公开(公告)号：US08345431B2

公开(公告)日：2013-01-01

申请号：US12317754

申请日：2008-12-29

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H05K1/00

CPC classification number: H05K1/189 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/07811 ,  H01L2924/15311 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/043 ,  H05K2201/056 ,  H05K2201/09109 ,  H05K2201/10159 ,  H05K2201/1056 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00

Abstract: A multichip module comprises a flexible circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The flexible circuit is enclosed and supported by two rigid frames, which may further be provided with protective heat spreading covers. Contact pads on the rigid frame(s) may be configured to engage a mating socket or they may be solderable to a printed circuit board.

公开(公告)号：US07787254B2

公开(公告)日：2010-08-31

申请号：US11715205

申请日：2007-03-07

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H05K1/00

CPC classification number: H05K1/189 ,  H01L23/473 ,  H01L23/5387 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K3/0061 ,  H05K3/0064 ,  H05K2201/056 ,  H05K2201/064 ,  H05K2201/09445 ,  H05K2201/2018 ,  H01L2924/00

Abstract: A multichip module comprises: a first rigid member defining one outer wall of a chamber; a second rigid member defining the opposite wall of the chamber; a sealable interface joining the first and second rigid members at their peripheries, whereby a hollow chamber is formed; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit affixed to at least one of the first and second rigid members; electrical contacts at least partially extending outward through the sealable interface; and, a fluid inlet and a fluid outlet configured to permit fluid to flow through the chamber whereby heat generated by the integrated circuit chips may be removed from the module.

Abstract translation: 多芯片模块包括：限定室的一个外壁的第一刚性构件; 限定所述腔室的相对壁的第二刚性构件; 可密封的界面，在其周边处连接第一和第二刚性构件，由此形成中空室; 具有设置在其上的多个集成电路芯片的柔性电路，所述柔性电路固定到所述第一和第二刚性构件中的至少一个; 至少部分地通过可密封界面向外延伸的电触点; 以及流体入口和流体出口，其构造成允许流体流过所述室，由此可以从模块移除由集成电路芯片产生的热量。