Abstract:
Embodiments relate to a method for forming reliable interconnects by the use of a device layer that can serve as a barrier or an etch stop layer, among other applications. The device layer is UV resistant in that its dielectric constant and stress remain stable or relatively stable when subjected to UV curing.
Abstract:
An integrated circuit system that includes: providing a substrate and a material layer; measuring a parameter of the material layer; and correlating the thickness of an anti-reflective layer to the measured parameter of the material layer for critical dimension control.
Abstract:
An optical proximity correction (OPC) model incorporates inline process variation data. OPC is performed by adjusting an input mask pattern with a mask bias derived from the OPC model to correct errors in the input mask pattern.
Abstract:
A semiconductor chip having an exposed metal terminating pad thereover, and a separate substrate having a corresponding exposed metal bump thereover are provided. A conducting polymer plug is formed over the exposed metal terminating pad. A conforming interface layer is formed over the conducting polymer plug. The conducting polymer plug of the semiconductor chip is aligned with the corresponding metal bump. The conforming interface layer over the conducting polymer plug is mated with the corresponding metal bump. The conforming interface layer is thermally decomposed, adhering and permanently attaching the conducting polymer plug with the corresponding metal bump. Methods of forming and patterning a nickel carbonyl layer are also disclosed.