. ,  Mark E. Steinke ,  Aparna Vallury

IPC分类号： H05K7/20

CPC分类号： G06F1/20 ,  G06F2200/201

摘要： An apparatus for cooling a memory module installed in a computer system includes a liquid coolant conduit that is connected to a conduit support structure having a form factor selectively securable within a first preconfigured memory module socket of the computer system in order to position the liquid coolant conduit above the first socket. A heat pipe provides direct thermal contact between the liquid conduit and a heat spreader assembly in direct thermal contact with a face of the memory module. The apparatus may include a second heat pipe and second heat spreader assembly for similarly cooling a second memory module. In alternative configurations, the apparatus may cool memory modules on opposing sides of the conduit or memory modules that are both on the same side of the conduit.

摘要翻译： 用于冷却安装在计算机系统中的存储器模块的装置包括液体冷却剂导管，该液体冷却剂导管连接到导管支撑结构，导管支撑结构具有选择性地固定在计算机系统的第一预配置存储器模块插槽内的形状因子，以便定位液体冷却剂导管 在第一个插槽之上。 热管提供液体导管与散热器组件之间的直接热接触，与存储器模块的表面直接热接触。 该装置可以包括用于类似地冷却第二存储器模块的第二热管和第二散热器组件。 在替代配置中，设备可以冷却导管的相对侧上的存储器模块或存储器模块，这些存储器模块都在导管的同一侧。

公开(公告)号：US20120279686A1

公开(公告)日：2012-11-08

申请号：US13102200

申请日：2011-05-06

申请人： Timothy J. CHAINER ,  David P. GRAYBILL ,  Madhusudan K. IYENGAR ,  Vinod KAMATH ,  Bejoy J. KOCHUPARAMBIL ,  Roger R. SCHMIDT ,  Mark E. STEINKE

发明人： Timothy J. CHAINER ,  David P. GRAYBILL ,  Madhusudan K. IYENGAR ,  Vinod KAMATH ,  Bejoy J. KOCHUPARAMBIL ,  Roger R. SCHMIDT ,  Mark E. STEINKE

IPC分类号： F28D15/02 ,  F28D15/00

CPC分类号： H05K7/20336 ,  F28D15/02 ,  H05K7/20509 ,  H05K7/20772 ,  H05K7/20936

摘要： Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

摘要翻译： 提供了用于促进电子部件的冷却的装置和方法。 该装置包括液冷冷板和与冷板相关联的散热器。 冷板包括在冷板内延伸的多个冷却剂承载通道部分，以及具有比待冷却部件的表面积更大的表面积的导热表面。 散热器包括一个或多个包括多个热管段的热管。 一个或多个热管部分与冷板的第一区域部分对准，即，与要冷却的表面对准，并且部分地对准于位于第一区域外部的冷板的第二区域。 一个或多个热管促进热量从电子部件分配到位于冷板的第二区域中的冷板的冷却剂承载通道部分。