PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

    公开(公告)号:US20220301825A1

    公开(公告)日:2022-09-22

    申请号:US17834948

    申请日:2022-06-08

    Abstract: A disclosed plasma processing method includes generating plasma in a chamber of a plasma processing apparatus by supplying radio frequency power from a radio frequency power source in a first period. The plasma processing method further includes stopping supply of the radio frequency power from the radio frequency power source in a second period following the first period. The plasma processing method further includes applying a negative direct-current voltage from a bias power source to a substrate support in a third period following the second period. In the third period, the radio frequency power is not supplied. In the third period, the negative direct-current voltage is set to generate ions in a chamber by secondary electrons that are emitted by causing ions in the chamber to collide with a substrate.

    PART TRANSPORTING DEVICE AND PROCESSING SYSTEM

    公开(公告)号:US20210268670A1

    公开(公告)日:2021-09-02

    申请号:US17186857

    申请日:2021-02-26

    Abstract: A part transporting device for transporting a consumable part includes a part housing, a container, a robot arm, and a moving mechanism. The part housing accommodates an unused consumable part and a used consumable part. The container has an opening to be connected to a processing device and a gate valve for opening or closing the opening, the container being configured to accommodate the part housing. The robot arm is provided in the container and has at least one end effector at a tip end thereof, the robot arm transferring the used consumable part from the processing device through the opening to accommodate the used consumable part in the part housing and transferring the unused consumable part from the part housing to load the unused consumable part into the processing device through the opening. The moving mechanism has a power source and is configured to move the part transporting device.

    SUBSTRATE PROCESSING METHOD
    14.
    发明申请

    公开(公告)号:US20200373166A1

    公开(公告)日:2020-11-26

    申请号:US16881073

    申请日:2020-05-22

    Abstract: A substrate processing method includes a first expanding step, a first gas supplying step, a first plasma processing step, and a first power stopping step. The first expanding step increases the volume of a gas diffusion chamber. The first gas supplying step supplies a first gas into the gas diffusion chamber. The first plasma processing step supplies radio-frequency power from a radio-frequency power supply to generate plasma in a processing chamber accommodating a substrate and reduces the volume of the gas diffusion chamber. The first power stopping step stops the supply of the radio-frequency power after the first plasma processing step.

    PART TRANSPORTING DEVICE AND PROCESSING SYSTEM

    公开(公告)号:US20250108525A1

    公开(公告)日:2025-04-03

    申请号:US18979706

    申请日:2024-12-13

    Abstract: A part transporting device for transporting a consumable part includes a part housing, a container, a robot arm, and a moving mechanism. The part housing accommodates an unused consumable part and a used consumable part. The container has an opening to be connected to a processing device and a gate valve for opening or closing the opening, the container being configured to accommodate the part housing. The robot arm is provided in the container and has at least one end effector at a tip end thereof, the robot arm transferring the used consumable part from the processing device through the opening to accommodate the used consumable part in the part housing and transferring the unused consumable part from the part housing to load the unused consumable part into the processing device through the opening. The moving mechanism has a power source and is configured to move the part transporting device.

    PARTICLE MONITORING SYSTEM, PARTICLE MONITORING METHOD, AND MONITORING DEVICE

    公开(公告)号:US20240068921A1

    公开(公告)日:2024-02-29

    申请号:US18505066

    申请日:2023-11-08

    CPC classification number: G01N15/0227 G01N15/0211 G01N2015/1087

    Abstract: A particle monitoring system includes a light emitting device for irradiating an inside of a plasma processing apparatus with light, and a monitoring device to be placed on a stage in the plasma processing apparatus. The monitoring device includes a base substrate, a plurality of imaging devices, and a control device. The base substrate has a plate shape. The plurality of imaging devices have optical axes facing upward on the base substrate, and are disposed apart from each other to capture images including scattered light from the particle irradiated with the light. The control device discriminates the particle in the images captured by the plurality of imaging devices.

    SUBSTRATE SUPPORT STAGE, PLASMA PROCESSING SYSTEM, AND METHOD OF MOUNTING EDGE RING

    公开(公告)号:US20210319988A1

    公开(公告)日:2021-10-14

    申请号:US17228222

    申请日:2021-04-12

    Abstract: A substrate support stage includes a substrate mounting surface on which a substrate is mounted and a ring mount on which an edge ring is mounted. The edge ring is disposed so as to surround the substrate mounted on the substrate mounting surface. The ring mount is provided with a plurality of gas ejection ports configured to eject a gas toward a lower surface side of the edge ring to levitate the edge ring while the edge ring is being mounted on the ring mount, thereby allowing the gas to flow out from a gap between inner and outer peripheries of the lower surface side of the edge ring and the ring mount.

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