公开(公告)号：US11914202B2

公开(公告)日：2024-02-27

申请号：US17176769

申请日：2021-02-16

Applicant: Fujitsu Optical Components Limited

Inventor： Takuya Nakao

IPC: G02B6/42 ,  H05K1/14

CPC classification number: G02B6/4242 ,  G02B6/4244 ,  G02B6/4281 ,  H05K1/147 ,  H05K2201/10121 ,  H05K2201/10431

Abstract: The optical module includes a housing, a lid that closes an opening of the housing, an optical component arranged inside the housing, and a printed circuit board arranged on a front surface of the lid outside the housing so as to be used as a board on which a control circuit that controls the optical component is mounted. The optical module further includes a side electrode that is provided on a side surface of the housing and configured to be electrically connected to an electrode of the optical component; and a flexible substrate that provides electrical connection between the side electrode and an electrode of the control circuit. The optical module can be miniaturized by integrating the optical component and the control circuit.

公开(公告)号：US20230369256A1

公开(公告)日：2023-11-16

申请号：US17742767

申请日：2022-05-12

Applicant: Infineon Technologies AG

Inventor： Kushal Kshirsagar ,  Eung San Cho ,  Danny Clavette ,  Wenkang Huang ,  Angela Kessler

IPC: H01L23/66 ,  H01L23/367 ,  H01L23/13 ,  H05K1/11 ,  H05K3/30 ,  H01L23/495 ,  H01L23/498

CPC classification number: H01L23/66 ,  H01L23/3675 ,  H01L23/13 ,  H05K1/111 ,  H05K3/301 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49872 ,  H05K2201/10431 ,  H05K2201/1003

Abstract: A semiconductor assembly includes a carrier including a dielectric substrate and a plurality of contact pads disposed on an upper surface of the carrier, first and second surface mount packages mounted on the carrier, first and second discrete inductors respectively mounted over the first and second surface mount packages, wherein the first and second surface mount packages each comprise lower surface terminals that face and electrically connect with the contact pads from the carrier, wherein the first and second surface mount packages each comprise an upper side that faces away from the carrier, and wherein the first and second discrete inductors are respectively thermally coupled to the upper sides of the first and second surface mount packages.

公开(公告)号：US20140216801A1

公开(公告)日：2014-08-07

申请号：US14240929

申请日：2011-09-12

Applicant: Tohru Matsumoto ,  MItsuaki Toda ,  Yoshio Imamura

Inventor： Tohru Matsumoto ,  MItsuaki Toda ,  Yoshio Imamura

IPC: H05K5/06 ,  H05K13/04 ,  H05K1/18

CPC classification number: H05K5/065 ,  H05K1/185 ,  H05K1/188 ,  H05K3/4602 ,  H05K13/046 ,  H05K2201/10431 ,  H05K2201/10636 ,  H05K2203/06 ,  Y02P70/611 ,  Y10T156/10 ,  Y10T156/1057

Abstract: A method of manufacturing a component-embedded substrate comprises forming an adhesive layer on a metal layer formed on a supporting plate, and mounting an electric or electronic component on the adhesive layer, wherein the component includes a component main body and a protrusion that protrudes beyond the component main body toward the adhesive layer, the adhesive layer includes a first adhesive body and a second adhesive body, the first adhesive body is formed only at a position corresponding to the protrusion, the second adhesive body is formed in an area corresponding to the whole of the surface of the component facing the adhesive layer after the first adhesive body is cured, and the component is mounted with the protrusion aligned with the first adhesive body in the component mounting step.

Abstract translation: 一种制造部件嵌入式基板的方法包括在形成在支撑板上的金属层上形成粘合剂层，并将电子或电子部件安装在粘合剂层上，其中该部件包括部件主体和突出部 组件主体朝向粘合剂层，粘合剂层包括第一粘合体和第二粘合体，第一粘合体仅形成在与突起相对应的位置处，第二粘合体形成在与第二粘合体相对应的区域中 在第一粘合体固化之后面向粘合剂层的部件的整个表面整体，并且在部件安装步骤中，将部件安装成与第一粘合体对准的突出部。