公开(公告)号：US20240006742A1

公开(公告)日：2024-01-04

申请号：US17854197

申请日：2022-06-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yiqi TANG ,  Rajen MURUGAN

IPC: H01Q1/22 ,  H01Q1/42 ,  H01Q9/04

CPC classification number: H01Q1/2283 ,  H01Q1/422 ,  H01Q9/0407

Abstract: One example includes an antenna-on-package system that includes a multi-layer antenna structure. The antenna structure includes a first conductive layer having a patch antenna and a transmission line. The transmission line extends from a feed-side edge of the patch antenna to terminate in a launch structure. The antenna structure also includes a second conductive layer having a ground reflector spaced apart from the first conductive layer by a layer of dielectric material. An integrated circuit (IC) die has a signal terminal on surface of the IC die, and a conductive signal interconnect extends through the layer of dielectric material and is coupled between the signal terminal and the launch structure.

公开(公告)号：US20230197642A1

公开(公告)日：2023-06-22

申请号：US18172208

申请日：2023-02-21

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yiqi TANG ,  Li JIANG ,  Rajen Manicon MURUGAN

IPC: H01L23/58 ,  H01L23/00 ,  H01L23/552

CPC classification number: H01L23/585 ,  H01L23/564 ,  H01L23/562 ,  H01L23/552

Abstract: In examples, a semiconductor package comprises a ceramic substrate and first and second metal layers covered by the ceramic substrate. The first metal layer is configured to carry signals at least in a 20 GHz to 28 GHz frequency range. The package comprises a semiconductor die positioned above the first and second metal layers and coupled to the first metal layer. The package comprises a ground shield positioned in a horizontal plane between the semiconductor die and the first metal layer, the ground shield including an orifice above a portion of the first metal layer. The package includes a metal seal ring coupled to a top surface of the ceramic substrate, the metal seal ring having a segment that is vertically aligned with a segment of the ground shield. The segment of the ground shield is between the orifice of the ground shield and a horizontal center of the ground shield. The package comprises a metal lid coupled to a top surface of the metal seal ring.

公开(公告)号：US20230131441A1

公开(公告)日：2023-04-27

申请号：US17741560

申请日：2022-05-11

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yiqi TANG ,  Rajen Manicon MURUGAN

IPC: H01P3/00 ,  H01P3/06 ,  H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H05K3/40

Abstract: One example includes an antenna-on-package (AoP) system. The system includes a first transmission line patterned on a first metal layer. The first metal layer can be arranged to be coupled on a printed circuit board (PCB). The system also includes an antenna portion patterned on a second metal layer. The first and second metal layers can be separated by at least one dielectric layer. The system further includes a coaxial transition portion comprising a via configured to communicatively couple the first transmission line on the first metal layer to a second transmission line on the second metal layer. The second transmission line can be coupled to the antenna portion.

公开(公告)号：US20200258825A1

公开(公告)日：2020-08-13

申请号：US16787327

申请日：2020-02-11

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yiqi TANG ,  Liang WAN ,  William Todd HARRISON ,  Manu Joseph PRAKUZHY ,  Rajen Manicon MURUGAN

IPC: H01L23/495 ,  H01L23/00 ,  H02M3/158

Abstract: In some examples, a direct current (DC)-DC power converter package comprises a controller, a conductive member, and a first field effect transistor (FET) coupled to the controller and having a first source and a first drain, the first FET coupled to a first portion of the conductive member. The package also comprises a second FET coupled to the controller and having a second source and a second drain, the second FET coupled to a second portion of the conductive member, the first and second portions of the conductive member being non-overlapping in a horizontal plane. The first and second FETs are non-overlapping.