公开(公告)号：US20250119112A1

公开(公告)日：2025-04-10

申请号：US18984189

申请日：2024-12-17

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hakhamanesh MANSOORZARE ,  Ting-Ta YEN ,  Jeronimo SEGOVIA-FERNANDEZ ,  Bichoy BAHR

IPC: H03H9/02 ,  H03H3/007

Abstract: A method comprises: forming a die including a cavity; coupling an anchor to the die; coupling a first resonator to a side of the anchor, in which the first resonator is suspended over the cavity and is operable to bend towards or away from a bottom of the cavity; and coupling a second resonator to the side of the anchor, in which the second resonator is suspended over the cavity, at least a part of the first resonator is laterally between the side of the anchor and a part of the second resonator, and the first resonator is operable to bend in an opposite direction from the second resonator.

公开(公告)号：US20230246630A1

公开(公告)日：2023-08-03

申请号：US17589465

申请日：2022-01-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Keegan Shaun MARTIN ,  Ricky A. JACKSON ,  Ting-Ta YEN ,  Huiyao CHEN

IPC: H03H9/17 ,  H01L41/047

CPC classification number: H03H9/17 ,  H01L41/047 ,  H03H9/131

Abstract: In some examples, a device includes a substrate, an oxide layer, and a resonator structure. The substrate is configured in a released-resonator architecture. The substrate has a first surface that is a roughened first surface and a second surface opposite to the first surface. The second surface exposed to a cavity of the released-resonator architecture.

公开(公告)号：US20200212881A1

公开(公告)日：2020-07-02

申请号：US16235382

申请日：2018-12-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Bichoy BAHR ,  Ting-Ta YEN

IPC: H03H9/24 ,  H03B5/30 ,  H03H9/02 ,  H03H9/10 ,  H01L23/00

Abstract: An apparatus includes a microelectromechanical system (MEMS) die having a first surface and an opposing second surface. The MEMS die includes a surface-mounted resonator on the first surface and includes a first inductor. The apparatus also includes first and second dies. The first die has a third surface and an opposing fourth surface. The first die is coupled to the MEMS die such that the third surface of the first die faces the first surface of the MEMS die. The first and second surfaces are spaced apart. The first die includes an oscillator circuit and a second inductor. The oscillator circuit is coupled to the second inductor. The second inductor is inductively coupled to the first inductor. The second die is electrically coupled to the first die.

公开(公告)号：US20200076366A1

公开(公告)日：2020-03-05

申请号：US16114708

申请日：2018-08-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Bichoy BAHR ,  Baher HAROUN ,  Ting-Ta YEN ,  Ali KIAEI

IPC: H03B5/32 ,  H03H9/17 ,  H01L41/047 ,  H01L41/08

Abstract: A system includes a tunable bulk acoustic wave (BAW) resonator device and a direct-current (DC) tuning controller coupled to the tunable BAW resonator device. The system also includes an oscillator circuit coupled to the tunable BAW resonator device. The DC tuning controller selectively adjusts a DC tuning signal applied to the tunable BAW resonator device to adjust a signal frequency generated by the oscillator circuit.

公开(公告)号：US20240391758A1

公开(公告)日：2024-11-28

申请号：US18794909

申请日：2024-08-05

Applicant: Texas Instruments Incorporated

Inventor： Ting-Ta YEN ,  Jeronimo SEGOVIA-FERNANDEZ ,  Ricky Alan JACKSON ,  Benjamin COOK

IPC: B81B7/00

Abstract: In one example, a method comprises etching a vertical spring in a substrate, the vertical spring encompassing a device formed on a front side of the substrate. The method further comprises bonding a cap to the front side of the substrate, the cap disposed over the device and the vertical spring.

公开(公告)号：US20230170877A1

公开(公告)日：2023-06-01

申请号：US17537776

申请日：2021-11-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jeronimo SEGOVIA-FERNANDEZ ,  Bichoy BAHR ,  Ting-Ta YEN ,  Michael Henderson PERROTT ,  Zachary SCHAFFER

IPC: H03H9/17 ,  H03H9/13 ,  H03H9/02

CPC classification number: H03H9/175 ,  H03H9/131 ,  H03H9/02015

Abstract: A tunable bulk acoustic wave (BAW) resonator includes: a first electrode adapted to be coupled to an oscillator circuit; a second electrode adapted to be coupled to the oscillator circuit; and a piezoelectric layer between the first electrode and the second electrode; and a Bragg mirror. The Bragg mirror has: a metal layer; and a dielectric layer between the metal layer and either of the first electrode or the second electrode. The tunable BAW resonator also includes: a radio-frequency (RF) signal source having a first end and a second end, the first end coupled to the first electrode, and the second end coupled to the second electrode; and an amplifier circuit between either the first electrode or the second electrode and the Bragg mirror metal layer.

公开(公告)号：US20230100911A1

公开(公告)日：2023-03-30

申请号：US17488586

申请日：2021-09-29

Applicant: Texas Instruments Incorporated

Inventor： Peter SMEYS ,  Ting-Ta YEN

IPC: H01L21/78 ,  B81B7/00 ,  B81C3/00 ,  H01L23/00 ,  H01L23/544

Abstract: An encapsulation chip manufacturing method includes forming first and second dicing grooves in a surface of a cap wafer and aligning the cap wafer and a device substrate such that the surface of the cap wafer faces a surface of the device substrate. The device substrate includes a device affixed to the surface and a bond pad on the surface and coupled to the device. The cap wafer is bonded to the device substrate and partially diced at the first and second dicing grooves such that the bond pad is exposed. Aligning the cap wafer and the device substrate includes aligning the first and second dicing grooves between the bond pad and a bonding area at which the cap wafer is bonded to the device substrate. A width of the first and second dicing grooves prevents cap wafer dust formed during the partial dicing from falling on the bond pad.

公开(公告)号：US20230063409A1

公开(公告)日：2023-03-02

申请号：US17463406

申请日：2021-08-31

Applicant: Texas Instruments Incorporated

Inventor： Michael Henderson PERROTT ,  Ting-Ta YEN ,  Bichoy BAHR ,  Baher S. HAROUN

IPC: H03B5/32 ,  H03B5/04 ,  H03L7/099 ,  H03L7/093

Abstract: A temperature compensated oscillator circuit includes a first oscillator, a second oscillator, a first divider, a second divider, a frequency ratio circuit, and a temperature compensation circuit. The first divider is coupled to the first oscillator, and is configured to divide a frequency of a first oscillator signal generated by the first oscillator. The second divider is coupled to the second oscillator, and is configured to divide a frequency of a second oscillator signal generated by the second oscillator. The frequency ratio circuit is coupled to the first divider and the second divider, and is configured to determine a frequency ratio of an output of the first divider to an output of the second divider. The temperature compensation circuit is coupled to the frequency ratio circuit and the first oscillator, and is configured to generate a compensated frequency based on the frequency ratio and the first oscillator signal.

公开(公告)号：US20220123715A1

公开(公告)日：2022-04-21

申请号：US17345644

申请日：2021-06-11

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Keegan Shaun MARTIN ,  Ting-Ta YEN

IPC: H03H9/08 ,  H03H3/04 ,  H03H9/02 ,  H03H9/17

Abstract: An acoustic-wave device includes a first electrode located over a substrate. A piezoelectric film is located over the first electrode and at least partially overlaps the first electrode. A second electrode is located over the piezoelectric film and at least partially overlaps the first electrode and the piezoelectric film. A temperature sensor is located in a same layer level as the first or second electrode. A heater may also be located in a same layer level as the first electrode. A closed-loop system may operate using the temperature sensor and the heater to maintain an operating temperature that provides highly stable operation.