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21 条记录 (耗时 0.019 秒)

    Honing method and honing control device
    11.
    发明授权
    Honing method and honing control device 有权
    珩磨方法和珩磨控制装置

    公开(公告)号：US07874893B2

    公开(公告)日：2011-01-25

    申请号：US12133407

    申请日：2008-06-05

    申请人： Akiharu Tashiro ,  Takayuki Monchujo ,  Kiyohisa Suzuki ,  Jun Inomata ,  Ryuji Fukada ,  Eiji Shiotani ,  Daisuke Terada ,  Kei Fujii

    发明人： Akiharu Tashiro ,  Takayuki Monchujo ,  Kiyohisa Suzuki ,  Jun Inomata ,  Ryuji Fukada ,  Eiji Shiotani ,  Daisuke Terada ,  Kei Fujii

    IPC分类号： B24B49/00 ,  B24B1/00 ,  B24B7/00 ,  B24B9/00 ,  G06F19/00

    CPC分类号： B24B49/16 ,  B24B33/02 ,  B24B33/06 ,  B24B33/087 ,  B24B49/06

    摘要： A honing method and honing control device suitable for the honing having a large processing area is provided. The honing control device includes a grinder and an expansion member for disposition in a processing hole of a workpiece. The amount of an expanding movement when the grinder contacts the inner surface of a gauge hole via the expansion member is stored as a target expansion amount by inserting a honing head into the gauge hole having the same size as a target processing diameter of a master gauge. Then, a honing of an inner surface of the processing hole is performed by inserting the honing head within a processing hole of a workpiece moving the grinder towards an outer side of a diametrical direction by the expansion member installed within the honing head to rotate the honing head. The honing is completed when the amount of the expanding movement of the grinder reaches a target expansion amount established by the master gauge.

    摘要翻译： 提供了一种适用于具有大加工区域的珩磨的珩磨方法和珩磨控制装置。 珩磨控制装置包括研磨机和用于配置在工件的加工孔中的膨胀构件。 当研磨机经由膨胀部件与规格孔的内表面接触时，膨胀运动的量通过将珩磨头插入到具有与主表的目标加工直径相同的尺寸的量规孔中作为目标膨胀量 。 然后，通过将珩磨头插入到通过安装在珩磨头内的膨胀构件沿着直径方向移动研磨机的工件的加工孔内，将珩磨头插入，来旋转珩磨 头。 当研磨机的膨胀运动量达到由母压力计确定的目标膨胀量时，珩磨完成。

    Method of and instrument for measuring roll diameter in roll grinder
    12.
    发明授权
    Method of and instrument for measuring roll diameter in roll grinder 失效
    轧辊研磨机辊径测量方法及仪器

    公开(公告)号：US5771599A

    公开(公告)日：1998-06-30

    申请号：US704998

    申请日：1996-08-29

    申请人： Hiroshi Uchimura ,  Takazumi Watanabe ,  Masayuki Tatara ,  Yoshinori Hata ,  Kazuo Kimura

    发明人： Hiroshi Uchimura ,  Takazumi Watanabe ,  Masayuki Tatara ,  Yoshinori Hata ,  Kazuo Kimura

    IPC分类号： B24B5/37 ,  B24B49/06 ,  B24B49/14 ,  G01B5/08 ,  G01B7/12

    CPC分类号： B24B5/37 ,  B24B49/06 ,  B24B49/14

    摘要： A method of measuring a roll diameter of a roll is provided. At first, a step-shaped conical master roll consisting of a plurality of diametrical parts is prepared and then, the diameters of the diametrical parts under predetermined standard temperature are measured. After mounting the master roll on a roll grinder under a temperature condition similar to that surrounding the roll mounted on the roll grinder, a diameter of one diametrical part, of which standard diameter is closest to the roll diameter of the roll, is measured. Next, a difference between the diameter value of the diametrical part and the standard diameter value is calculated as a correction value, so that the roll diameter value of the roll is corrected by the correction value.

    摘要翻译： 提供了一种测量卷筒直径的方法。 首先，准备由多个直径部件构成的阶梯形的圆锥形主辊，然后测量在预定标准温度下的直径部分的直径。 在与辊式研磨机上安装的辊周围的温度条件相似的温度条件下将母辊安装在辊式研磨机上之后，测量其直径最接近轧辊直径的一个直径部分的直径。 接下来，计算直径部分的直径值与标准直径值之间的差作为校正值，从而通过校正值校正辊的辊直径值。

    Measuring method and equipment for the automatic control of the forwards and backwards movement of the grinding wheel of a surface grinder
    13.
    发明授权
    Measuring method and equipment for the automatic control of the forwards and backwards movement of the grinding wheel of a surface grinder 失效
    用于自动控制表面磨床砂轮前后运动的测量方法和设备

    公开(公告)号：US4934105A

    公开(公告)日：1990-06-19

    申请号：US248065

    申请日：1988-09-23

    申请人： Hans Sigg

    发明人： Hans Sigg

    IPC分类号： B24B49/06

    CPC分类号： B24B49/06

    摘要： Measuring method and equipment for automatic control of forward and backward movements of a grinding wheel of a surface grinder. The upper surfaces of the workpieces are felt by means of a length measuring head mounted on the frame of the grinder during different successive passes of these pieces under the grinding wheel to obtain each time a measuring signal which substantially represents their actual size. A reference block of given thickness composed of one or several pieces is placed on the grinder table, in addition to the pieces to be machined and out of reach of the grinding wheel. The upper surface of this block is periodically felt with the measuring head to obtain a reference signal and the value of this signal is stored each time. The difference between the value of the measuring signal and the stored value of the reference signal is calculated at least once for each of the passes to obtain a resultant signal which corresponds to the exact actual size of the workpieces and is used to control the movements of the grinding wheel so as to avoid measurement errors such as those caused by wear on the head, by deformations in its support, and/or by heat-induced variations in the level of the table.

    摘要翻译： 用于自动控制平面磨床砂轮前后运动的测量方法和设备。 工件的上表面通过安装在研磨机的框架上的长度测量头在这些碎片在砂轮下的不同连续通过期间被感觉到，以获得每次基本上代表其实际尺寸的测量信号。 除了要加工的零件和磨轮不能到达之外，将由一个或多个组成的给定厚度的参考块放置在研磨台上。 测量头周期性地感觉到该块的上表面，以获得参考信号，并且每次都存储该信号的值。 测量信号的值与参考信号的存储值之间的差异对于每个通道至少计算一次，以获得对应于工件的确切实际尺寸的合成信号，并且用于控制 砂轮，以避免测量误差，例如由头部磨损引起的测量误差，其支撑变形和/或由于热引起的台面水平的变化。

    Machining in-process gage calibration from reference master
    14.
    发明授权
    Machining in-process gage calibration from reference master 失效
    从参考主机加工过程中的量规校准

    公开(公告)号：US4539777A

    公开(公告)日：1985-09-10

    申请号：US557523

    申请日：1983-12-02

    申请人： Bernard J. Brown ,  Thomas B. Peelle

    发明人： Bernard J. Brown ,  Thomas B. Peelle

    IPC分类号： B23Q15/04 ,  B23Q15/16 ,  B24B49/06

    CPC分类号： B23Q15/16 ,  B23Q15/04 ,  B24B49/06

    摘要： A system and method for controlling operation of a machine tool such as a grinder wherein engagement of the machine tool with a workpiece is controlled in real time by a workpiece measurement signal from a gage likewise engaged with the workpiece. The measurement gage is periodically brought into measuring engagement with a gage master having a predetermined master dimension relative to the desired machined size of the workpiece. The resulting gage master measurement signal is compared with a reference, and a compensation signal is generated and stored as a function of the magnitude and polarity of any departure from the gage master measurement signal from the gage master reference signal. Thereafter, during the machining mode of operation, motion of the machine tool is controlled as a combined function of the workpiece measurement signal and the compensation signal generated and stored during the calibration mode of operation.

    摘要翻译： 用于控制诸如磨床的机床的操作的系统和方法，其中机床与工件的接合通过来自同样与工件接合的量规的工件测量信号实时控制。 周期性地测量量具与相对于工件的期望加工尺寸具有预定主尺寸的量具主机进行测量接合。 将所得到的量具主测量信号与参考值进行比较，并且根据量规主测量信号与量规主参考信号的任何偏差的大小和极性产生并存储补偿信号。 此后，在加工操作模式期间，机床的运动被控制为工件测量信号和在校准操作模式期间产生和存储的补偿信号的组合函数。

    Lens manufacturing method
    16.
    发明授权
    Lens manufacturing method 有权

    公开(公告)号：US09815167B2

    公开(公告)日：2017-11-14

    申请号：US15456035

    申请日：2017-03-10

    申请人： FUJIFILM Corporation

    发明人： Yasuhito Hiraki ,  Kenji Ito ,  Seiichi Watanabe

    IPC分类号： B24B13/01 ,  B24B41/06 ,  B24B49/04 ,  B24B49/06 ,  B24B13/005

    CPC分类号： B24B13/01 ,  B24B13/005 ,  B24B41/06 ,  B24B49/04 ,  B24B49/06

    摘要： A lens manufacturing method including a holding step of holding a lens in a lens holding fixture, and a machining step of machining a surface to be machined in the held lens. A reverse surface of the surface to be machined is machined into a non-planar shape with a first surface shape error. A lens holding surface of the lens holding fixture is machined into the same shape as the non-planar shape with a second surface shape error smaller than the first surface shape error. In the holding step, the reverse surface is brought into surface contact with the holding surface in imitation of the holding surface to correct the shape of the lens such that the reverse surface runs along the holding surface. In the machining step, the surface to be machined is machined in a state where the correction has been made by the holding step.

    METHOD OF POLISHING WAFER AND WAFER POLISHING APPARATUS
    17.
    发明申请
    METHOD OF POLISHING WAFER AND WAFER POLISHING APPARATUS 有权
    抛光抛光和抛光抛光装置的方法

    公开(公告)号：US20160207161A1

    公开(公告)日：2016-07-21

    申请号：US14914747

    申请日：2014-06-24

    申请人： S U M C O (SUMCO CORPORATION)

    发明人： Tomonori KAWASAKI

    IPC分类号： B24B37/005 ,  B24B37/20

    CPC分类号： B24B37/005 ,  B24B37/20 ,  B24B37/34 ,  B24B49/06 ,  H01L21/02024

    摘要： A practical method of polishing a wafer that can reduce wafer loss due to dummy polishing, and stabilize the LPD count in production wafers at a low level, is provided. in the method of polishing a wafer according to the present disclosure, a wafer 104 is brought into contact with a polishing cloth 112 provided on the surface of a polishing plate 110, and the wafer 104 and the polishing plate 110 are rotated, thereby performing several rounds of a polishing process on the surface of the wafer 104 using the same polishing cloth 112. At this time, the contact angle of the polishing cloth is measured, and based on the measured value thereof, the timing for a switchover from an initial polishing (or a dummy polishing) mode to a production polishing mode is determined.

    摘要翻译： 提供了一种抛光晶片的实用方法，其可以减少由于虚拟抛光导致的晶片损耗，并将生产晶片中的LPD计数稳定在低水平。 在根据本公开的抛光晶片的方法中，晶片104与设置在抛光板110的表面上的抛光布112接触，并且晶片104和抛光板110旋转，从而执行几个 使用相同的抛光布112在晶片104的表面上进行一轮抛光处理。此时，测量抛光布的接触角，并且基于其测量值，从初始抛光切换的定时 （或虚拟抛光）模式确定为生产抛光模式。