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234 条记录 (耗时 0.021 秒)

    STREET LIGHTING POLE BASE
    11.
    发明申请
    STREET LIGHTING POLE BASE 有权

    公开(公告)号：US20210250053A1

    公开(公告)日：2021-08-12

    申请号：US16972842

    申请日：2019-06-17

    申请人： SIGNIFY HOLDING B.V.

    发明人： Petra BIJL ,  Koos VAN OORSCHOT ,  Alouisius Johannes Gerardus Maria WILLEMSE ,  Ay Ling DE GOEDEREN-OEI

    IPC分类号： H04B1/036

    摘要： The present invention relates to a street lighting pole base (10), i.a. comprising a sub-divider (38) arranged in a first bay (20a) and adapted to split an airflow (46) from an individual air inlet (28) into a first sub-airflow (48a) intended to mainly cool a first heat dissipating device used for wireless telecommunication (34a) when mounted in a first position (36a) but substantially not a second heat dissipating device used for wireless telecommunication (34b) when mounted in a second position (36b) and a second sub-airflow (48b) intended to mainly cool the second heat dissipating device used for wireless telecommunication but substantially not the first heat dissipating device used for wireless telecommunication. The present invention also relates to a street lighting pole (100) comprising such a base, and to a method of cooling first and second heat dissipating device used for wireless telecommunications mounted in such a base or pole.

    Cooling structure, cooling structure manufacturing method, power amplifier, and transmitter
    12.
    发明授权
    Cooling structure, cooling structure manufacturing method, power amplifier, and transmitter 有权

    公开(公告)号：US11004772B2

    公开(公告)日：2021-05-11

    申请号：US16615441

    申请日：2018-06-15

    申请人： NEC CORPORATION

    发明人： Takahiro Nakagawa

    IPC分类号： H01L23/473 ,  H01L21/48 ,  F28F13/06 ,  H04B1/036

    摘要： A cooling structure according to the present invention is provided with: a base material formed with a cooling water flow passageway; a pipe which includes a first layer formed on an outer surface of the base material, and a second layer formed on the outside of the first layer; and a plate having the pipe cast therein. The base material is configured from a highly thermally conductive first material. The first layer is configured from a heat-resistant second material. The second layer is configured from a third material having high affinity with the second material. The plate is configured from a highly thermally conductive fourth material. The second material and the third material respectively have high affinity with the fourth material.

    HEAT TRANSFER IN OPTICAL TRANSCEIVER
    13.
    发明申请
    HEAT TRANSFER IN OPTICAL TRANSCEIVER 有权

    公开(公告)号：US20210105025A1

    公开(公告)日：2021-04-08

    申请号：US16945167

    申请日：2020-07-31

    申请人： Infinera Corporation

    发明人： Franklin Wall, JR.

    IPC分类号： H04B1/036 ,  H04B10/116 ,  H04B10/43 ,  H04B1/3827 ,  H05K7/20

    摘要： An optical transceiver with a built-in heat transfer structure is described. The heat transfer structure can connect one or more circuit regions of the optical transceiver to a heat sink while bypassing circuit regions that may impede the transfer of heat from the one or more circuit regions. The heat transfer structure may directly contact the one or more circuit regions, and the heat sink and may include an opening to avoid contact with the circuit regions to be bypassed.

    ANTENNA APPARATUS AND COMMUNICATIONS TERMINAL APPARATUS
    14.
    发明申请
    ANTENNA APPARATUS AND COMMUNICATIONS TERMINAL APPARATUS 审中-公开

    公开(公告)号：US20200313272A1

    公开(公告)日：2020-10-01

    申请号：US16821707

    申请日：2020-03-17

    申请人： SHARP KABUSHIKI KAISHA

    发明人： NAOKI SOTOMA

    IPC分类号： H01Q1/02 ,  H04B1/036

    摘要： An antenna apparatus includes: an antenna substrate including a heat source provided to at least one face of the antenna substrate; and a heat dissipator configured to dissipate heat produced in the heat source. The heat dissipator contacts with at least a portion of the heat source.An area of a cross section parallel to the antenna substrate of the heat dissipator at a distance less than a predetermined distance in a normal direction of the contact face from the contact face is equal to or less than an area of the contact face, and an area of a cross section parallel to the antenna substrate of the heat dissipator at a distance equal to or more than the predetermined distance from the contact face is larger than the area of the contact face.

    HEAT DISSIPATION DEVICE FOR OPTICAL TRANSCEIVER, AND OPTICAL COMMUNICATION DEVICE
    16.
    发明申请
    HEAT DISSIPATION DEVICE FOR OPTICAL TRANSCEIVER, AND OPTICAL COMMUNICATION DEVICE 审中-公开

    公开(公告)号：US20180309519A1

    公开(公告)日：2018-10-25

    申请号：US15735652

    申请日：2016-02-12

    申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD.

    发明人： Shuitsu YUDA ,  Naoya KIZAKI ,  Yuichi KITAJIMA

    IPC分类号： H04B10/40 ,  H04B1/036 ,  H05K7/20

    CPC分类号： H04B10/40 ,  H04B1/036 ,  H05K7/20418

    摘要： An optical communication device according to an embodiment of the present invention includes: a heat sink integrally having a plurality of contact portions respectively corresponding to the plurality of the optical transceivers, and a heat transfer portion bound to a casing so as to be able to transfer heat to the casing; a plurality of cage members configured to respectively accommodate the plurality of the optical transceivers, and having openings so as to allow the optical transceivers to be partially exposed to the contact portion side, respectively; a holding unit configured to hold the plurality of the cage members inside the casing in a state where the openings correspond to the contact portions, respectively; and an elastic member configured to bring the plurality of the optical transceivers into thermal contact with the plurality of the contact portions, respectively, by pressing each of the plurality of the cage members toward the heat sink side.

    SATELLITE TRANSMITTER SYSTEM
    18.
    发明申请
    SATELLITE TRANSMITTER SYSTEM 审中-公开

    公开(公告)号：US20180198517A1

    公开(公告)日：2018-07-12

    申请号：US15784103

    申请日：2017-10-14

    申请人： Mission Microwave Technologies, Inc.

    发明人： Francis S. Auricchio ,  David Fieldhouse

    IPC分类号： H04B7/185 ,  H05K7/20 ,  H04B1/036 ,  H04B1/04

    CPC分类号： H04B7/18515 ,  H04B1/036 ,  H04B1/04 ,  H04B2001/0491 ,  H05K7/20136 ,  Y02D70/12 ,  Y02D70/122 ,  Y02D70/40 ,  Y02D70/446

    摘要： A satellite transmitter module for accepting input signals and emitting output signals for uplink transmission. The module includes a transmitter unit that includes i) transmitter circuitry, ii) at least one input port, iii) and at least one output port. At least one heat sink coupled to the transmitter unit includes a plurality of heat sink fins, wherein at least two of the plurality of heat sink fins are of different heights. A fan is capable of generating air flow parallel with the plurality of heat sink fins. The module further includes an outer enclosure that i) encloses the transmitter unit and the plurality of heat sink fins and ii) is impermeable to the air flow generated by the fan. The outer enclosure includes an enclosure cross section shape that is substantially similar to the at least one heat sink cross section shape defined by the height of each of the plurality of the heat sink fins.