FILM-FORMING POWDER, FILM FORMING METHOD, AND FILM-FORMING POWDER PREPARING METHOD

    公开(公告)号:US20230100603A1

    公开(公告)日:2023-03-30

    申请号:US18075586

    申请日:2022-12-06

    IPC分类号: C23C24/02 C01F17/259

    摘要: A film-forming powder containing a rare earth oxyfluoride has an average particle size D50 of 0.6-15 μm, a total volume of 10 μm pores of 0.51-1.5 cm3/g as measured by mercury porosimetry, and a BET surface area of 3-50 m2/g is suitable for forming a dense film in high yields or deposition rates and high productivity. The film-forming powder having a greater pore volume can be prepared by forming a rare earth ammonium fluoride complex salt on surfaces of rare earth oxide particles to provide precursor particles, and heat treating the precursor particles at a temperature of 350 to 700° C.

    ISOCYANATE GROUP-CONTAINING ORGANOSILICON COMPOUND AND METHOD FOR PRODUCING ISOCYANATE GROUP-CONTAINING ORGANOSILICON COMPOUND

    公开(公告)号:US20230098950A1

    公开(公告)日:2023-03-30

    申请号:US17799133

    申请日:2021-02-05

    发明人: Koji SAKUTA

    IPC分类号: C07F7/10

    摘要: An isocyanate group-containing organosilicon compound shown by the following general formula (1). This provides an organosilicon compound having only one isocyanate group, which is highly reactive, in a molecule and having two or three organopolysiloxane groups per molecule. In the formula (1), each R1 is identical to or different from one another, represents a monovalent alkyl group having 1 to 10 carbon atoms or a phenyl group, and has no aliphatic unsaturated group; each R2 is identical to or different from one another, represents a monovalent alkyl group having 1 to 10 carbon atoms, a fluorine-substituted alkyl group, a monovalent aryl group having 6 to 10 carbon atoms, or a monovalent aralkyl group having 7 to 10 carbon atoms, and has no aliphatic unsaturated group; “a” represents 0 or 1; and “b” represents an integer of 0 to 300.

    ISOCYANATE GROUP-CONTAINING ORGANOSILICON COMPOUND AND METHOD FOR PRODUCING ISOCYANATE GROUP-CONTAINING ORGANOSILICON COMPOUND

    公开(公告)号:US20230092712A1

    公开(公告)日:2023-03-23

    申请号:US17800870

    申请日:2021-02-01

    发明人: Koji SAKUTA

    IPC分类号: C07F7/08

    摘要: An isocyanate group-containing organosilicon compound shown by the following general formula (1), and having three or more R2 groups per molecule and a viscosity at 25° C. of 100 mm2/s or less. This provides an organosilicon compound which has three or more isocyanate groups per molecule, and which is suitable as a crosslinking agent, low in viscosity, and excellent in handleability. R1aR2bSiO(4−a−b)/2 (1), where each R1 is identical to or different from one another, represents a monovalent alkyl group having 1 to 10 carbon atoms, a fluorine-substituted alkyl group, a monovalent aryl group having 6 to 10 carbon atoms, or a monovalent aralkyl group having 7 to 10 carbon atoms, and has no aliphatic unsaturated group; and R2 represents an organic group shown by a formula —CH2CH2Si(CH3)2OSi(CH3)2CH2CH2CH2NCO.

    Pellicle frame and pellicle
    17.
    发明授权

    公开(公告)号:US11592739B2

    公开(公告)日:2023-02-28

    申请号:US17556440

    申请日:2021-12-20

    发明人: Yu Yanase

    IPC分类号: G03F1/64

    摘要: The present invention is to provide a pellicle frame in a frame shape, having an upper end face to arrange a pellicle film thereon and a lower end face to face a photomask, and which is characterized by being provided with a notched part from an outer side face toward an inner side face of the upper end face, and to provide a pellicle characterized by including the pellicle frame as a component.

    Process for preparing 6-isopropenyl-3-methyl-9-decenyl acetate and intermediates thereof

    公开(公告)号:US11591282B2

    公开(公告)日:2023-02-28

    申请号:US17234879

    申请日:2021-04-20

    IPC分类号: C07C67/08 C07C69/145

    摘要: A process for process for preparing 6-isopropenyl-3-methyl-9-decenyl acetate of the following formula (3), wherein Ac represents an acetyl group, the process comprising steps of: preparing a nucleophilic reagent, 5-isopropenyl-2-methyl-8-nonenyl compound, of the following general formula (1): wherein M1 represents Li, MgZ1, ZnZ1, Cu, CuZ1, or CuLiZ1, wherein Z1 represents a halogen atom or a 5-isopropenyl-2-methyl-8-nonenyl group, from a 5-isopropenyl-2-methyl-8-nonenyl halide compound of the following general formula (4): wherein X1 represents a halogen atom; subjecting the nucleophilic reagent (1), 5-isopropenyl-2-methyl-8-nonenyl compound, to an addition reaction with at least one electrophilic reagent selected from the group consisting of formaldehyde, paraformaldehyde, and 1,3,5-trioxane, followed by a hydrolysis reaction to form 6-isopropenyl-3-methyl-9-decenol of the following formula (2); and acetylating 6-isopropenyl-3-methyl-9-decenol (2) to form 6-isopropenyl-3-methyl-9-decenyl acetate (3).

    THERMALLY CONDUCTIVE SILICONE RESIN COMPOSITION

    公开(公告)号:US20230047058A1

    公开(公告)日:2023-02-16

    申请号:US17788828

    申请日:2020-12-08

    摘要: One of the objects of the present invention is to provide a thermally conductive silicone resin composition which has good thermal conductivity, a light weight (namely, a light weight per unit volume), and good reliability in high humidity, and a molded body thereof. The present invention provides a thermally conductive silicone resin composition comprising the following components (A) to (E): (A) an organopolysiloxane having at least two alkenyl groups each bonded to a silicon atom in an amount of 100 parts by mass, (B) an organohydrogen polysiloxane having at least two hydrogen atoms each bonded to a silicon atom in an amount such that a ratio of the number of the hydrogen atom bonded to a silicon atom relative to the number of the alkenyl group in component (A) is 0.1 to 2, (C) a thermally conductive filler in an amount of 2500 to 6000 parts by mass, (D) a catalytic amount of an addition reaction catalyst, and (E) an addition-reaction controlling agent in an amount of 0.01 to 1 part by mass, wherein the thermally conductive filler (C) comprises magnesium oxide having a specific surface area of 0.4 m2/g or less in an amount of 20 to 50 wt % and aluminum hydroxide in an amount of 10 to 30 wt %, relative to a total weight of component (C).