公开(公告)号：US11004772B2

公开(公告)日：2021-05-11

申请号：US16615441

申请日：2018-06-15

申请人： NEC CORPORATION

发明人： Takahiro Nakagawa

IPC分类号： H01L23/473 ,  H01L21/48 ,  F28F13/06 ,  H04B1/036

摘要： A cooling structure according to the present invention is provided with: a base material formed with a cooling water flow passageway; a pipe which includes a first layer formed on an outer surface of the base material, and a second layer formed on the outside of the first layer; and a plate having the pipe cast therein. The base material is configured from a highly thermally conductive first material. The first layer is configured from a heat-resistant second material. The second layer is configured from a third material having high affinity with the second material. The plate is configured from a highly thermally conductive fourth material. The second material and the third material respectively have high affinity with the fourth material.