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公开(公告)号：US20170179371A1
公开(公告)日：2017-06-22
申请号：US15449053
申请日：2017-03-03
申请人： NGK INSULATORS, LTD.
发明人： Kazumasa KITAMURA , Tomoki NAGAE
IPC分类号： H01L41/337 , B24B37/10
CPC分类号： H01L41/337 , B24B37/10 , B81C1/00611 , H01L21/30625 , H01L21/7684 , H01L41/0805 , H01L41/18 , H01L41/312 , H01L41/338 , H03H3/02
摘要： A production method for a composite substrate according to the present invention comprises (a) a step of mirror-polishing a piezoelectric-substrate side of a laminated substrate formed by bonding a piezoelectric substrate and a support substrate; (b) a step of performing machining using an ion beam or a neutral atom beam so that a thickness of an outer peripheral portion of the piezoelectric substrate is larger than a thickness of an inner peripheral portion and a difference between a largest thickness and a smallest thickness of the inner peripheral portion of the piezoelectric substrate is 100 nm or less over an entire surface; and (c) a step of flattening the entire surface of the piezoelectric substrate to remove at least a part of an altered layer formed by the machining using the ion beam or the neutral atom beam in the step (b).
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公开(公告)号：US09566616B2
公开(公告)日：2017-02-14
申请号：US14315283
申请日：2014-06-25
申请人： EBARA CORPORATION
发明人： Tetsuji Togawa , Kenya Ito , Yu Ishii , Keisuke Uchiyama
IPC分类号： B08B1/04 , H01L21/304 , H01L21/687 , B08B1/00 , H01L21/67
CPC分类号： B08B1/04 , B08B1/001 , B08B1/006 , B24B37/10 , B24B37/107 , B24B37/30 , H01L21/304 , H01L21/67046 , H01L21/67051 , H01L21/687 , H01L21/68728
摘要： There is disclosed a substrate processing apparatus which is capable of detecting whether a substrate, such as a wafer, supported by a fluid is properly present in a predetermined processing position or not. The substrate processing apparatus includes at least one distance sensor configured to measure a distance between a scrubber and a hydrostatic support structure; and a processing controller configured to calculate a gap between the hydrostatic support structure and the surface of the substrate from a measured value of the distance and determine whether the gap falls within a predetermined range or not.
摘要翻译： 公开了一种能够检测由流体支撑的诸如晶片的基板是否适当地存在于预定处理位置中的基板处理装置。 衬底处理装置包括至少一个距离传感器，其构造成测量洗涤器和静水支撑结构之间的距离; 以及处理控制器，被配置为从所述距离的测量值计算所述静液压支撑结构和所述基板的表面之间的间隙，并且确定所述间隙是否落在预定范围内。
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公开(公告)号：US09539696B2
公开(公告)日：2017-01-10
申请号：US14578845
申请日：2014-12-22
发明人： Dai Fukushima , Takashi Watanabe , Jun Takayasu
CPC分类号： B24B37/32 , B24B37/042 , B24B37/10 , B24B37/107
摘要： A retainer ring configured to be attachable, at a first side thereof, to a polish head of a polish apparatus configured to polish a polish object by depressing the polish object against a polish pad is disclosed. The retainer ring is configured to depress the polish pad at a second side thereof. The retainer ring includes a contact surface contacting the polish pad. The contact surface applies depressing force on the polish pad. The depressing force is directed from a polish head side and is applied so as to be centered on an imaginary circle of pressure center having a radius falling substantially in a middle of an inner radius of the retainer ring and an outer radius of the retainer ring. An area of the contact surface is greater in a first region inside the circle of pressure center than in a second region outside the circle of pressure center.
摘要翻译： 公开了一种保持环，其被构造成可以在其第一侧被附着到抛光装置的抛光头，所述抛光装置被配置为通过将抛光物体压靠抛光垫来抛光抛光物体来抛光抛光物体。 保持环构造成在其第二侧压下抛光垫。 保持环包括接触抛光垫的接触表面。 接触表面在抛光垫上施加抑制力。 按压力从抛光头侧引导，并且被施加以在具有大体上位于保持环的内半径的中间的半径的压力中心的假想圆和保持环的外半径的中心。 接触表面的区域在压力中心圆周内的第一区域内比在压力中心圆外的第二区域内更大。
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公开(公告)号：US20160250735A1
公开(公告)日：2016-09-01
申请号：US15150279
申请日：2016-05-09
申请人： EBARA CORPORATION
发明人： Osamu NABEYA , Tetsuji TOGAWA , Makoto FUKUSHIMA , Hozumi YASUDA
IPC分类号： B24B37/20 , B24B37/005
CPC分类号： B24B37/20 , B24B37/005 , B24B37/042 , B24B37/10 , B24B37/105 , B24B37/30 , B24B37/32 , B24B47/22 , B24B49/00 , B24B49/16 , B24B49/18 , B24B49/183
摘要： A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.
摘要翻译： 抛光装置具有抛光垫，用于保持半导体晶片的顶环，以及可操作以在垂直方向上移动顶环的垂直移动机构。 抛光装置还具有距离测量传感器，该距离测量传感器可操作以当顶环的下表面与抛光垫接触时检测顶环的位置，以及控制器，其可操作以计算顶环的最佳位置进行抛光 基于由距离测量传感器检测到的位置的半导体晶片。 垂直移动机构包括可操作以将顶环移动到最佳位置的滚珠丝杠机构。
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公开(公告)号：US09352441B2
公开(公告)日：2016-05-31
申请号：US14510195
申请日：2014-10-09
发明人： Steven M. Zuniga , Chih Hung Chen , Jay Gurusamy
CPC分类号： B24B37/10 , B24B37/345
摘要： A chemical mechanical polishing system is provided. The chemical mechanical polishing system includes a platen, a load cup, a hub, a first polishing arm cantilevered from the hub and rotatable around the centerline of the hub between the platen and load cup, and a second polishing arm cantilevered from the hub and rotatable around the centerline of the hub between the platen and load cup the second arm rotatable independently from the hub.
摘要翻译： 提供化学机械抛光系统。 所述化学机械抛光系统包括压板，负载杯，轮毂，从所述轮毂悬臂并能围绕所述压板和所述负载杯之间的所述轮毂的中心线旋转的第一抛光臂，以及从所述轮毂悬臂的第二抛光臂， 围绕压板和负载杯之间的毂的中心线，第二臂可独立于轮毂旋转。
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公开(公告)号：US20160129549A1
公开(公告)日：2016-05-12
申请号：US14988367
申请日：2016-01-05
发明人： IN-KWON KIM , KYUNG-HYUN KIM , Kl-JONG PARK , Kl-HO BAE , JONG-HEUN LIM
IPC分类号： B24B37/30
CPC分类号： B24B37/30 , B24B37/042 , B24B37/10 , B24B37/32
摘要： A chemical mechanical polishing machine includes a polishing head assembly including a polishing head body and a membrane disposed at a bottom of the polishing head body. The bottom surface of the membrane includes a hydrophobic area and a hydrophilic area.
摘要翻译： 化学机械抛光机包括抛光头组件，其包括抛光头本体和设置在抛光头本体底部的膜。 膜的底表面包括疏水区域和亲水区域。
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公开(公告)号：US20160052104A1
公开(公告)日：2016-02-25
申请号：US14828158
申请日：2015-08-17
申请人： EBARA CORPORATION
发明人： Tomoatsu ISHIBASHI
摘要： A polishing apparatus in which a liquid containing a slurry hardly enters into a gap between a top ring body and a retainer ring during polishing, and the slurry can be discharged by cleaning even if the liquid containing the slurry enters into the gap, and slurry particles can be prevented from being attached to a surface of a substrate (wafer) when the substrate (wafer) is released is disclosed. The polishing apparatus includes a top ring having a top ring body and a retainer ring provided at an outer circumferential portion of the top ring body, and configured to hold a substrate to be polished and to press the substrate against the polishing surface, and a cleaning mechanism provided at a substrate transfer position for transferring the substrate to the top ring or receiving the substrate from the top ring, and having a cleaning nozzle configured to eject a cleaning liquid toward the top ring. The retainer ring has a recess formed over an entire circumference of an inner circumferential surface of the retainer ring. The cleaning nozzle is configured to eject the cleaning liquid toward the recess of the retainer ring.
摘要翻译： 在抛光期间，含有浆料的液体几乎不会进入顶环体和保持环之间的间隙的抛光装置，即使含有浆料的液体进入间隙，也可以通过清洗排出浆料，浆料颗粒 可以防止当释放衬底（晶片）时衬底（晶片）的表面附着。 抛光装置包括：顶环，其具有顶环主体和设置在顶环体的外周部的保持环，并且构造成保持要被抛光的基板并将基板压靠在抛光表面上，并且清洁 机构，设置在用于将衬底转移到顶环或从顶环接收衬底的衬底转移位置，并且具有构造成朝向顶环喷射清洁液体的清洁喷嘴。 保持环具有形成在保持环的内周面的整个圆周上的凹部。 清洁喷嘴被构造成朝向保持环的凹部喷射清洁液体。
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公开(公告)号：US09266216B2
公开(公告)日：2016-02-23
申请号：US14373672
申请日：2013-01-28
发明人： Hisashi Masumura
IPC分类号： B24B37/10 , B24B37/32 , H01L21/304 , B24B37/30 , H01L21/02
CPC分类号： B24B37/10 , B24B37/30 , B24B37/32 , H01L21/02024 , H01L21/304 , H01L2221/683
摘要： The present invention provides a polishing head including: an annular rigid ring; an elastic film bonded to the rigid ring; and an upward and downward movable mid-plate, the mid-plate defining a first sealed space together with the rigid ring and the elastic film; an incompressible fluid enclosed in a sealed space; and a mid-plate positioning device for adjusting vertical position of the mid-plate, to hold a back surface of a workpiece on a lower surface of the elastic film and polish a front surface by bringing the front surface into contact with a polishing pad attached to a turn table, wherein the mid-plate can adjust a shape of the lower surface of the elastic film by adjusting the vertical position of the mid-plate. The polishing head polishes a workpiece without generating surface defects on the workpiece surface and easy detachment of the workpiece from a polishing pad after polishing.
摘要翻译： 本发明提供了一种抛光头，包括：环形刚性环; 粘结到刚性环的弹性膜; 以及向上和向下移动的中间板，中间板与刚性环和弹性膜一起限定第一密封空间; 封闭在密封空间内的不可压缩流体; 以及用于调节中间板的垂直位置的中间板定位装置，用于将工件的后表面保持在弹性膜的下表面上，并通过使前表面与附接的抛光垫接触来抛光前表面 转台，其中中板可以通过调节中间板的垂直位置来调节弹性膜的下表面的形状。 抛光头对工件进行抛光，而不会在工件表面产生表面缺陷，并且抛光后容易从抛光垫上脱离工件。
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公开(公告)号：US09199354B2
公开(公告)日：2015-12-01
申请号：US14329967
申请日：2014-07-13
IPC分类号： B24B37/30 , B24B37/04 , B24B37/10 , H01L21/304
CPC分类号： B24B37/30 , B24B37/042 , B24B37/10 , B24B37/105 , H01L21/304
摘要： Hard-material, flat-surfaced workpieces such as semiconductor wafers or sapphire disks are quickly attached with vacuum to a rotatable floating workpiece carrier. Fluid pressure in a sealed chamber applies uniform abrading pressure over the full abraded surface of the workpieces. A flexible diaphragm is used to form the sealed chamber and the carrier is rotationally driven by a lug-pin device. The floating carrier is horizontally restrained by a center-post device that provides rigid lateral support against abrading forces. Tilting of the floating carrier is provided by a spherical bearing. The abrading system can be operated at the very high abrading speeds used in high speed flat lapping with raised-island abrasive disks. Vacuum can also be applied to the sealed chamber to quickly move the workpiece away from the abrading surface. A mode of providing rigid parallel-surface abrading of a workpiece can be activated by simply applying vacuum to the sealed chamber.
摘要翻译： 诸如半导体晶片或蓝宝石盘的硬质材料的平面表面工件被快速地附接到可旋转的浮动工件载体上。 密封腔中的流体压力在工件的全磨损表面上施加均匀的研磨压力。 使用柔性隔膜来形成密封室，并且托架由凸耳针装置旋转驱动。 浮动载体由中心柱装置水平约束，其提供抵抗研磨力的刚性侧向支撑。 浮动载具的倾斜由球面轴承提供。 研磨系统可以在用凸岛研磨盘的高速平面研磨中使用的非常高的研磨速度下操作。 也可以将真空应用于密封室，以将工件快速移离研磨表面。 可以通过简单地将真空施加到密封室来激活提供工件的刚性平行表面研磨的模式。
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公开(公告)号：US20150217423A1
公开(公告)日：2015-08-06
申请号：US14614641
申请日：2015-02-05
摘要： A pressure-adjusting lapping element is included as a structural component of a carrier assembly in a lapping head. The lapping element includes actuator nodes that permit fine tuning of a lapping force applied through the lapping element to a work piece. An actuator assembly is directly attached to the lapping element and manipulates the individual actuator nodes. The lapping element further includes whippletree structure to permit a desired degree of flexibility in the lapping element to respond to force inputs at the actuator nodes.
摘要翻译： 作为研磨头中的载体组件的结构部件，包括压力调节研磨元件。 研磨元件包括致动器节点，其允许将通过研磨元件施加的研磨力微调到工件。 致动器组件直接附接到研磨元件并操纵各个致动器节点。 研磨元件还包括鞭状结构，以允许研磨元件中的期望程度的柔性以响应于致动器节点处的力输入。
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