公开(公告)号：US07660111B2

公开(公告)日：2010-02-09

申请号：US11947299

申请日：2007-11-29

申请人： Dennis R. Barringer ,  Robert R. Genest ,  John J. Loparco ,  Wade H. White

发明人： Dennis R. Barringer ,  Robert R. Genest ,  John J. Loparco ,  Wade H. White

IPC分类号： H05K7/20 ,  H05K5/00

CPC分类号： H05K7/20727

摘要： A method and incorporated assembly is provided for cooling of an electronic device or component. The assembly comprises a thermal duct having a fixed duct portion and a removable duct portion. The portions each have complementary interlocking components to secure them to one another. Also a first attachment block is provided. The first attachment block has complementary interlocking portions with the fixed and removable duct portions such that the block can be secured at least partially to each of the fixed duct portion and the removable duct portion. A second attachment block is also provided that has a complementary interlocking portion with the removable duct portion. This second attachment block can be secured to one or more electronic devices requiring cooling.

摘要翻译： 提供了一种用于冷却电子设备或组件的方法和组装的组件。 组件包括具有固定管道部分和可移除管道部分的热导管。 这些部分各自具有互补的互锁部件以将它们彼此固定。 还提供了第一附接块。 第一附接块具有互补的互锁部分，其具有固定和可移除的管道部分，使得块可以至少部分地固定到固定管道部分和可移除管道部分中的每一个。 还提供了第二附接块，其具有与可移除管道部分互补的互锁部分。 该第二连接块可以固定到需要冷却的一个或多个电子设备。

公开(公告)号：US07539013B2

公开(公告)日：2009-05-26

申请号：US11862262

申请日：2007-09-27

申请人： Mark A. Brandon ,  Richard M. Ecker ,  Edward F. Furey ,  John J. Loparco

发明人： Mark A. Brandon ,  Richard M. Ecker ,  Edward F. Furey ,  John J. Loparco

IPC分类号： H05K7/20

CPC分类号： G06F1/181

摘要： A method and incorporated automatic air blockage assembly door is provided. The assembly comprises an air blockage door secured to a frame, capable of moving from a first to a second position via a pivot block and a shaft. The movement of the door is enabled by securing the door via the pivot block to an arm mechanism. The mechanism includes a pivot member and an activation pin. The activation and deactivation of the pin causes the movement of the door.

摘要翻译： 提供了一种方法并结合了自动空气堵塞装配门。 组件包括固定到框架上的空气阻塞门，其能够经由枢轴块和轴从第一位置移动到第二位置。 门的移动通过将门经由枢轴块固定到臂机构来实现。 该机构包括枢轴构件和活动销。 销的激活和停用导致门的移动。

公开(公告)号：US20090086426A1

公开(公告)日：2009-04-02

申请号：US11862262

申请日：2007-09-27

申请人： Mark A. Brandon ,  Richard M. Ecker ,  Edward F. Furey ,  John J. Loparco

发明人： Mark A. Brandon ,  Richard M. Ecker ,  Edward F. Furey ,  John J. Loparco

IPC分类号： H05K7/20 ,  A47B81/00

CPC分类号： G06F1/181

摘要： A method and incorporated automatic air blockage assembly door is provided. The assembly comprises an air blockage door secured to a frame, capable of moving from a first to a second position via a pivot block and a shaft. The movement of the door is enabled by securing the door via the pivot block to an arm mechanism. The mechanism includes a pivot member and an activation pin. The activation and deactivation of the pin causes the movement of the door.

摘要翻译： 提供了一种方法并结合了自动空气堵塞装配门。 组件包括固定到框架上的空气阻塞门，其能够经由枢轴块和轴从第一位置移动到第二位置。 门的移动通过将门经由枢轴块固定到臂机构来实现。 该机构包括枢轴构件和活动销。 销的激活和停用导致门的移动。

公开(公告)号：US07378603B2

公开(公告)日：2008-05-27

申请号：US11262050

申请日：2005-10-28

申请人： Gary F. Goth ,  John J. Loparco ,  Andrew Rybak ,  John G. Torok

发明人： Gary F. Goth ,  John J. Loparco ,  Andrew Rybak ,  John G. Torok

IPC分类号： H05K9/00

CPC分类号： H05K7/1487

摘要： An improved method and a cassette assembly for protecting electronic components, comprising of a housing that encloses the electronic components disposed over an insulator. The housing also encases a scissor jack component that can move from a first to a second position to enable actuation and unmating of the cassette assembly, such as to a next level of packaging. The housing has an overhang design, having complementary upper openings and lower cable shroud areas for supporting cable connections and for providing heat dissipation relief and EMC containment. Alternate designs provide for other components such as a honey comb screen and an EMC gasket to further enable EMC containment. In addition, other components such as an actuation trap door, a retention feature and card support members or support struts can be added to the design to enable better actuation and provide for an improved structural rigidity.

摘要翻译： 一种改进的方法和用于保护电子部件的盒组件，包括外壳，其包围设置在绝缘体上的电子部件。 壳体还包括可从第一位置移动到第二位置的剪刀千斤顶部件，以使得盒组件的致动和脱离能够进入下一级包装。 壳体具有突出设计，具有互补的上部开口和下部电缆护罩区域，用于支撑电缆连接并提供散热释放和EMC防护。 替代设计提供了其他组件，如蜂窝梳屏和EMC垫片，以进一步实现EMC容纳。 此外，可以向设计中添加诸如致动捕获门，保持特征和卡支撑构件或支撑支柱的其它部件，以实现更好的致动并提供改进的结构刚性。

公开(公告)号：US06921272B2

公开(公告)日：2005-07-26

申请号：US10435917

申请日：2003-05-12

申请人： John S. Corbin, Jr. ,  William P. Kostenko ,  John J. Loparco ,  Budy D. Notohardjono ,  John G. Torok

发明人： John S. Corbin, Jr. ,  William P. Kostenko ,  John J. Loparco ,  Budy D. Notohardjono ,  John G. Torok

IPC分类号： H01R12/16 ,  H01R13/24 ,  H01R12/00

CPC分类号： H01R12/7076 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01R13/24 ,  H01L2924/00

摘要： An electrical contact assembly includes a first module having a first set of electrical contacts, a second module having a second set of electrical contacts, a shape-generating module, and a clamping arrangement. The second set of electrical contacts is aligned with the first set of electrical contacts and the shape-generating module is arranged to impart a shape to the second module such that the second set of electrical contacts is driven toward the first set of electrical contacts. The clamping arrangement is arranged to clamp the first, the second, and the shape-generating modules together, thereby resulting in a positive contact force between the first and second sets of electrical contacts. The positive contact force is equal to or greater than a predefined value.

摘要翻译： 电触头组件包括具有第一组电触点的第一模块，具有第二组电触点的第二模块，形状产生模块和夹紧装置。 第二组电触头与第一组电触头对准，并且形状产生模块被布置成赋予第二模块形状，使得第二组电触点朝向第一组电触点驱动。 夹持装置被布置成将第一，第二和形状发生模块夹在一起，从而导致第一和第二组电触点之间的正接触力。 正接触力等于或大于预定值。

公开(公告)号：US08864379B2

公开(公告)日：2014-10-21

申请号：US12943921

申请日：2010-11-10

申请人： Kristina M. Hays ,  John J. Loparco ,  Steven C. McIntosh ,  Stephen P. Mroz ,  Kevin R. Qualters ,  Scott A. Shurson

发明人： Kristina M. Hays ,  John J. Loparco ,  Steven C. McIntosh ,  Stephen P. Mroz ,  Kevin R. Qualters ,  Scott A. Shurson

IPC分类号： A47B88/00 ,  H05K7/14

CPC分类号： H05K7/1489

摘要： A system to carry a drawer may include a fixed-length rail to be fastened to a server rack. The system may also include a roller fastened to the fixed-length rail on one side of the roller so that the roller spins freely. The system may further include a channel carried by a drawer, and the channel is sized to permit the roller to traverse a portion of the channel.

摘要翻译： 携带抽屉的系统可以包括要固定到服务器机架的固定长度的轨道。 该系统还可以包括在辊的一侧固定到固定长度导轨上的辊，使得辊自由地旋转。 该系统可以进一步包括由抽屉支承的通道，并且该通道的尺寸被设计成允许滚筒穿过通道的一部分。

公开(公告)号：US08079481B2

公开(公告)日：2011-12-20

申请号：US11262051

申请日：2005-10-28

申请人： Shawn M. Canfield ,  John J. Loparco ,  Budy D. Notohardjono ,  John G. Torok

发明人： Shawn M. Canfield ,  John J. Loparco ,  Budy D. Notohardjono ,  John G. Torok

IPC分类号： H05K7/14

CPC分类号： H05K7/183

摘要： A cabinet assembly is provided that can be quickly assembled and disassembled inside side racks used for the purpose of housing computer systems. The assembly comprises a plurality of side plates that can be secured to inside rack sides, preferably through flexible flanges, a plurality of top and bottom plates that can be secured to the side plates, and a mid-plate is disposed substantially horizontally between the top and bottom plates. Alternately, the assembly can also comprise at least one rear plate that can be secured to the side plates to provide a third side for the assembly. The rear plates having openings designed to allow for front to back air flow ventilation. The assembly can also have at least one divider plate, and preferably a plurality of divider plates, that can be secured to the top and bottom and/or mid-plate(s). In such a case, the divider plates are disposed above and/or below the mid-plate and preferably each have an upper divider plate and a lower divider plate.

摘要翻译： 提供了一个柜组件，可以在用于容纳计算机系统的侧面机架内部快速组装和拆卸。 组件包括多个侧板，其可以优选地通过柔性凸缘固定在机架侧面内;多个顶板和底板可固定到侧板，中间板基本上水平地设置在顶部 和底板。 或者，组件还可以包括至少一个后板，其可固定到侧板以提供用于组件的第三侧。 后板具有设计成允许前后气流通风的开口。 组件还可以具有至少一个分隔板，并且优选地多个分隔板，其可以固定到顶部和底部和/或中间板。 在这种情况下，分隔板设置在中板的上方和/或下方，并且优选地各自具有上分隔板和下分隔板。

公开(公告)号：US07766684B2

公开(公告)日：2010-08-03

申请号：US12035595

申请日：2008-02-22

申请人： Dennis R. Barringer ,  William L. Brodsky ,  Francesco Chiarella ,  John J. Loparco ,  Michael F. Scanlon ,  John G. Torok

发明人： Dennis R. Barringer ,  William L. Brodsky ,  Francesco Chiarella ,  John J. Loparco ,  Michael F. Scanlon ,  John G. Torok

IPC分类号： H01R13/62

CPC分类号： H05K7/1407

摘要： A mechanism for electrically connecting a first electronic component to a second electronic component. The mechanism includes an actuating member disposed in the first electronic component including a first connector half and an actuation screw having a head and a threaded end. The actuation screw is located in the first electronic component wherein rotation of the actuation screw urges the actuating member in a direction substantially perpendicular to an axis of the actuation screw thereby engaging the first connector half to a second connector half disposed in the second electronic component. A method for electrically connecting a first electronic component to a second electronic component includes rotating an actuation screw disposed in the first electronic component and in operable communication with an actuating member disposed in the first electronic component, the actuating member including a first connector half. The actuating member is urged in a direction substantially perpendicular to an axis of the actuation screw by the rotation of the actuation screw and the first connector half is engaged to a second connector half disposed in the second electronic component.

摘要翻译： 一种用于将第一电子部件电连接到第二电子部件的机构。 该机构包括设置在第一电子部件中的致动部件，其包括第一连接器半部和具有头部和螺纹端部的致动螺钉。 致动螺钉位于第一电子部件中，其中致动螺杆的旋转沿着基本上垂直于致动螺钉的轴线的方向推动致动构件，从而将第一连接器半部接合到设置在第二电子部件中的第二连接器半体。 用于将第一电子部件电连接到第二电子部件的方法包括旋转设置在第一电子部件中的致动螺钉，并且与设置在第一电子部件中的致动部件可操作地连通，致动部件包括第一连接器半部。 致动构件通过致动螺钉的旋转而沿着基本上垂直于致动螺钉的轴线的方向被推动，并且第一连接器半部被接合到设置在第二电子部件中的第二连接器半体上。

公开(公告)号：US20080067696A1

公开(公告)日：2008-03-20

申请号：US11532329

申请日：2006-09-15

申请人： Gary F. Goth ,  William P. Kostenko ,  John J. Loparco ,  Prabjit Singh ,  John G. Torok

发明人： Gary F. Goth ,  William P. Kostenko ,  John J. Loparco ,  Prabjit Singh ,  John G. Torok

IPC分类号： H01L23/52

CPC分类号： H01L23/26 ,  H01L23/3672 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2224/0401

摘要： Disclosed a multi-chip module with solder corrosion prevention including one or more chips connected to a substrate by soldering, the substrate disposed on a printed circuit board. The multi-chip module also includes a quantity of molecular sieve desiccant, and a first cover to contain the one or more chips, the substrate, and the molecular sieve desiccant, the first cover having a seal to the printed circuit board.

摘要翻译： 公开了一种具有焊料防腐蚀性的多芯片模块，包括通过焊接连接到衬底的一个或多个芯片，该衬底设置在印刷电路板上。 多芯片模块还包括一定数量的分子筛干燥剂，以及包含一个或多个芯片，基底和分子筛干燥剂的第一盖，第一盖具有与印刷电路板的密封。

公开(公告)号：US20080067651A1

公开(公告)日：2008-03-20

申请号：US11532396

申请日：2006-09-15

申请人： Gary F. Goth ,  William P. Kostenko ,  John J. Loparco ,  Prabjit Singh ,  John G. Torok

发明人： Gary F. Goth ,  William P. Kostenko ,  John J. Loparco ,  Prabjit Singh ,  John G. Torok

IPC分类号： H01L21/00

CPC分类号： H01L23/562 ,  H01L23/041 ,  H01L23/053 ,  H01L24/16 ,  H01L24/32 ,  H01L25/0655 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2224/0401

摘要： Disclosed is a multi-chip module with solder corrosion prevention including one or more chips connected to a substrate by soldering, the substrate situated on a printed circuit board. The multi-chip module also includes a molecular sieve desiccant chamber containing a quantity of molecular sieve desiccant and a first cover to contain the one or more chips, the substrate, and the molecular sieve desiccant, the first cover having a seal to the printed circuit board. The molecular sieve desiccant chamber is connected to the first cover via a first fluid pathway and a second fluid pathway.

摘要翻译： 公开了一种具有焊料防腐蚀的多芯片模块，包括通过焊接连接到基板的一个或多个芯片，位于印刷电路板上的基板。 多芯片模块还包括含有一定数量的分子筛干燥剂的分子筛干燥剂室和含有一个或多个碎片的第一盖子，基底和分子筛干燥剂，第一盖子具有印刷电路的密封 板。 分子筛干燥剂室经由第一流体路径和第二流体路径连接到第一盖。